Patents for C23F 1 - Etching metallic material by chemical means (16,062)
02/2007
02/28/2007CN1922340A Method of electroplating on aluminum
02/28/2007CN1921955A Substrate processing apparatus and method
02/28/2007CN1920098A Dissolved tin containing divalent copper compound and tin alloy solution
02/28/2007CN1920097A Wet method pattern technology of chrome-nickel alloy thin film
02/28/2007CN1302545C Printed circuit boards with plated resistors and its manufacturing method
02/28/2007CN1302154C Stripping liquid for aluminum silicon infiltration layer on the surface of high-temperature alloy and its application method
02/27/2007US7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
02/27/2007US7183183 Method for using ion implantation to treat the sidewalls of a feature in a low-k dielectric film
02/27/2007US7183126 Method for forming an optical interfering pattern on a surface of a metal substrate, and article having an optical interfering effect
02/27/2007US7182875 Microstructures and methods of fabrication thereof
02/27/2007US7182816 Particulate reduction using temperature-controlled chamber shield
02/22/2007WO2007020206A1 Stabilized etching solutions for cu and cu/ni layers
02/22/2007WO2006071816A3 Window protector for sputter etching of metal layers
02/22/2007US20070042602 Etch method using supercritical fluids
02/22/2007US20070039927 CMP wafer contamination reduced by insitu clean
02/22/2007US20070039923 Method for preventing charge-up in plasma process and semiconductor wafer manufactured using same
02/22/2007US20070039920 Method of fabricating nanochannels and nanochannels thus fabricated
02/22/2007US20070039919 Polymide thin film self-assembly process
02/22/2007US20070039170 Three-dimensional metal microfabrication process and devices produced thereby
02/21/2007EP1753896A1 Method and system for selectively coating or etching surfaces
02/21/2007EP1430288A4 Method and apparatus for real-time dynamic chemical analysis
02/21/2007CN1917151A Process for producing silicon wafer
02/21/2007CN1916240A Corrosion liquid for InGaP/ AIGaInP crystal material
02/20/2007US7179753 Process for planarizing substrates of semiconductor technology
02/20/2007US7179397 Plasma processing methods and apparatus
02/20/2007US7179334 System and method for performing semiconductor processing on substrate being processed
02/20/2007CA2384465C Selective removal of brazing compound from joined assemblies
02/15/2007US20070037402 Method for manufacturing semi-transparent semi-reflective electrode substrate, reflective element substrate, method for manufacturing same, etching composition used for the method for manufacturing the reflective electrode substrate
02/15/2007US20070037395 Stringer elimination in a BiCMOS process
02/15/2007US20070035200 Microelectromechanical system comprising a beam that undergoes flexural deformation
02/15/2007US20070034606 Method for pickling metallic surfaces by using alkoxylated alkynols
02/15/2007US20070034605 Evaporation control using coating
02/15/2007US20070034604 Method and apparatus for tuning a set of plasma processing steps
02/15/2007US20070034603 Etching methods, RIE methods, and methods of increasing the stability of photoresist during RIE
02/15/2007US20070034599 Nanoscale electric lithography
02/15/2007US20070034337 Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
02/15/2007US20070034336 Method of, and apparatus for, producing near field optical head
02/15/2007US20070034157 Plasma processing apparatus and plasma processing method
02/15/2007US20070034154 Plasma source assembly and method of manufacture
02/15/2007DE102005038414A1 Stabilisierte Ätzlösungen zum Ätzen von Cu- und Cu/Ni-Schicht Stabilized etching solutions for etching of Cu and Cu / Ni layer
02/14/2007EP1752562A1 Process for stripping an area of a layer from a component
02/14/2007EP1750918A1 Etch rate control
02/14/2007CN1914712A Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
02/14/2007CN1914710A System and method for selective etching of silicon nitride during substrate processing
02/14/2007CN1914356A Surface-treating agent for metal
02/14/2007CN1914355A Method for surface treatment of metal material
02/14/2007CN1913098A Loading umloading device of semiconductor processing piece and its loading and unloading method
02/14/2007CN1912187A Etchant composition, methods of patterning conductive layer and manufacturing flat panel display device using the same
02/14/2007CN1912186A Oxygen charging device of sal ammoniac etching liquid
02/14/2007CN1912185A Lifting device and method for processing alloy wire with continuous or step taper at end
