| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/27/2005 | US20050236060 Multilayer plated fuel line parts for automobile |
| 10/26/2005 | EP1266546B1 Treatment of circuit supports with impulse excitation |
| 10/26/2005 | CN1688753A Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 10/25/2005 | US6958113 Plating apparatus and plating method |
| 10/20/2005 | WO2005098095A1 Method for preparing multi-component alloy onto substrate by molten salt electrolysis |
| 10/20/2005 | US20050233653 Electronic connector terminal, a method for plating, and a terminal stack |
| 10/20/2005 | US20050233566 Lead frame and method of manufacturing the same |
| 10/20/2005 | US20050233564 Semiconductor device and method for fabricating the same |
| 10/20/2005 | US20050230263 Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
| 10/20/2005 | US20050230262 Electrochemical methods for the formation of protective features on metallized features |
| 10/20/2005 | US20050230260 Plating apparatus and method |
| 10/20/2005 | DE202005012618U1 Surface structure of an iron object comprises an iron object, a tin coating deposited on the surface of the object and a transparent protective layer for covering the surface of the tin coating |
| 10/19/2005 | EP1586679A1 Metal plating coating film having sliding function and article coated therewith |
| 10/19/2005 | CN1685086A Electropolishing and electroplating methods |
| 10/19/2005 | CN1685080A Substrate processing apparatus and substrate processing method |
| 10/19/2005 | CN1684243A Method for producing silicon insulator lining structure |
| 10/19/2005 | CN1684238A Lead frame and method of manufacturing the same |
| 10/18/2005 | US6956174 Tip structures |
| 10/18/2005 | US6955747 Cam driven paddle assembly for a plating cell |
| 10/13/2005 | WO2005095678A2 Electroplating system and method |
| 10/13/2005 | WO2005095677A1 Copper foil and its manufacturing method |
| 10/13/2005 | US20050227483 Planar metal electroprocessing |
| 10/13/2005 | US20050224359 Method and apparatus for electroplating |
| 10/13/2005 | US20050224358 Method for improved local planarity control during electropolishing |
| 10/13/2005 | US20050224340 System for electrochemically processing a workpiece |
| 10/13/2005 | CA2559152A1 Electroplating system and method |
| 10/12/2005 | CN1682352A Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 10/12/2005 | CN1681973A Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case |
| 10/12/2005 | CN1681971A Surface treated steel plate for battery cases and battery case using same |
| 10/12/2005 | CN1680631A Electrolysis treating method and apparatus |
| 10/12/2005 | CN1223029C Manufacture of sintered nickel positive electrode for alkali secondary battery |
| 10/12/2005 | CN1222641C Plating apparatus and method |
| 10/11/2005 | US6953986 Leadframes for high adhesion semiconductor devices and method of fabrication |
| 10/11/2005 | US6953522 Power supply for eletrolytic polishing/plating is unrestricted to improve uniformity in plane of electric current sent to metal surface |
| 10/06/2005 | US20050221621 Proximity head heating method and apparatus |
| 10/06/2005 | US20050218008 Method of manufacturing semiconductor device |
| 10/06/2005 | US20050218003 Electropolishing and/or electroplating apparatus and methods |
| 10/06/2005 | US20050218002 Electroplating using an apparatus with a selective shield/material flow assembly between the anode and the cathode and forming adjustable openings having adjustable sizes for selectively and controllably adjusting the amount of electric flux passing through the assembly and distribution on the workpiece |
| 10/05/2005 | EP1583138A1 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 10/05/2005 | EP1583135A1 Proximity head heating method and apparatus |
| 10/05/2005 | CN1679156A Tilted electrochemical plating cell with constant wafer immersion angle |
| 10/05/2005 | CN1678770A Electrochemical processing cell |
| 10/05/2005 | CN1678428A Brazing product and method of manufacturing a brazing product |
| 10/05/2005 | CN1222203C Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| 10/05/2005 | CN1222005C Method for producing gauze screen of non-electrode illuminating system |
| 10/05/2005 | CN1221685C Device for electroplating steel band metal coating |
| 09/29/2005 | WO2005091340A1 Single workpiece processing chamber |
| 09/29/2005 | US20050215079 Method for making thin-film semiconductors based on i-III-vi<sb>2</sb> compounds, for photovoltaic applications |
| 09/29/2005 | US20050211560 applying cothodic potentials to electroconductive layers formed on substrate having depression patterns, then dipping in a solution that is in contact with an anode, to form films; electrochemistry; electrodepostion |
