Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 7 - Electroplating characterised by the article coated
Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2005
12/27/2005US6979391 continuous reel-to-reel electrolysis and electrolytic cell; insulating wall between electrodes; one- or two-sided metallization; conductive foils for printed circuits
12/27/2005US6979248 Conductive polishing article for electrochemical mechanical polishing
12/27/2005US6979161 Bolt structure for use with a magnesium alloy member for tightening magnesium alloy members with each other or with a heterogenenous material
12/22/2005WO2005122297A1 Metal foil with carrier foil, method for producing such metal foil with carrier foil, collector for nonaqueous electrolyte secondary battery using such metal foil with carrier foil
12/22/2005US20050280498 Conductive base material with resistance layer and circuit board material with resistance layer
12/22/2005US20050279637 Methods of forming target/backing plate assemblies comprising ruthenium, methods of electrolytically processing ruthenium, and container-shaped physical vapor deposition targets comprising ruthenium
12/22/2005DE102005024071A1 Rollelement und Verfahren zu dessen Herstellung Rolling element and process for its preparation
12/22/2005DE102004029894B3 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut Apparatus and method for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of a flat item to be treated
12/22/2005DE102004025671A1 Anordnung zur Verabreichung eines atembaren Gases, insbesondere CPAP-Geräteanordnung Arrangement for administering a breathable gas, in particular CPAP device arrangement
12/21/2005EP1608209A1 Conductive base material with resistance layer and circuit board material with resistance layer
12/21/2005EP1036222A4 Copper metallization of silicon wafers using insoluble anodes
12/21/2005CN1711149A Method of connecting module layers suitable for the production of microstructure components and a microstructure component
12/15/2005WO2005120139A1 Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil
12/15/2005WO2005042809A3 Support for workpiece to be electrolytically coated
12/15/2005US20050277293 Fabrication method of wafer level chip scale packages
12/15/2005US20050274622 Plating chemistry and method of single-step electroplating of copper on a barrier metal
12/15/2005US20050274621 Method of barrier layer surface treatment to enable direct copper plating on barrier metal
12/15/2005US20050274604 Plating apparatus
12/15/2005US20050274445 Method for manufacturing decoration of imitation metal
12/14/2005CN1707759A Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
12/13/2005US6974767 Chemical solution for electroplating a copper-zinc alloy thin film
12/13/2005US6974636 Protective coating for turbine engine component
12/13/2005US6974531 Current or voltage is changed during plating resulting in an average current increase from an initially small current to a final current corresponding to the desired current density for the total plated area.
12/13/2005US6974530 Method and system for controlling ion distribution during plating of a metal on a workpiece surface
12/08/2005WO2005116303A1 Method for electroplating bath chemistry control
12/08/2005WO2005116300A1 External palladium plating structure of semiconductor component and semiconductor device manufacturing method
12/08/2005WO2005115486A1 System for administering a respirable gas, especially a cpap apparatus system
12/08/2005US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same
12/08/2005US20050269212 Method of making rolling electrical contact to wafer front surface
12/08/2005DE10200445B4 Metallband für epitaktische Beschichtungen und Verfahren zu dessen Herstellung Metal strip for epitaxial coatings, and process for its preparation
12/07/2005EP1602750A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY
12/07/2005EP1602127A2 Plating apparatus
12/07/2005EP1601822A1 Method of electroplating a workpiece having high-aspect ratio holes
12/07/2005CN1705774A Integrated plating and planarization process and apparatus therefor
12/07/2005CN1705770A Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon
12/07/2005CN1230575C Continuous nickel plating process for stainless steel wire
12/06/2005US6972082 Method for the selectively electroplating a strip-shaped, metal support material
12/06/2005US6972081 Fabrication of embedded vertical spiral inductor for multichip module (MCM) package
12/01/2005WO2004057060A3 Multi-chemistry electrochemical processing system
12/01/2005US20050266304 Negative electrode for nonaqueous secondary battery and process of producing the same
12/01/2005US20050263273 Electroformed microchannel cooler and methods of making same
12/01/2005DE102004022297A1 Verfahren und System zum selektiven Beschichten oder Ätzen von Oberflächen A method and system for selectively coating or etching surfaces
11/2005
11/30/2005EP1601006A2 An apparatus and a method for processing a fluid meniscus
11/30/2005EP1488025B1 Conveyorized plating line and method for electrolytically metal plating a workpiece
11/30/2005EP1407062B1 Composite foil and its manufacturing process
11/30/2005CN1229526C Electrolytic processing method for wire and electrolytic processing device for wire
11/29/2005US6969672 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
