| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 02/09/2006 | WO2006013735A1 Composite copper foil and method for production thereof |
| 02/09/2006 | US20060029723 repairing a coated high pressure turbine blade, which has been exposed to engine operation, to restore coated airfoil contour dimensions of the blade, and improve upon the prior bond coat |
| 02/09/2006 | US20060027460 Metal interconnect features with a doping gradient |
| 02/09/2006 | DE10309401B4 Vorrichtung und Verfahren zu Beschichtung von Gegenständen An apparatus and process for coating objects |
| 02/09/2006 | DE102004033332A1 Einspannvorrichtung für Druckzylinder Jig for printing cylinders |
| 02/08/2006 | EP1624092A1 Chromium plated exhaust pipe |
| 02/08/2006 | CN1732291A Lead free bump and method of forming the same |
| 02/08/2006 | CN1240881C Method for electroplating strip of foam |
| 02/07/2006 | US6996425 Cellular phone housing |
| 02/07/2006 | US6995457 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board |
| 02/07/2006 | US6994919 Core sheet overcoated with aluminum alloy |
| 02/02/2006 | WO2006012112A2 Electrochemical plating cell with an auxiliary electrode in an isolated anolyte compartment |
| 02/02/2006 | WO2006011922A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 02/01/2006 | EP1620222A1 Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
| 02/01/2006 | CN1729315A Method for producing galvanically deposited antennae for RFID labels using an adhesive that is selectively applied |
| 02/01/2006 | CN1729312A Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 02/01/2006 | CN1728347A Apparatus and method for plating semiconductor wafers |
| 02/01/2006 | CN1239753C Nickel base alloy composite conductor roll and manufacturing method |
| 02/01/2006 | CN1239751C Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/31/2006 | US6992016 Chemical processing method, and method of manufacturing semiconductor device |
| 01/31/2006 | US6991717 Web processing method and apparatus |
| 01/31/2006 | US6991711 Cup type plating apparatus |
| 01/31/2006 | US6991710 Apparatus for manually and automatically processing microelectronic workpieces |
| 01/26/2006 | WO2005095678A3 Electroplating system and method |
| 01/26/2006 | WO2005018311A3 Fishhook |
| 01/26/2006 | DE102004032659A1 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung Apparatus and method for chemical or electrolytic treatment of material to be treated and to the use of the device |
| 01/25/2006 | EP1619275A2 Apparatus and method for plating semiconductor wafers |
| 01/25/2006 | EP1112125B1 Metallization structures for microelectronic applications and process for forming the structures |
| 01/25/2006 | CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer |
| 01/25/2006 | CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 01/25/2006 | CN1238891C Novel chip interconnect and packaging deposition methods and structures |
| 01/25/2006 | CN1238769C Mask forming and removing method, and semiconductor device, electric circuit, display module, color filter and emissive device manufactured by the same method |
| 01/25/2006 | CN1238571C Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 01/24/2006 | US6989328 Method of manufacturing semiconductor device having damascene interconnection |
| 01/24/2006 | US6989199 Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board |
| 01/24/2006 | US6989084 Semiconductor wafer plating cell assembly |
| 01/24/2006 | US6988932 Apparatus of sealing wafer backside for full-face processing |
| 01/24/2006 | US6988327 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/19/2006 | US20060012044 Plating method |
| 01/19/2006 | US20060011487 Submicron and nano size particle encapsulation by electrochemical process and apparatus |
| 01/19/2006 | US20060011485 Multi step electrodeposition process for reducing defects and minimizing film thickness |
| 01/19/2006 | DE102004030726A1 Process to etch manufacture printed circuit board by regulation of electrolytic cell voltage transverse to the direction of travel |
| 01/19/2006 | DE10148045B4 Reparaturverfahren für strukturierte und/oder glatte Stahloberflächen auf Endlosbändern oder Pressblechen Repair method for structured and / or smooth steel surfaces of endless belts or press plates |
| 01/18/2006 | EP1027722B1 Plating system for semiconductor materials |
| 01/18/2006 | CN2752276Y Nickeling device for radiator |
| 01/18/2006 | CN2751972Y Polishing product for processing base material |
| 01/18/2006 | CN1722374A Substrate proximity processing structures and methods for using and making the same |
| 01/18/2006 | CN1722372A Proximity head heating method and apparatus |
