Patents for C23F 1 - Etching metallic material by chemical means (16,062)
08/2005
08/04/2005WO2005027729A3 Silicon blades for surgical and non-surgical use
08/04/2005US20050170077 Adhesion method
08/04/2005US20050169096 PAA- based etchant, methods of using same, and resultant structures
08/04/2005US20050167395 Mask, method of fabricating the same, and method of fabricating organic electro-luminescence device using the same
08/04/2005US20050167393 Cleaning process and apparatus for silicate materials
08/04/2005US20050167281 Production method of suspension board with circuit
08/03/2005EP1560263A2 Method for forming macropores in a layer and products obtained thereof
08/03/2005EP1560262A1 Plasma etching chamber and plasma etching system using same
08/03/2005CN1649473A Production method of suspension board with circuit
08/03/2005CN1213342C Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer
08/02/2005US6924069 Depositing a negative photoresist over the light blocking layer to include filling a portion of the opening exposing the negative photoresist layer through the quartz substrate; developing and dry etching; accuracy
07/2005
07/28/2005WO2005069705A1 Metal pattern and process for producing the same
07/28/2005WO2005067634A2 Advanced multi-pressure worpiece processing
07/28/2005WO2005037446A3 Applying imprinting material to substrates employing electromagnetic fields
07/28/2005US20050165474 Flexible stent
07/28/2005US20050161439 applying caustic solution then nitric acid; without damage to base metal
07/28/2005US20050161438 Method for chemically removing aluminum-containing materials from a substrate
07/28/2005US20050161437 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process
07/28/2005US20050161435 using a hard mask of metal nitride, by generating a plasma from a mixture of nitrogen, carbon tetrafluoride (CF4) and a fluorocarbon CxFy (X >== 2); will not form hard to remove metal oxide deposits in the etching holes when etching silicon oxide, silicon oxycarbide or silicon carbide
07/28/2005US20050161428 Patterning the surface of a metal substrate using a mask to pattern microcavities to be etched using photolithography techniques, wet-etching to form the microcavities; efficient, economical rainbow holograms for e.g. counterfeiting prevention
07/28/2005US20050161250 Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board
07/28/2005US20050161157 Substrate treating apparatus and method
07/28/2005US20050160987 Plasma processing apparatus
07/28/2005DE102004014680B3 Demetallizing solution for removing tin-bismuth layers, e.g. from electronic or electrical components, containing acid (e.g. alkylsulfonic acid), nitroaromatic compound and aminopolycarboxylic acid
07/27/2005EP1311714A4 Surface treatments to improve corrosion resistance of austenitic stainless steels
07/27/2005CN2713646Y Grid structure having high dielectric constant dielectric layer
07/27/2005CN1646731A Process for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode and process for producing electrode material for electrolytic capac
07/27/2005CN1646245A System and method for the manufacture of surgical blades
07/27/2005CN1645987A Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board
07/27/2005CN1645574A Etching liquid recovering system and method
07/27/2005CN1644764A Chemical etching method for zinc oxide material
07/27/2005CN1212652C Photoetching method for nanoparticle pattern based on self organization
07/27/2005CN1212650C Method by using wet etching with non-equivalence in directions to carry out even process
07/27/2005CN1212549C Making method of micro text and pattern mold
07/27/2005CN1212426C Method for suspension etching one face of film
07/26/2005US6921493 Method of processing substrates
07/26/2005US6921437 Gas distribution system
07/21/2005WO2005067354A1 Printed wiring board, method for manufacturing same, and circuit device
07/21/2005WO2005066579A1 Method and apparatus for measuring fillm thickness by means of coupled eddy sensors
07/21/2005WO2005065433A2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
07/21/2005WO2005065186A2 Showerhead electrode assembly for plasma processing apparatuses
07/21/2005US20050156140 Tungsten metal removing solution and method for removing tungsten metal by use thereof
07/21/2005US20050155950 Method of forming a micro pattern on a substrate
07/21/2005DE10358025A1 Etching of tungsten involves using a gas mixture that contains nitrogen trifluoride, hydrogen bromide, and oxygen
07/20/2005CN1643666A Plasma processor electrode and plasma processor
07/20/2005CN1643665A Method of plasma etching
07/20/2005CN1641840A Chip protection device
07/20/2005CN1641839A Chip protection device
07/20/2005CN1211504C Nickel-containing iron trichloride etching effluent extraction and separation method
