Patents for C23F 1 - Etching metallic material by chemical means (16,062)
06/2006
06/22/2006US20060131276 Uniformity in batch spray processing using independent cassette rotation
06/22/2006US20060131275 Selective slurry for chemical mechanical polishing
06/22/2006US20060131274 Method for producing an electronic component
06/22/2006US20060131273 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
06/22/2006US20060131272 Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles
06/22/2006US20060131271 Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate
06/22/2006US20060131270 Method and system for making a nano-plate for imprint lithography
06/22/2006US20060131269 Object-moving method, object-moving apparatus and production process using the method
06/22/2006US20060131268 Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same
06/22/2006US20060131267 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel
06/22/2006US20060131266 Large area electronic device with high and low resolution patterned film features
06/22/2006US20060131265 Method of forming branched structures
06/22/2006US20060130972 Dry etching method and apparatus for performing dry etching
06/22/2006US20060130971 Apparatus for generating plasma by RF power
06/22/2006US20060130969 Partial edge bead removal to allow improved grounding during e-beam mask writing
06/22/2006US20060130967 Wafer machining apparatus
06/22/2006US20060130322 Semiconductor inspection device and method for manufacturing contact probe
06/21/2006EP1672092A1 Method of bonding a first aluminium comprising mass to a second aluminium comprising mass and target/backing plate structure.
06/21/2006EP0839217B1 A plasma enhanced chemical processing reactor and method
06/21/2006CN1260784C Two-stage step structured wet chemical corrosion method for silicon semiconductor device
06/20/2006US7063800 Methods of cleaning copper surfaces in the manufacture of printed circuit boards
06/20/2006US7063796 Micromechanical component and method for producing the same
06/15/2006US20060129161 Undercutting exposed bone surface beneath a mask by laser etching to provide interconnected recesses of varying depth; providing greater fractal area below the bone surface for cell growth and stabilization of the prosthesis; accurate computercontrol; sharp edges; roughness; surgery; grafting
06/15/2006US20060128159 Method of removing etch residues
06/15/2006US20060127690 Metal photo-etching product and production method therefor
06/15/2006US20060125031 Microelectromechanical device having a common ground plane layer and a set of contact teeth and method for making aspects thereof
06/15/2006US20060124597 Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
06/15/2006US20060124595 Method of polishing film to be polished
06/15/2006US20060124594 Chemical mechanical polishing (CMP) slurries and CMP methods using and making the same
06/15/2006US20060124593 Colloidal silica based chemical mechanical polishing slurry
06/15/2006US20060124592 Chemical mechanical polish slurry
06/15/2006US20060124591 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors
06/15/2006US20060124589 Apparatus and method for removing photoresist in a semiconductor device
06/15/2006US20060124588 System and method for reducing metal oxides with hydrogen radicals
06/15/2006US20060124587 Method for fabricating semiconductor device using ArF photolithography capable of protecting tapered profile of hard mask
06/15/2006US20060124586 Rinse liquid for lithography and method for forming resist pattern using same
06/15/2006US20060124585 Method for manufacturing magnetic recording medium
06/15/2006US20060124582 Method for fabricating bottom electrodes of stacked capacitor memory cells and method for cleaning and drying a semiconductor wafer
06/15/2006US20060124581 Mask blank for charged particle beam exposure, method of forming mask blank and mask for charged particle beam exposure
06/15/2006US20060124245 High selective ratio and high and uniform plasma processing method and system
06/15/2006US20060124244 Plasma processor and plasma processing method
06/15/2006US20060124243 Disturbance-free, recipe-controlled plasma processing system and method
06/15/2006US20060124059 Inductively coupled plasma generation system with a parallel antenna array having evenly distributed power input and ground nodes and improved field distribution
06/14/2006EP1670051A1 Apparatus and method for cvd copper removal at low temperature
06/14/2006EP1669158A1 Process for laser manufacturing a hole emerging in an inner space of a workpiece with chemical treatment for cleaning the inner space
06/14/2006EP1668967A2 Improved method for micro-roughening treatment of copper and mixed-metal circuitry
