C23F 1 - Etching metallic material by chemical means

Patents for C23F 1 - Etching metallic material by chemical means (16,062)
01/2007
01/02/2007	US7157016 Etching process for micromachining crystalline materials and devices fabricated thereby
01/02/2007	US7156951 Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
01/02/2007	US7156950 Gas diffusion plate for use in ICP etcher
01/02/2007	US7156947 Energy enhanced surface planarization
01/02/2007	US7156946 Wafer carrier pivot mechanism
01/02/2007	US7156921 Method and apparatus for chemical vapor deposition capable of preventing contamination and enhancing film growth rate
01/02/2007	US7156046 Plasma CVD apparatus
12/2006
12/28/2006	WO2006137497A1 Etching composition for metal material and method for manufacturing semiconductor device by using same
12/28/2006	WO2006124693A3 Method and composition for improving adhesion of organic polymer coatings with copper surface
12/28/2006	WO2003102540A3 Micro machined polymer beam structure method and resulting device for spring applications
12/28/2006	US20060292888 Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant
12/28/2006	US20060292882 Method for fabricating semiconductor device
12/28/2006	US20060292876 Plasma etching method and apparatus, control program and computer-readable storage medium
12/28/2006	US20060289389 Poly etch without separate oxide decap
12/28/2006	US20060289388 Forming indentations on a chromium alloy implant by etching with a methanol-free fluid, preferably containing hydrohalic acid, an oxidant and a chloride salt, and incubating at 10-100 degrees C.; enhances adhesion of coatings or cells, improves retention of proteins, and encourages bone in-growth
12/28/2006	US20060289385 Plasma etching method and apparatus, control program and computer-readable storage medium storing the control program
12/28/2006	US20060289384 Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal
12/28/2006	US20060289381 Including selectively etching an exposed portion of the top magnetic layer, and underlying portions of the tunnel barrier and the pinned bottom magnetic film layer using an etchant solution containing an arylsulfonic acid and an aliphatic or alicyclic amine.
12/28/2006	US20060289117 Method and device for generating alfven waves
12/28/2006	US20060289116 Plasma processing apparatus
12/28/2006	US20060288934 Electrode assembly and plasma processing apparatus
12/27/2006	EP1736568A1 Liquid treatment device and liquid treatment method
12/27/2006	EP1736182A1 Orthopaedic implants with textured surface
12/27/2006	CN1885501A Etching method for forming contact window
12/27/2006	CN1885497A Liquid flow control system for wet processing tank, and wet processing system
12/27/2006	CN1885495A Etching method and contact window forming method
12/27/2006	CN1884618A Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant
12/26/2006	US7154611 Spin etcher with thickness measuring system
12/26/2006	US7153782 Effective solution and process to wet-etch metal-alloy films in semiconductor processing
12/26/2006	US7153449 Acidic treatment liquid and method of treating copper surfaces
12/26/2006	US7153445 Hydrogen peroxide, a pH adjuster, a topography modifier, and a uniformity enhancer, and free of halogen ions.
12/26/2006	US7153440 Surfactant-enhanced protection of micromechanical components from galvanic degradation
12/26/2006	US7153388 Chamber for high-pressure wafer processing and method for making the same
12/26/2006	US7153368 Susceptor with epitaxial growth control devices and epitaxial reactor using the same
12/26/2006	US7153367 Drive mechanism for a vacuum treatment apparatus
12/26/2006	US7152308 Wirebonder to bond an IC chip to a substrate
12/21/2006	WO2006083928A3 Apparatus and method for modifying an object
12/21/2006	WO2005031803A3 Thermal processing system with cross flow injection system with rotatable injectors
12/21/2006	US20060287753 Process change detection through the use of evolutionary algorithms
12/21/2006	US20060286491 Formation of a mask on an integrated electronic circuit
12/21/2006	US20060286368 Method and apparatus for creating a topographically patterned substrate
12/21/2006	US20060286018 Method and reactor arrangement of reducing the emission of nitrogen oxides
12/21/2006	US20060283837 Methods of etching an aluminum oxide comprising substrate, and methods of forming a capacitor
12/21/2006	US20060283835 Method of operating a plasma reactor chamber with respect to two plasma parameters selected from a group comprising ion density, wafer voltage, etch rate and wafer current, by controlling chamber parameters of source power and bias power
12/21/2006	US20060283551 Confinement ring assembly of plasma processing apparatus
12/21/2006	US20060283550 Plasma processing apparatus
12/21/2006	US20060283549 Plasma processing apparatus and method capable of adjusting temperature within sample table
12/20/2006	CN1882714A Cleaning process and apparatus for silicate materials
12/20/2006	CN1880504A Partial pressure control system, flow rate control system and shower plate used for partial pressure control system
12/19/2006	US7151209 Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices
