Patents for C23F 1 - Etching metallic material by chemical means (16,062)
10/2007
10/18/2007WO2007117740A2 Multi-zone substrate temperature control system and method of operating
10/18/2007US20070242328 Tiltable-body apparatus, and method of fabricating the same
10/18/2007US20070241076 Staggered Vertical Comb Drive Fabrication Method
10/18/2007US20070240826 Gas supply device and apparatus for gas etching or cleaning substrates
10/18/2007US20070240646 Substrate treatment apparatus
10/17/2007EP1843903A2 Processes for forming electronic devices and electronic devices formed by such processes
10/17/2007EP1843863A2 Method and apparatus for cleaning and surface conditioning objects with plasma
10/17/2007EP1633906B1 Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
10/17/2007EP1616189A4 Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system
10/17/2007CN200961148Y 蚀刻机 Etching
10/17/2007CN100344001C Method for preparing polycrystalline silicon suede
10/17/2007CN100343952C Silicon chip unloading technology capable of raising production volume and reducing silicon chip surface roughness
10/17/2007CN100343362C Polishing fluid for metal and polishing Method
10/16/2007US7282158 Method of processing a workpiece
10/16/2007US7282157 Method of manufacturing light-propagating probe for near-field microscope
10/16/2007US7282112 Method and apparatus for an improved baffle plate in a plasma processing system
10/16/2007US7282111 System and method for monitoring particles contamination in semiconductor manufacturing facilities
10/16/2007US7282097 Slit valve door seal
10/16/2007US7281491 Dielectric-coated electrode, plasma discharge treatment apparatus and method for forming thin film
10/11/2007WO2007059730A3 Method for the pre-treatment of titanium components for the subsequent coating thereof
10/11/2007US20070238261 Device, lithographic apparatus and device manufacturing method
10/11/2007US20070235685 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/11/2007US20070235413 Method of forming si tip by single etching process and its application for forming floating gate
10/11/2007US20070235412 Segmented radio frequency electrode apparatus and method for uniformity control
10/11/2007US20070235411 Method for removing damaged dielectric material
10/11/2007US20070235410 Method of forming a darkfield etch mask
10/11/2007US20070235409 Controlled fluid meniscus continuously fills the region between a tool head and the surface of the substrate; removing fluid by vacuum
10/11/2007US20070235407 Method of fabricating a diaphragm of a capacitive microphone device
10/11/2007US20070235138 Post-etch treatment system for removing residue on a substrate
10/11/2007US20070235137 Gas distribution system for a post-etch treatment system
10/11/2007US20070235136 Reduced contaminant gas injection system and method of using
10/11/2007US20070235135 Plasma processing apparatus
10/11/2007US20070235134 Multi-zone substrate temperature control system and method of operating
10/11/2007US20070235133 Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
10/11/2007US20070235132 Photoresist stripping apparatus, method of recycling photoresist stripper, and method of manufacturing thin film transistor array panel using the photoresist stripping apparatus
10/11/2007US20070234960 Plasma processing apparatus
10/11/2007US20070234957 Method of forming oxide film and oxide deposition apparatus
10/10/2007CN100342515C Method for eliminating voiding in plated solder
10/09/2007US7279116 Method for the wet treatment of disk-like objects
10/09/2007US7279115 Method to reduce stacking fault nucleation sites and reduce Vf drift in bipolar devices
10/09/2007US7279068 Temperature control assembly for use in etching processes
10/09/2007US7279067 Port structure in semiconductor processing system
10/09/2007US7279066 Apparatus for forming silicon oxide film
10/09/2007US7279049 Apparatus for reducing entrapment of foreign matter along a moveable shaft of a substrate support
10/04/2007WO2007111837A2 Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material
10/04/2007WO2006104863A3 A plasma enhanced atomic layer deposition system
10/04/2007US20070232085 Method and apparatus for plasma processing
10/04/2007US20070231540 Anisotropic wet etching of silicon
10/04/2007US20070228333 Adhesion promotion in printed circuit boards
10/04/2007US20070228012 Method for making a satin finish surface
10/04/2007US20070228009 Keep high in-plane uniformity of plasma processing by varying impedance on an electrode side of the plasma generated in the process vessel to frequency of a radio-frequency power source;etching semiconductor wafers; efficiency
