Patents for C23F 1 - Etching metallic material by chemical means (16,062)
02/2006
02/02/2006US20060024478 Composite, ordered material having sharp surface features
02/02/2006US20060023371 High sensitivity spin valve designs with ion beam treatment
02/02/2006US20060023353 Method and apparatus for providing a write head having well-defined, precise write head pole tips
02/02/2006US20060021971 Method for plasma treatment of a carbon layer
02/02/2006US20060021968 Time continuous ion-ion plasma
02/02/2006US20060021967 fabricating an imprint stamp using controlled thin film deposition, lithographic patterning, and etching to form an imprint stamp that includes an application specific imprint pattern.
02/02/2006US20060021966 Production process and production system of magnetic recording medium
02/02/2006US20060021962 Method of fabricating a sharp protrusion
02/02/2006US20060021961 Micromechanical component and method for manufacturing such a component
02/02/2006US20060021705 Substrate mounting apparatus and control method of substrate temperature
02/02/2006US20060021704 Method and apparatus for etching Si
02/02/2006US20060021703 Dual gas faceplate for a showerhead in a semiconductor wafer processing system
02/02/2006US20060021702 Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor
02/02/2006US20060021701 Dual-chamber plasma processing apparatus
02/02/2006US20060021700 Plasma processing apparatus and method
02/02/2006DE10326767B4 Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben Of the same method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys, as well as an apparatus for performing
02/01/2006EP1622192A1 Substrate transfer device of thin-film forming apparatus
02/01/2006EP1620257A2 A method of adding mass to mems structures
02/01/2006CN1239747C Surface treatment agent for copper and copper alloy
02/01/2006CN1239746C Technology of selective lead removed for running water pipe fitting made of copper alloy and lead removal liquid
02/01/2006CN1239320C Composite comprising aluminium alloy and resin and method for manufacturing the same
01/2006
01/31/2006US6992016 Chemical processing method, and method of manufacturing semiconductor device
01/31/2006US6991740 Method for reducing removal forces for CMP pads
01/26/2006US20060019178 Method of repairing phase shift mask
01/26/2006US20060016783 Process for titanium nitride removal
01/26/2006US20060016782 Methods and compositions for dicing through lithographic micro-machining
01/26/2006US20060016781 Dry etching method
01/26/2006US20060016561 Semiconductor etching apparatus
01/26/2006US20060016560 Plasma processing apparatus
01/26/2006US20060016559 Plasma processing apparatus
01/26/2006US20060016558 Endpoint detecting device in semiconductor manufacturing system
01/26/2006US20060016459 High rate etching using high pressure F2 plasma with argon dilution
01/26/2006DE10232220B4 Vorrichtung und Verfahren zur direkten Rückgewinnung der Chemikalien, die sich beim Betrieb von Anlagen der Galvano- Oberflächentechnik in Absauganlagen ablagern Apparatus and method for direct recovery of the chemicals that are deposited in the operation of facilities electroplating surface technology in extraction systems
01/25/2006EP1619268A2 Process for titanium nitride removal
01/25/2006EP1442344B1 Method and device for treating objects by means of a liquid
01/25/2006CN1726302A Method of cleaning a coated process chamber component
01/25/2006CN1725442A Process for titanium nitride removal
01/25/2006CN1725306A Method of dry etching, method of manufacturing magnetic recording medium, and magnetic recording medium
01/25/2006CN1724706A Method for enhancing fluorine utilization
01/25/2006CN1238755C Method of forming metal wire of LCD device
01/25/2006CN1238560C Solution used for platinum chemical mechanical polishing
01/24/2006US6989683 of wafers; circuit with a variable capacitor that sets the initial phase angle of the measurement circuit to about zero and alters the phase angle; improved detection under noisy conditions
01/24/2006US6988342 Door skin, a method of etching a plate for forming a wood grain pattern in the door skin, and an etched plate formed therefrom
01/19/2006WO2006007355A1 Method for providing uniform removal of organic material
01/19/2006US20060011585 Method for controlling ph during planarization and cleaning of microelectronic substrates
01/19/2006US20060011583 Materials and gas chemistries for processing systems
01/19/2006US20060011582 Fast isotropic etching system and process for large, non-circular substrates
01/19/2006US20060011580 Plasma processing method and post-processing method
01/19/2006US20060011576 Method and apparatus for stone engraving
01/19/2006US20060011299 Ultra high speed uniform plasma processing system