02/14/2007CN1912184A Etching method of copper-coated electronic circuit board
02/13/2007US7176494 Thin film transistor for liquid crystal display and method of manufacturing the same
02/13/2007US7176469 Negative ion source with external RF antenna
02/13/2007US7176041 PAA-based etchant, methods of using same, and resultant structures
02/13/2007US7175737 Electrostatic chucking stage and substrate processing apparatus
02/13/2007US7175713 Apparatus for cyclical deposition of thin films
02/08/2007WO2007016315A2 Extended release venlafaxine compositions
02/08/2007WO2007016013A2 Unique passivation technique for a cvd blocker plate to prevent particle formation
02/08/2007US20070032086 Mehtod of manufacturing an electronic device
02/08/2007US20070029284 Dry etching method, fabrication method for semiconductor device, and dry etching apparatus
02/08/2007US20070029283 Etching processes and methods of forming semiconductor constructions
02/08/2007US20070029280 Photoresists; dielectrics
02/08/2007US20070029046 Methods and systems for increasing substrate temperature in plasma reactors
02/08/2007US20070029044 Plasma etching apparatus
02/07/2007EP1749116A1 Methods and apparatuses for transferring articles through a load lock chamber under vacuum
02/07/2007CN1910308A Advanced multi-pressure workpiece processing
02/07/2007CN1909192A Non-selective etched process for GaAs/AlGaAs crystal material
02/07/2007CN1909183A Semiconductor arts piece processing device
02/07/2007CN1909182A Semiconductor technology processing system and method
02/07/2007CN1908232A Method of losslessly separating copper from copper solution and application thereof
02/07/2007CN1298292C System and method for the manufacture of surgical blades
02/06/2007US7172979 Substrate processing apparatus and method
02/06/2007US7172707 Sputtered spring films with low stress anisotropy
02/06/2007US7171919 Diamond film depositing apparatus using microwaves and plasma
02/01/2007WO2007013703A1 Injection type plasma treatment apparatus and method
02/01/2007US20070026682 Method for advanced time-multiplexed etching
02/01/2007US20070026347 Method for fabricating thin film transistor and pixel structure
02/01/2007US20070023394 Etching Method and Etching Apparatus
02/01/2007US20070023393 polysilicon layer has at least one doped region, is provided, substrate is placed in a processing chamber, an etchant gas is provided into the processing chamber comprises N2, SF6, and at least one of CHF3 and CH2F2. The etching gas is transformed to a plasma to etch the polysilicone
02/01/2007US20070023392 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
02/01/2007US20070023391 Temperature exchanging element made by extrusion, and its applications
02/01/2007US20070023390 Cluster tool and method for process integration in manufacturing of a photomask
02/01/2007US20070023389 Substrate and method of forming substrate for fluid ejection device
02/01/2007US20070023386 Hollow microneedle array
02/01/2007US20070023145 Apparatus to confine plasma and to enhance flow conductance
02/01/2007US20070023144 Gas line weldment design and process for cvd aluminum
02/01/2007US20070023142 Airfoil refurbishment method
02/01/2007US20070022954 Gas treatment device and heat readiting method
02/01/2007US20070022952 Unique passivation technique for a cvd blocker plate to prevent particle formation
02/01/2007CA2634297A1 Article having patterned decorative coating
01/2007
01/31/2007EP1747303A2 Improved micro-fluid ejection assemblies
01/31/2007CN1904142A Copper extraction method of etching waste liquid or low copper containing waste liquid
01/31/2007CN1298199C Plasma treatment method and apparatus
01/31/2007CN1297692C Electrode and electrolytic solution for preparing nitrogen trifluoride gas and process for preparing nitrogen trifluoride gas by them
01/31/2007CN1297690C Appts. for silicon anisotropic corrosion
01/30/2007US7169664 Method of reducing wafer contamination by removing under-metal layers at the wafer edge
01/30/2007US7169317 Removing native titanium oxide layer from titanium bone implant, acid etching surface to form a uniform surface roughness, depositing a layer of hydroxyapatite on acid-etched surface; enhanced bonding
01/30/2007US7169315 Method of producing an aluminium surface with a high total reflectance
01/30/2007US7169253 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
01/30/2007US7169234 Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
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