06/14/2006EP1667850A2 Methods for cleaning a set of structures comprising yttrium oxide in a plasma processing system
06/14/2006EP1667778A2 Single phase fluid imprint lithography method
06/14/2006DE102005015758A1 Verfahren und Vorrichtung zum Ätzen von in einer Ätzlösung aufgenommenen Substraten Method and apparatus for etching in an etching solution taken substrates
06/14/2006DE102004059123A1 Substrate e.g. glass substrate, thinning device, has determining unit finding thinning period value based on sensor unit`s output value, thickness target value and auxiliary value specified based on difference in output and target values
06/14/2006CN1788070A Polishing fluid for metal and polishing Method
06/14/2006CN1787182A Method for reducing sediment of reacting chamber
06/14/2006CN1785674A Method for manufacturing droplet ejection head, droplet ejection head, and droplet ejection apparatus
06/13/2006US7060587 Method for forming macropores in a layer and products obtained thereof
06/13/2006US7060197 Micromechanical mass flow sensor and method for the production thereof
06/13/2006US7060196 supplying charge particle beams; using oxidizer; removal of copper
06/13/2006US7060194 Dry etching method for magnetic material
06/13/2006US7059267 Use of pulsed grounding source in a plasma reactor
06/08/2006WO2005124827A3 Improved method and apparatus for the etching of microstructures
06/08/2006US20060121737 Method of manufacturing a semiconductor device and method of manufacturing a thin layer using the same
06/08/2006US20060121210 Plasma processing equipment and method of operating the same
06/08/2006US20060119366 System for inspection of a disk-shaped object
06/08/2006US20060118759 Etching pastes for titanium oxide surfaces
06/08/2006US20060118524 Cerium oxide abrasive and method of polishing substrates
06/08/2006US20060118523 Planarization with reduced dishing
06/08/2006US20060118522 Etching composition and use thereof with feedback control of HF in BEOL clean
06/08/2006US20060118520 Plasma etching method
06/08/2006US20060118519 Dielectric etch method with high source and low bombardment plasma providing high etch rates
06/08/2006US20060118517 Etching method
06/08/2006US20060118514 Applications and fabrication techniques for large scale wire grid polarizers
06/08/2006US20060118242 Atmospheric pressure plasma system
06/08/2006US20060118241 Plasma processing apparatus
06/08/2006US20060118240 Methods and apparatus for downstream dissociation of gases
06/08/2006US20060118239 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
06/08/2006US20060118044 Capacitive coupling plasma processing apparatus
06/08/2006US20060117691 Door skin, a method of etching a plate for forming a wood grain pattern in the door skin, and an etched plate formed therefrom
06/07/2006EP1667503A1 Metal pattern and process for producing the same
06/07/2006EP1666136A1 Microreactor including magnetic barrier
06/07/2006EP1664384A2 Silicon blades for surgical and non-surgical use
06/07/2006EP1664382A1 Adhesion promotion in printed circuit boards
06/07/2006CN2786148Y Metal tag etching machine
06/07/2006CN1784509A Method for removing layers from a component
06/07/2006CN1782133A Sulfur hexafluoride remote plasma source clean
06/07/2006CN1782132A Method and device for controlling copper concentration in decayed copper liquid
06/07/2006CN1782131A Spraying type aluminium alloy chemical etching liquid
06/07/2006CN1782130A Method for removing and re-coating diamond-like carbon film and its finished product
06/06/2006US7056648 Method for isotropic etching of copper
06/06/2006US7056624 Single side engraving type which comprises a shifter part and a non- shifter part on a substrate; shading layer pattern formed with a shading film which covers continuously including the sidewall part of the recess
06/06/2006US7056448 Method for forming circuit pattern
06/06/2006US7056416 Atmospheric pressure plasma processing method and apparatus
06/01/2006WO2006058034A2 Molecular self-assembly in substrate processing
06/01/2006WO2006014785A3 Interactive wagering contest method and system
06/01/2006WO2005079476A3 Method of dry plasma etching semiconductor materials
06/01/2006US20060113284 Manufacturing method of substrate
06/01/2006US20060113281 Method of precise wafer etching
06/01/2006US20060113280 Partial edge bead removal to allow improved grounding during e-beam mask writing
06/01/2006US20060113279 Non-photolithographic method for forming a wire grid polarizer for optical and infrared wavelengths
06/01/2006US20060113277 Micro-fluid ejection head containing reentrant fluid feed slots
06/01/2006US20060113040 Stage device, exposure apparatus using the unit, and device manufacturing method
06/01/2006US20060113039 Substrate treatment method and substrate treatment apparatus