Patents for C23F 1 - Etching metallic material by chemical means (16,062)
04/2007
04/04/2007CN1943003A Method and apparatus for in-situ film stack processing
04/04/2007CN1942984A Method of manufacturing aluminum material for electrolytic capacitor electrodes, aluminum material for electrolytic capacitor electrodes, anode material for aluminum electrolytic capacitors, and alumi
04/04/2007CN1942606A Liquid treatment device and liquid treatment method
04/04/2007CN1309027C Nano etching method based on nano material disposition
04/04/2007CN1309024C Grid structure and production method of high dielectric constant dielectric layer
04/04/2007CN1308486C Chemical agent supplier
04/03/2007US7198725 Method for making a surface acoustic wave device package
04/03/2007US7198694 Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems
04/03/2007US7198678 Apparatus for performing at least one process on a substrate
03/2007
03/29/2007WO2007035880A2 Method and apparatus for forming device features in an integrated electroless deposition system
03/29/2007WO2005111267A3 Gas distribution member supplying process gas and rf power for plasma processing
03/29/2007US20070072434 Method and system for operating a physical vapor deposition process
03/29/2007US20070072429 Pattern enhancement by crystallographic etching
03/29/2007US20070072427 Method for fabricating semiconductor device and polishing method
03/29/2007US20070072426 Chemical mechanical polishing process and apparatus therefor
03/29/2007US20070071888 Method and apparatus for forming device features in an integrated electroless deposition system
03/29/2007US20070068900 Apparatus and methods to remove films on bevel edge and backside of wafer
03/29/2007US20070068899 Apparatus for the removal of an edge polymer from a substrate and methods therefor
03/29/2007US20070068629 Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof
03/29/2007US20070068627 Electrical Open/Short Contact Alignment Structure for Active Region vs. Gate Region
03/29/2007US20070068626 Vacuum processing apparatus
03/29/2007US20070068624 Apparatus to treat a substrate and method thereof
03/29/2007US20070068623 Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor
03/29/2007US20070068456 Monitoring processing of a substrate in a processing chamber
03/29/2007US20070068455 Adjustable electrode assembly for use in processing substrates of differing widths in a plasma processing system
03/28/2007EP1766669A1 Reactive fluid systems for removing deposition materials and methods for using same
03/28/2007EP1766665A2 Improved method and apparatus for the etching of microstructures
03/28/2007CN1938661A Semiconductor manufacturing gas flow divider system and method
03/28/2007CN1937179A Etching method of single wafer
03/27/2007US7196449 Two-axis device and manufacturing method therefor
03/27/2007US7195693 Lateral temperature equalizing system for large area surfaces during processing
03/22/2007US20070066038 Fast gas switching plasma processing apparatus
03/22/2007US20070062910 Complex CMP process and fabricating methods of STI structure and interconnect structure
03/22/2007US20070062909 cleaning with a detergent, then deionized water, then treating with a nitric acid solution; useful for gas distribution in semiconductor processing equipment; leakproof
03/22/2007US20070062647 Method and apparatus for isolative substrate edge area processing
03/22/2007US20070062455 Gas driven rotation apparatus and method for forming crystalline layers
03/22/2007US20070062454 Method for dechucking a substrate
03/22/2007US20070062450 Production apparatus for magnetic recording medium
03/22/2007US20070062449 Enhanced magnetic shielding for plasma-based semiconductor processing tool
03/21/2007CN1306568C Terminal testing method and device
03/21/2007CN1306526C Method for forming noble metal film pattern
03/21/2007CN1306065C Controllable type etching equipment of microbe
03/20/2007US7192886 Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics
03/20/2007US7192883 Method of manufacturing semiconductor device
03/20/2007US7192529 Plurality of protrusions of different heights; protrusions of larger height having a stack structure formed of layers of at least two types of materials, allowing transfer of a number of patterns at the same time.