07/20/2005CN1211503C Recovery of tin from waste liquid of tin and lead
07/19/2005USRE38760 Controlled etching of oxides via gas phase reactions
07/19/2005US6918989 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
07/19/2005US6918988 Semiconductor processing device
07/14/2005US20050151544 Sensor array for measuring plasma characteristics in plasma processing environments
07/13/2005EP1552552A2 Method for eliminating voiding in plated solder
07/13/2005EP1552037A1 Method for removing a layer area of a component
07/13/2005CN1639476A Dynamic pressure bearing manufacturing method, dynamic pressure bearing, and dynamic pressure bearing manufacturing device
07/13/2005CN1638598A Plasma treatment device and substrate surface treatment device
07/13/2005CN1637438A Etching method, a substrate with a plurality of concave portions, a microlens substrate, a transmission screen and a rear projection
07/07/2005WO2005061378A2 Equipment and process for creating a custom sloped etch in a substrate
07/07/2005US20050145602 Test patterns and methods of controlling CMP process using the same
07/07/2005US20050145336 Plasma processor electrode and plasma processor
07/07/2005US20050145334 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters
07/06/2005EP1549784A2 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
07/06/2005EP1549783A1 Aqueous composition for the chemical removal of metallic surfacing present on turbine blades, and its use
07/06/2005EP1549780A2 Substrate processing apparatus and related systems and methods
07/06/2005CN1634713A Method for forming multilayered patterns on aluminium composite board surface
07/06/2005CN1209500C Method for removing copper stannous and lead ions from used tin soldering liquid
07/06/2005CN1209499C Etching agent and application for improving etching selective ratio
07/05/2005US6914039 Etching liquid composition
07/05/2005US6913653 Prior to cleaning with XeF2, contacting XeF2 gas with an article to be cleaned, such as a semiconductor, in a reduced-pressure or vacuum atmosphere containing a required amount of water to form HFto be
06/2005
06/30/2005WO2004084287A9 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
06/30/2005WO2004066027A3 Electron beam processing for mask repair
06/30/2005US20050141085 Etching method, a substrate with a plurality of concave portions, a microlens substrate, a transmission screen and a rear projection
06/30/2005US20050139968 Chemical leadframe roughening process and resulting leadframe and integrated circuit package
06/30/2005US20050139939 Wafer protection device
06/30/2005US20050139575 Phase shift mask and fabricating method thereof
06/30/2005US20050139322 Plasma processing device
06/30/2005US20050139321 Plasma processing apparatus
06/30/2005US20050139229 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads
06/30/2005US20050138803 Stamper for pattern transfer and manufacturing method thereof
06/30/2005DE10355990A1 Differential etching technique for plate shaped components e.g. electronic circuit board, comprises using an etching unit with a horizontal or vertical transport system
06/29/2005EP1548808A1 High frequency plasma generator and high frequency plasma generating method
06/29/2005EP1548155A1 Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material
06/29/2005EP1432847B8 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
06/29/2005CN1208813C Transfer type substrate treating device
06/29/2005CN1208139C Low etch alkaline zincate composition and process for zincating aluminum
06/28/2005US6911249 Surface for use on implantable device
06/23/2005WO2005013002A3 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
06/23/2005US20050137029 Golf Club Striking Plate wtih Variable Thickness
06/23/2005US20050136672 Etching solution composition for metal films
06/23/2005US20050133479 Equipment and process for creating a custom sloped etch in a substrate
06/23/2005US20050133165 Apparatus for the prevention of arcing in a CVD-TiN chamber
06/23/2005US20050133160 Showerhead electrode assembly for plasma processing apparatuses
06/23/2005DE102004050358A1 Etching composition hydrogen fluoride useful for selectively etching oxide layer and for manufacturing semiconductor device comprises ammonium fluoride, non-ionic polymer surfactant and water
06/22/2005CN1630917A Etching solution for forming an embedded resistor
06/22/2005CN1630038A Etching solution and method for manufacturing conducting lug by selectively removing barrier layer with the same
06/22/2005CN1629357A Surface coarsening agent for copper or copper alloys
06/22/2005CN1207442C Method of reducing elution of lead in lead-containing copper alloy, and method of reducing elution plate of lead in lead-containing copper alloy
06/21/2005US6908569 Ruthenium silicide wet etch