10/04/2007US20070228008 Medium pressure plasma system for removal of surface layers without substrate loss
10/04/2007US20070228004 Device and method for the treatment of wafers
10/04/2007US20070228003 Measuring line widths of collinear line bodies in a mask layer; locating effective line end positions for the line ends based on the line widths; and measuring the distance between the effective line end positions, as an effective line end spacing; accurate prediction for optical proximity corrections
10/04/2007US20070227669 Method and apparatus for plasma processing
10/04/2007US20070227668 Plasma processing apparatus
10/04/2007US20070227667 Plasma processing apparatus and method of measuring amount of radio-frequency current in plasma
10/04/2007US20070227666 Plasma processing apparatus
10/04/2007US20070227665 Plasma processing method and plasma processing apparatus
10/04/2007US20070227664 Plasma processing apparatus and plasma processing method
10/04/2007US20070227663 Substrate processing apparatus and side wall component
10/04/2007US20070227662 Plasma processing apparatus
10/04/2007US20070227661 Microwave plasma processing apparatus, method for manufacturing microwave plasma processing apparatus and plasma processing method
10/04/2007US20070227660 Plasma treatment apparatus
10/04/2007US20070227658 Control device for controlling substrate processing apparatus and method therefor
10/04/2007US20070227657 Plasma processing apparatus
10/04/2007US20070227625 Adhesion promotion in printed circuit boards
10/03/2007EP1840948A1 Fine treatment agent and fine treatment method using same
10/03/2007EP1838899A2 Applications and fabrication techniques for large scale wire grid polarizers
10/03/2007EP1549780A4 Substrate processing apparatus and related systems and methods
10/03/2007CN100341165C Electrochemical making process and apparatus of super-miniature thermocouple
10/03/2007CN100340632C Method for roughening copper surfaces for bonding to substrates
10/02/2007US7276180 Chemical mechanical polishing composition and process
10/02/2007US7276174 Etching plastic surface with sulfuric acid and chromic anhydride in solution comprising oxidation catalyst; metallized coatings; decorations
10/02/2007US7276172 Method for preparing a nanowire crossbar structure and use of a structure prepared by this method
10/02/2007US7276140 Plasma accelerating apparatus for semiconductor substrate processing and plasma processing system having the same
10/02/2007US7276135 Vacuum plasma processor including control in response to DC bias voltage
10/02/2007US7276124 Reactor having a movable shutter
10/02/2007US7276123 Semiconductor-processing apparatus provided with susceptor and placing block
10/02/2007US7276122 Multi-workpiece processing chamber
09/2007
09/27/2007WO2007109356A2 Device and method for etching flash memory gate stacks comprising high-k dielectric
09/27/2007WO2007027458A3 Batch deposition tool and compressed boat
09/27/2007US20070224826 Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material
09/27/2007US20070224817 Plasma processing apparatus, plasma processing method, and storage medium
09/27/2007US20070224813 Device and method for etching flash memory gate stacks comprising high-k dielectric
09/27/2007US20070224709 Plasma processing method and apparatus, control program and storage medium
09/27/2007US20070224350 Edge coating in continuous deposition line
09/27/2007US20070223342 Substrate Processing Method and Substrate Processing Apparatus
09/27/2007US20070221623 Plasma processing apparatus and method
09/27/2007US20070221620 Processes for monitoring the levels of oxygen and/or nitrogen species in a substantially oxygen and nitrogen-free plasma ashing process
09/27/2007US20070221617 Method of manufacturing nozzle plate, liquid ejection head and image forming apparatus
09/27/2007US20070221612 Method of forming a conductive pattern
09/27/2007US20070221611 Method of manufacturing fine features for thin film transistors
09/27/2007US20070221609 Method for purifying silicon carbide coated structures
09/27/2007US20070221332 Plasma processing apparatus
09/27/2007US20070221331 Hybrid plasma reactor
09/27/2007US20070221330 Agitated wet process machine
09/26/2007CN101044601A Method and system for substrate temperature profile control
09/25/2007US7273533 Plasma processing system with locally-efficient inductive plasma coupling
09/25/2007US7273526 Thin-film deposition apparatus
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