Patents for C23F 1 - Etching metallic material by chemical means (16,062)
10/2005
10/12/2005CN1682341A Method and apparatus for an improved baffle plate in a plasma processing system
10/12/2005CN1682338A Method and system for analyzing data from a plasma process
10/12/2005CN1681968A Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material
10/12/2005CN1681091A Controllable corrosion for preparing nanometer ultra-thin covariant substrates
10/12/2005CN1681079A In-situ dry clean chamber for front end of line fabrication
10/12/2005CN1681076A Process and apparatus for forming discrete microcavities in a filament wire using a polymer etching mask
10/12/2005CN1223247C Method for producing etched circuit
10/11/2005US6953751 Micro device and process for producing it
10/11/2005US6953533 Process for removing chromide coatings from metal substrates, and related compositions
10/11/2005US6953531 Methods of etching silicon-oxide-containing materials
10/11/2005US6953041 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
10/06/2005WO2005093116A2 Replacing chamber components in a vacuum environment
10/06/2005WO2005091974A2 Methods for the optimization of substrate etching in a plasma processing system
10/06/2005WO2005033797A3 Single phase fluid imprint lithography method
10/06/2005US20050221552 Substrate support for in-situ dry clean chamber for front end of line fabrication
10/06/2005US20050218507 Lid assembly for front end of line fabrication
10/06/2005US20050218117 Chemically assisted surface finishing process
10/06/2005US20050218110 Method for manufacturing wiring substrate and method for manufacturing electronic device
10/06/2005US20050217799 Wafer heater assembly
10/06/2005US20050217798 Plasma processing apparatus
10/06/2005US20050217797 Methods and array for creating a mathematical model of a plasma processing system
10/06/2005US20050217796 Techniques for packaging and encapsulating components of diagnostic plasma measurement devices
10/06/2005US20050217795 Method of plasma etch endpoint detection using a V-I probe diagnostics
10/06/2005US20050217794 Semiconductor manufacturing apparatus and method for assisting monitoring and analysis of the same
10/06/2005US20050217793 Substrate treating apparatus
10/06/2005US20050217580 Gas distribution system
10/05/2005EP1582316A2 Method for manufacturing an inner cutter for an electric shaver
10/05/2005EP1581668A1 Etching of algainassb
10/05/2005CN1679146A Acid etching mixture having reduced water content
10/05/2005CN1678768A Method of treatment for reducing elution of lead from lead containing copper alloy and waterwork utensils made from lead containing copper alloy
10/05/2005CN1677498A Manufacturing method of magnetic head slider, magnetic head slider and magnetic device
10/05/2005CN1676563A Compositions and methods for chemical mechanical planarization of tungsten and titanium
10/05/2005CN1222203C Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet
10/04/2005US6951624 Method and apparatus of arrayed sensors for metrological control
10/04/2005US6951623 Solvent-free overcoating for metals; radiation curable polymer
10/04/2005US6951587 Ceramic heater system and substrate processing apparatus having the same installed therein
09/2005
09/29/2005WO2004027810A3 System and method for removal of materials from an article
09/29/2005US20050215046 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
09/29/2005US20050214676 Chemically amplified positive resist composition
09/29/2005US20050214624 Bipolar plate assembly, fuel cell stacks and fuel cell systems incorporating the same
09/29/2005US20050211952 Compositions and methods for chemical mechanical planarization of tungsten and titanium
09/29/2005US20050211951 Compositions and methods for polishing copper
09/29/2005US20050211670 Providing a nickel-containing layer overlying a substrate;introducing gas comprising a carbonyl gas and a hydrogen halide gas;forming plasma from said process gas; etching nickel-containing layer by exposing nickel-containing layer to plasma
09/29/2005US20050211666 Method of processing a workpiece
09/29/2005US20050211384 Thermally sprayed member, electrode and plasma processing apparatus using the electrode
09/29/2005US20050211383 Magnetron plasma-use magnetic field generation device
09/29/2005US20050211381 RF sensor clamp assembly
09/29/2005US20050211378 Filter, substrate treatment apparatus and substrate treatment method
09/29/2005US20050211377 Multiple zone carrier head with flexible membrane
09/29/2005US20050211375 Method of manufacturing a semiconductor device