12/19/2006	US7150805 Plasma process device
12/19/2006	CA2247120C Thermoplastic resin-coated aluminum alloy plate and method and apparatus for manufacturing the same
12/14/2006	WO2004109761A3 Gas distribution system
12/14/2006	US20060281314 Wafer Holder And Method Of Holding A Wafer
12/14/2006	US20060279018 applying liquids containing polymers on substrates, then stamping relief patterns; electronics such as displays and detectors
12/14/2006	US20060278612 Manufacturing method of semiconductor integrated circuit device
12/14/2006	US20060278611 Method and device for flattening surface of solid
12/14/2006	US20060278610 Method of controlling chamber parameters of a plasma reactor in accordance with desired values of plural plasma parameters, by translating desired values for the plural plasma parameters to control values for each of the chamber parameters
12/14/2006	US20060278609 Method of determining wafer voltage in a plasma reactor from applied bias voltage and current and a pair of constants
12/14/2006	US20060278607 Method for fabricating semiconductor device with step gated asymmetric recess structure
12/14/2006	US20060278535 Apparatus and methods for removing tungsten-containing coatings from a metal component
12/14/2006	US20060278340 Confined plasma with adjustable electrode area ratio
12/14/2006	US20060278339 Etch rate uniformity using the independent movement of electrode pieces
12/14/2006	DE4318676B4 Verfahren zur Verringerung einer teilchenförmigen Konzentration in Arbeitsfluiden A method for reducing a particulate concentration in working fluids
12/14/2006	DE102005026334A1 Method for processing of medium- and long-wave surface shape of work piece e.g., for optical elements, involves eroding modified layers to give work piece modified surface
12/13/2006	EP1730324A1 Process for recovering caustic soda solutions from pickling of aluminum extrusion matrix
12/13/2006	EP1729978A2 Method of dry plasma etching semiconductor materials
12/13/2006	EP1334213B1 Process for regeneration of spent acid halide leach solutions
12/13/2006	CN1878889A Thermal processing system with cross-flow liner
12/13/2006	CN1876863A Cable shielding copper alloy belt and manufacturing method thereof
12/13/2006	CN1290164C Ruthenium silicide wet etch
12/13/2006	CN1289714C Method and device for recovering metals with pulsating cathode currents also combined with anode coupling processes
12/12/2006	US7148114 Process for patterning high-k dielectric material
12/12/2006	US7147798 For etching an aluminum surface in the presence of solder bumps, containing phosphoric acid, nitric acid, acetic acid, an amine oxide surfactant, a Pb solubilizing additive, and deionized water; solder bumps are phosphate-free after etching.
12/12/2006	US7147795 Method for surface treatment
12/12/2006	US7147794 Coating for forming a high definition aperture
12/12/2006	US7147793 Method of and apparatus for tailoring an etch profile
12/12/2006	US7147748 Plasma processing method
12/12/2006	US7147747 Plasma processing apparatus and plasma processing method
12/12/2006	US7147677 Bipolar plate assembly, fuel cell stacks and fuel cell systems incorporating the same
12/07/2006	WO2006130439A1 Process for removal of metals and alloys from a substrate
12/07/2006	US20060273072 Tungsten silicide etch process with reduced etch rate micro-loading
12/07/2006	US20060273071 Removing one of an alterated layer (formed by dry-etching or ashing)and deposited layer formed on organic film pattern, then fusing film for deformation; dielectrics; for semiconductors, liquid crystal displays; photolithography
12/07/2006	US20060273070 Photoresist polymer, photoresist composition and method for manufacturing semiconductor device
12/07/2006	US20060273069 Forming a conductive pattern on a substrate
12/07/2006	US20060273066 Method for manufacturing a magnetic sensor having an ultra-narrow track width
12/07/2006	US20060273065 Method for forming free standing microstructures
12/07/2006	US20060272774 Substrate support with clamping electrical connector
12/07/2006	US20060272772 Vacuum reaction chamber with x-lamp heater
12/07/2006	US20060272675 Method and apparatus for cleaning and surface conditioning objects using plasma
12/07/2006	US20060272674 Method and apparatus for cleaning and surface conditioning objects using plasma
12/07/2006	US20060272673 Method and apparatus for cleaning and surface conditioning objects using plasma
12/07/2006	US20060272672 Method of cleaning at least one surface of an optical device disposed in a vacuum chamber
12/06/2006	EP1192050A4 Substrate treatment method
12/06/2006	CN1875466A Methods and apparatus for optimizing a substrate in a plasma processing system
12/06/2006	CN1875321A A method of forming a patterned layer on a substrate
12/06/2006	CN1873054A Etch combination
12/06/2006	CN1288279C Detin liquid and its preparation technology and use
12/05/2006	CA2434161C Process for the manufacture of printed circuit boards with plated resistors
11/2006
11/30/2006	US20060270575 Cleaning solution and cleaning method of a semiconductor device

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