01/19/2006US20060011298 Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates
01/19/2006US20060011297 Semiconductor manufacturing apparatus
01/19/2006US20060011296 Substrate processing apparatus, substrate processing method, and computer program
01/19/2006DE102004030924A1 Elektrolytisch regenerierbare Ätzlösung Electrolytically reclaimable etching solution
01/18/2006EP1616189A2 Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system
01/18/2006EP1229970A4 A golf club head with a face composed of a forged material
01/18/2006CN1722361A Substrate processing device and method, and pattern forming method
01/18/2006CN1721574A Aqueous solution composition for treating metal surface
01/18/2006CN1721493A Multiple process polishing solution for chemical mechanical planarization
01/18/2006CN1237207C Silver alloy etching solution
01/18/2006CN1236845C Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof
01/17/2006US6986609 optical module, in which grooves of different depths are included so as to prevent a convex corner phenomenon without compensation patterns, and a substrate is passed through the grooves or etched to a predetermined depth to form a stoppper hole
01/17/2006US6986202 Method of fabricating a micro-electromechanical fluid ejection device
01/12/2006US20060009039 Etching method, etching apparatus, and method for manufacturing semiconductor device
01/12/2006US20060009004 Method of forming trench isolation within a semiconductor substrate
01/12/2006US20060005930 Substrate supporting structure for semiconductor processing, and plasma processing device
01/12/2006US20060005929 Plasma processing device and plasma generating method
01/12/2006US20060005928 Apparatus and methods for improving the stability of RF power delivery to a plasma load
01/12/2006US20060005927 Plasma processing apparatus, control method thereof and program for performing same
01/12/2006US20060005926 Gas distributor and apparatus using the same
01/12/2006US20060005856 Reduction of reactive gas attack on substrate heater
01/12/2006US20060005771 Apparatus and method of shaping profiles of large-area PECVD electrodes
01/11/2006EP1614766A1 Method for forming porous thin film
01/11/2006EP1613792A2 Methods and apparatus for atomic layer deposition
01/11/2006CN1720352A Aqueous composition for the chemical removal of metallic surfacing present on turbine blades, and its use
01/11/2006CN1718869A Surface treated aluminum material and mfg.method thereof
01/11/2006CN1718858A High petential magnesium alloy sacrificial anode material and its manufacturing method
01/10/2006US6984588 Compositions for oxide CMP
01/10/2006US6983718 Electron beam physical vapor deposition apparatus
01/05/2006WO2006002153A1 Probes for use in scanning probe microscopes and methods of fabricating such probes
01/05/2006WO2006000364A1 Electrolytically recoverable etching solution
01/05/2006US20060003593 Method and apparatus for stripping photo-resist
01/05/2006US20060003592 System and method for processing a substrate using supercritical carbon dioxide processing
01/05/2006US20060000807 Energy enhanced surface planarization
01/05/2006US20060000806 Substrate carrier for surface planarization
01/05/2006US20060000805 Method and apparatus for stable plasma processing
01/05/2006US20060000803 Plasma processing method and apparatus
01/05/2006US20060000800 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units
01/05/2006US20060000553 Minimizing particle contamination of semiconductor wafers during pressure evacuation by selective orientation and shielding
01/05/2006US20060000552 Plasma processing apparatus and cleaning method thereof
01/05/2006US20060000551 Methods and apparatus for optimal temperature control in a plasma processing system
01/04/2006EP1611992A1 Method of forming a molding surface for a composite shingle mold
01/04/2006CN1717789A Plasma processing apparatus and method, and electrode plate for plasma processing apparatus
01/04/2006CN1716009A Etching composition for laminated film including reflective electrode and method for forming laminated wiring structure
12/2005
12/29/2005WO2005124827A2 Improved method and apparatus for the etching of microstructures
12/29/2005US20050287815 Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
12/29/2005US20050287389 Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material
12/29/2005US20050284844 Cleaning composition for semiconductor components and process for manufacturing semiconductor device
12/29/2005US20050284842 Method of dry etching, method of manufacturing magnetic recording medium, and magnetic recording medium
12/29/2005US20050284577 Glass support system, method of supporting glass, and etching equipment using the same