11/29/2005US6969557 Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same
11/29/2005US6969456 Method of using vertically configured chamber used for multiple processes
11/29/2005US6968755 Lightweight bearing and wave gear drive
11/24/2005US20050260846 Substrate processing method, semiconductor device production method, and semiconductor device
11/24/2005US20050258046 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/24/2005US20050258044 Magnetic focus rings for improved copper plating
11/24/2005DE102004021260A1 System und Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren System and method for enhanced bath life in a Einzelbadplattierungsverfahren
11/23/2005EP1598449A2 Improved plating method
11/23/2005CN1701137A Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti
11/23/2005CN1701136A Low-force electrochemical mechanical processing method and apparatus
11/23/2005CN1228475C Galvanization apparatus and process of tube-type crystallizer
11/23/2005CN1228474C Metallic screen material having a strand or fibre structure, and method for manufacturing such a material
11/22/2005US6967166 Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
11/22/2005CA2115062C Acid bath for the galvanic deposition of copper, and the use of such a bath
11/17/2005WO2005108647A1 Porous metal foil with carrier foil and process for producing the same
11/17/2005WO2005107982A1 Tool holder with vibration damping means and a method for manufacturing the same
11/16/2005CN1697893A Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
11/16/2005CN1227394C Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system
11/15/2005US6964792 Using diffuser membrane in electrolytic cells
11/10/2005WO2005106989A1 Plated steel plate for battery container, battery container using the plated steel plate for battery container, and battery using the battery container
11/10/2005WO2005106081A1 Method and system for selectively coating or etching surfaces
11/10/2005WO2005105356A2 Electrochemical mechanical planarization process and apparatus
11/10/2005US20050250327 Copper plating of semiconductor devices using intermediate immersion step
11/10/2005US20050250324 Plating apparatus
11/10/2005US20050249967 Tin plating method
11/10/2005US20050249927 Copper foil for high-density ultra-fine printed wiring board
11/10/2005US20050247567 Method of plating
11/10/2005US20050247566 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece
11/10/2005DE10326337B4 Vorrichtung zum Entfernen von Dendriten an den Kanten eines Metall-Bandes An apparatus for removing dendrites at the edges of a metal band
11/09/2005EP1592825A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
11/08/2005US6962649 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
11/08/2005US6962441 Rotary member and production process
11/03/2005WO2005104268A1 Plated steel plate for cell vessel, cell vessel using the plated steel plate for cell vessel, cell using the cell vessel
11/03/2005WO2005104267A1 Plated steel sheet for battery container, battery container utilizing the plated steel sheet and battery utilizing the battery container
11/03/2005WO2005103340A1 Composite foil, method for producing same, current collector using such composite foil, electrode for nonaqueous electrolyte secondary battery, and nonaqueous electrolyte secondary battery
11/03/2005WO2005033377A3 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/03/2005US20050245084 Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)
11/03/2005US20050245083 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
11/03/2005US20050242443 A palladium layer and a gold layer are formed by an electrolytic plating on a solderd part having a nickel layer; thickness of the palladium layer is 0.007 to 0.1 mu m; thickness of the gold layer is 0.003 to 0.02 mu; the gold layer partially laps a palladium strike surface
11/03/2005US20050241955 Substrate processing apparatus and substrate processing method
11/03/2005US20050241950 Method for forming a coating on a wheel and the structure of the coating
11/03/2005US20050241947 System and method for an increased bath lifetime in a single-use plating regime
11/03/2005US20050241946 electrodeposition of copper or silver; for filling fine interconnect recesses such as trenches and via holes in semiconductor substrate with uniform coatings; control the movement of the conductive layer and the porous member relatively to each other without passing electric current
11/02/2005EP1590099A1 Process equipment wear surfaces of extended resistance and methods for their manufacture
11/02/2005EP0776385B1 High fatigue ductility electrodeposited copper foil
11/02/2005CN2737501Y Polising product for processing base material
11/02/2005CN1691416A Electronic part and surface treatment method of the same
11/02/2005CN1690255A Method for preparing neodymium-iron-boron magnetic powder coated with metal layer by electrochemical deposition
11/01/2005US6960370 Methods of forming medical devices
11/01/2005US6959757 Black layer coated heat exchanger
10/2005
10/27/2005WO2005100641A1 Method for imparting excellent resistance to hydrogen to article and article exhibiting excellent resistance to hydrogen
10/27/2005US20050239292 Device for etching semicnductors with a large surface area
10/27/2005US20050236268 Substrate processing apparatus
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