| 09/29/2005 | US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/29/2005 | US20050211461 Flat cable conductor, method of making the same and flat cable using the same |
| 09/28/2005 | EP1579463A2 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 09/28/2005 | EP1579031A1 Peel strength enhancement of copper laminates 102426-201 |
| 09/28/2005 | EP1455981B1 Wire for high-speed electrical discharge machining |
| 09/28/2005 | EP0886894B1 Contact carriers for populating substrates with spring contacts |
| 09/28/2005 | CN1675411A Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 09/28/2005 | CN1674359A 压配合端子 Press-fit terminal |
| 09/28/2005 | CN1674231A Plating apparatus |
| 09/28/2005 | CN1673423A Metal wire on-line purger |
| 09/28/2005 | CN1673419A Electroplating apparatus for rectangle material and conveying method for rectangle material |
| 09/28/2005 | CN1220798C Pad designs and structures for universal material working equipment |
| 09/28/2005 | CN1220796C Process for plating Cr on inner cavity of cylinder sleeve |
| 09/27/2005 | US6949172 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
| 09/27/2005 | US6949171 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 09/22/2005 | US20050209727 Data output processor and method of manufacturing a semiconductor device |
| 09/22/2005 | US20050208774 Wet processing method and processing apparatus of substrate |
| 09/22/2005 | US20050208340 Magnetic thin film head |
| 09/22/2005 | US20050208314 Ornaments/decoration; toys; jewelry; buttons; improved plating adhesion and disengaging force stability; black color tone |
| 09/22/2005 | US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces |
| 09/22/2005 | US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/22/2005 | US20050205111 Method and apparatus for processing a microfeature workpiece with multiple fluid streams |
| 09/22/2005 | DE10251457B4 Gleitelement mit Verbundplattierungsfilm Slider with composite plating |
| 09/21/2005 | EP1577421A1 Substrate processing apparatus and method for processing substrate |
| 09/21/2005 | CN1671886A Multilayer plated fuel line parts for automobile |
| 09/21/2005 | CN1670262A Method for producing electroplating coat |
| 09/21/2005 | CN1670261A Aluminium sheet embossing roll |
| 09/21/2005 | CN1670259A Additive for plating bath |
| 09/20/2005 | US6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness |
| 09/20/2005 | CA2252923C Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| 09/15/2005 | US20050202346 when the sealing rubber is pressed the thin negative resist layer bends because it is made from a flexible resin and capillary phenomenon occurs ao sealing rubber is elastically deformed when entering the plating pattern; thus plating solution does not leak; electrode on semiconductor wafer |
| 09/15/2005 | US20050199503 Single workpiece processing chamber |
| 09/15/2005 | US20050199502 Current density; electrical resistance |
| 09/15/2005 | US20050199489 Electroless deposition apparatus |
| 09/15/2005 | DE102005005926A1 Kontaktstecker Contact plug |
| 09/14/2005 | EP1574600A1 Cup type plating equipment |
| 09/14/2005 | EP1573094A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 09/14/2005 | EP1165863B1 Method of manufacturing of copper tubes with their internal surface tin plated by electrolysis |
| 09/14/2005 | CN2725320Y Equipment for electrochemial electroplating |
| 09/14/2005 | CN1668785A Device and method for monitoring an electrolytic process |
| 09/14/2005 | CN1668784A Metal strip for the manufacture of components for electrical connectors |
| 09/14/2005 | CN1668783A Electromagnetic wave shield material and process for producing the same |
| 09/14/2005 | CN1667879A Electronic connector terminal, a method for plating, and a terminal stack |
| 09/14/2005 | CN1667802A Plating method |
| 09/13/2005 | US6942781 Continuously applying the foam strip onto a moving cathode immersed in an electroplating bath so that the supported strip travels through the bath in contact with the moving cathode while being electroplated |
| 09/13/2005 | US6942780 Method and apparatus for processing a substrate with minimal edge exclusion |
| 09/13/2005 | US6942767 Chemical reactor system |
| 09/09/2005 | WO2005083157A1 Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil |
| 09/09/2005 | WO2005081657A2 Laser ablation resistant copper foil |
| 09/09/2005 | WO2005064043A3 Improved metal strip electroplating |
| 09/08/2005 | US20050196959 Semiconductor device and manufacturing process therefor as well as plating solution |