09/28/2005EP1580803A1 Method of etching, etching apparatus and process for producing semiconductor device
09/28/2005EP1580300A1 Process for increasing strength, flexibility and fatigue life of metals
09/28/2005CN1674236A Method of manufacturing semiconductor device
09/28/2005CN1673861A Chemically amplified positive resist composition
09/28/2005CN1673415A Separation of nickel ion in iron trichloride solution by crystallization and extraction method
09/28/2005CN1673410A Showerhead mounting to accommodate thermal expansion
09/27/2005US6949202 Apparatus and method for flow of process gas in an ultra-clean environment
09/22/2005WO2005048663A3 Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
09/22/2005US20050209119 Etching liquid composition
09/22/2005US20050208774 Wet processing method and processing apparatus of substrate
09/22/2005US20050208771 Method of manufacturing semiconductor device
09/22/2005US20050205532 Methods and apparatus for optimizing a substrate in a plasma processing system
09/22/2005US20050205524 Method of manufacturing tape wiring substrate
09/22/2005US20050205522 Chemical mechanical polishing; carbonyl derivative of benzotriazole forms a protective film on the surface of the metal layer; hydrogen peroxide, buffer, amine; etching agent includes hydrofluoric acid; micro processing step for semiconductor device
09/22/2005US20050205520 Method for end point detection for chemical mechanical polishing of integrated circuit devices
09/22/2005US20050205519 Methods for the optimization of substrate etching in a plasma processing system
09/22/2005US20050205514 Optical microelectromechanical component and fabrication method thereof
09/22/2005US20050205210 Advanced multi-pressure workpiece processing
09/22/2005US20050205209 Replacing chamber components in a vacuum environment
09/22/2005US20050205208 Plasma processing apparatus and control method thereof
09/22/2005US20050205206 Apparatus for materials processing by stimulated light emission and method of its utilization
09/22/2005US20050205110 Removing native oxides from a substrate surface (semiconductor) in a vacuum chamber by generating reactive species from a gas mixture(NH3 + NF3), cooling surface and reacting with gas to form a film (ammonium hexafluorosilicate), and annealing to vaporize film; dry etching
09/22/2005US20050205015 Insulating film forming method, insulating film forming apparatus, and plasma film forming apparatus
09/22/2005US20050205011 Process and apparatus for forming discrete microcavities in a filament wire using a polymer etching mask
09/22/2005US20050204637 Polishing composition and polishing method
09/22/2005DE19901002B4 Verfahren zum Strukturieren einer Schicht A method for patterning a layer
09/21/2005EP1577357A1 Polishing composition and polishing method
09/21/2005EP1055016A4 Method for etching
09/21/2005CN2727191Y Chemical etching machine
09/21/2005CN2727190Y Etching reaction tank
09/21/2005CN1672237A Method for adjusting voltage on a powered faraday shield
09/21/2005CN1671270A Method of manufacturing tape wiring substrate
09/21/2005CN1670923A Chemico-mechanical polishing end-point detection method for integrated circuit device
09/21/2005CN1670913A Insulating film forming method, insulating film forming apparatus, and plasma film forming apparatus
09/20/2005US6946082 Apparatus and method for demetallizing a metallized film
09/20/2005US6946055 Method for recovering an organic solvent from a waste stream containing supercritical CO2
09/20/2005US6946027 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
09/20/2005CA2153349C Process for reducing lead leachate in brass plumbing components
09/15/2005WO2005086551A1 Etching solution, method of etching and printed wiring board
09/15/2005WO2005084930A1 Inductively coupled plasma source using induced eddy currents
09/15/2005WO2005067634A3 Advanced multi-pressure worpiece processing
09/15/2005WO2005034596B1 Improved method for micro-roughening treatment of copper and mixed-metal circuitry
09/15/2005WO2005010948A3 Cleaning process and apparatus for silicate materials
09/15/2005WO2004112092A3 Adjustable gas distribution system
09/15/2005US20050199583 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
09/15/2005US20050199343 Plasma etching apparatus and plasma etching process
09/15/2005US20050199342 Semiconductor manufacturing gas flow divider system and method
09/15/2005US20050199341 Method and system for analyzing data from a plasma process
09/14/2005EP1575082A2 Method for formimg a self-aligned germanide structure
09/14/2005EP1573775A2 Gas distribution apparatus and method for uniform etching