03/20/2007US7192510 Fluid control device and method of manufacturing the same
03/20/2007US7192487 Semiconductor substrate processing chamber and accessory attachment interfacial structure
03/15/2007WO2005098091A3 A method of plasma etch endpoint detection using a v-i probe diagnostics
03/15/2007US20070056930 Polysilicon etching methods
03/15/2007US20070056929 Plasma etching apparatus and plasma etching method
03/15/2007US20070056928 Plasma processing method and plasma processing device
03/15/2007US20070056927 Process and system for etching doped silicon
03/15/2007US20070056926 Process and system for etching doped silicon using SF6-based chemistry
03/15/2007US20070056925 Selective etch of films with high dielectric constant with H2 addition
03/14/2007EP1761947A1 Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
03/14/2007EP1761659A1 Electrolytically recoverable etching solution
03/14/2007CN1928159A Green high efficient restrainer and its application
03/14/2007CN1928158A Method for constructing super-drainage structure on metal copper surface
03/14/2007CN1304643C Method of plating and pretreating aluminium workpieces
03/13/2007US7190119 Methods and apparatus for optimizing a substrate in a plasma processing system
03/13/2007US7189449 Metal/ceramic bonding substrate and method for producing same
03/13/2007US7189336 Etchant, method for roughening copper surface and method for producing printed wiring board
03/13/2007US7189305 Gas-assist systems for applying and moving ozonated resist stripper to resist-bearing surfaces of substrates
03/08/2007US20070054493 Methods of forming patterns using phase change material and methods for removing the same
03/08/2007US20070052322 Micromachined polymer beam structure method and resulting device for spring applications
03/08/2007US20070051874 Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device
03/08/2007US20070051700 Composition for cleaning substrates and method of forming gate using the composition
03/08/2007US20070051699 Methods of removing metal contaminants from a component for a plasma processing apparatus
03/08/2007US20070051698 Photoresist trimming process
03/08/2007US20070051696 Method for reducing critical dimension and semiconductor etching method
03/08/2007US20070051693 Microetching solution
03/08/2007US20070051471 Methods and apparatus for stripping
03/08/2007US20070051470 Plasma processing apparatus and method
03/08/2007US20070051412 Method and apparatus for the mechanical actuation of valves in fluidic devices
03/08/2007US20070051314 Movable transfer chamber and substrate-treating apparatus including the same
03/08/2007US20070051312 Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
03/07/2007CN1924076A Method of manufacturing corrosive-resistant single-body hydraulic supporter by salt bath nitriding
03/07/2007CN1303655C Polishing method for base copper-layer
03/07/2007CN1303251C Special hot state silicon washing film forming agent for high parameter boiler
03/06/2007US7186480 Subjecting the chrome-containing layer of a photomask to a wet etch process using deionized water and ozone; length of exposure is directly proportional to the degree of adjustment desired
03/06/2007US7186350 Providing a substrate with an alignment mark;forming a color resist layer over the substrate and the alignment mark;injecting a solvent to contact the color resist over the alignment mark and dissolve the color resist; removal of the dissolved color resist by vacuum suction to expose alignment mark
03/06/2007US7186314 Plasma processor and plasma processing method
03/06/2007US7186298 Wafer support system
03/01/2007WO2007024556A2 Methods and compositions for acid treatment of a metal surface
03/01/2007WO2006031452A3 Apparatus for the optimization of atmospheric plasma in a plasma processing system
03/01/2007WO2006023637A3 In situ surface contaminant removal for ion implanting
03/01/2007US20070050076 Method and apparatus for determining an operation status of a plasma processing apparatus, program and storage medium storing same
03/01/2007US20070049040 Multiple deposition for integration of spacers in pitch multiplication process
03/01/2007US20070045234 Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
03/01/2007US20070045232 Wafer polishing method and polished wafer
03/01/2007US20070045230 Methods for independently controlling one or more etching parameters in the manufacture of microfeature devices
03/01/2007US20070045229 System and method for the manufacture of surgical blades
03/01/2007US20070045227 Method of stripping photoresist
03/01/2007US20070045226 Technique for reducing silicide defects by reducing deleterious effects of particle bombardment prior to silicidation
03/01/2007US20070044916 Vacuum processing system
03/01/2007US20070044915 Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same
03/01/2007US20070044718 Wafer Holder and Semiconductor Manufacturing Apparatus
02/2007
02/28/2007EP1756331A1 Container for holding and storing liquids as well as viscous substances, and method for the production thereof
02/28/2007CN1922463A Method and apparatus for measuring film thickness by means of coupled eddy sensors
02/28/2007CN1922344A Apparatus for electroless deposition
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