| 01/12/2006 | WO2006004298A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2006002969A2 Device and method for chemically and electrolytically treating work pieces |
| 01/12/2006 | WO2005059206A3 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/12/2006 | WO2005040459A3 Electroplating compositions and methods for electroplating |
| 01/12/2006 | US20060006071 Reducing defects; adjust bioas voltage, current; overcoating substrate with metal seed layer |
| 01/12/2006 | US20060006060 Method and apparatus for processing a substrate with minimal edge exclusion |
| 01/12/2006 | US20060005902 Method for production of thin metal-containing layers having low electrical resistance |
| 01/12/2006 | DE10347145B4 Verfahren zur Herstellung einer Verschleißschutzschicht A method for producing a wear-resistant layer |
| 01/11/2006 | CN1720355A Metal plating structure and method for production thereof |
| 01/11/2006 | CN1720354A Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
| 01/11/2006 | CN1720350A Peel strength enhancement of copper laminates |
| 01/11/2006 | CN1718868A Electrolytic film plating device |
| 01/10/2006 | US6984302 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors |
| 01/10/2006 | US6984301 Methods of forming capacitor constructions |
| 01/05/2006 | WO2006001594A1 Method for manufacturing black surface- treated copper foil for emi shield and copper foil the same and the composite material using it |
| 01/05/2006 | WO2005076680A3 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate |
| 01/05/2006 | US20060001132 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 01/05/2006 | US20060000708 Noble metal contacts for plating applications |
| 01/05/2006 | US20060000704 Solution treatment apparatus and solution treatment method |
| 01/04/2006 | EP1612855A2 Method and apparatus for plating semiconductor wafers |
| 01/04/2006 | EP1226365A4 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 01/04/2006 | CN1717153A Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 01/04/2006 | CN1715457A Surface coarsening method and surface coarsening liquid for copper foil |
| 01/04/2006 | CN1234919C Electroplating apparatus |
| 01/04/2006 | CN1234917C Continuous nickel plating apparatus for fine metal wire |
| 01/04/2006 | CN1234916C Method and device for electrolytic treatment of electrically insulating film materials and use of said method |
| 01/04/2006 | CN1234915C Copper foil coated with stable layer, coating method and laminate piece including insulation substrate and copper foil |
| 01/03/2006 | US6982863 Component formation via plating technology |
| 01/03/2006 | US6982011 Method for producing improved cold-rolled strip that is capable of being deep-drawn or ironed, and cold-rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 01/03/2006 | CA2320278C Plating apparatus and method |
| 01/03/2006 | CA2191339C Method and device for continuous uniform electrolytic metallising or etching |
| 12/29/2005 | WO2005123990A1 Device and method for electrolytically treating flat work pieces |
| 12/29/2005 | WO2005123989A1 Plating apparatus |
| 12/29/2005 | WO2005123988A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 12/29/2005 | WO2004094702A8 Multi-chemistry plating system |
| 12/29/2005 | US20050287388 Metal based resistance heating element and method for preparation therefor |
| 12/29/2005 | US20050284768 Method for coloring socket |
| 12/29/2005 | US20050284767 electroplating; movable electrodes; as anode moves over wafer, electric current is applied through meniscus between anode and wafer |
| 12/29/2005 | US20050284766 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 12/29/2005 | US20050284755 Substrate support element for an electrochemical plating cell |
| 12/29/2005 | US20050284754 Electric field reducing thrust plate |
| 12/29/2005 | US20050284751 Electrochemical plating cell with a counter electrode in an isolated anolyte compartment |
| 12/29/2005 | DE112004000245T5 Verbund-Kupferfolie, Verfahren zu deren Herstellung und Hochfrequenz-Übertragungsschaltung unter Verwendung einer Verbundkupferfolie Composite copper foil, to processes for their preparation and high-frequency transmission circuit using a composite copper foil |
| 12/29/2005 | CA2568579A1 Plating apparatus |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | CN1714412A Method for increasing the copper to superconductor ratio in a superconductor wire |
| 12/28/2005 | CN1714177A Plating uniformity control by contact ring shaping |
| 12/28/2005 | CN1233880C Cathode chuck of electroplating tester |
| 12/27/2005 | US6979645 Method of producing a semiconductor device having copper wiring |
| 12/27/2005 | US6979515 Surface-treated steel plate for battery case and battery case |
| 12/27/2005 | US6979393 Method for plating copper conductors and devices formed |