Patents for C23F 1 - Etching metallic material by chemical means (16,062)
05/2007
05/24/2007WO2007058284A1 Wet etching method and wet etching apparatus
05/24/2007US20070117392 Coiled circuit device with active circuitry and methods for making the same
05/24/2007US20070117389 Pattern formation method using nanoimprinting and device for carrying out same
05/24/2007US20070114208 Substrate treating method and apparatus
05/24/2007US20070114207 Charge-free method of forming nanostructures on a substrate
05/24/2007US20070114205 Method of forming etching mask
05/24/2007US20070114204 Method for making guide panel for vertical probe card in batch
05/24/2007US20070113981 Etch system with integrated inductive coupling
05/24/2007US20070113980 Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
05/24/2007US20070113979 Slotted Electrostatic Shield Modification for Improved Etch and CVD Process Uniformity
05/24/2007US20070113978 Plasma processing apparatus and method
05/24/2007US20070113977 Revolution member supporting apparatus and semiconductor substrate processing apparatus
05/24/2007US20070113976 Plasma chamber wall segment temperature control
05/24/2007US20070113975 Plasma reaction chamber assemblies
05/24/2007US20070113867 Polymer treatment using a plasma brush
05/24/2007US20070113788 Plasma processing equipment
05/24/2007US20070113787 Plasma process apparatus
05/24/2007US20070113786 Radio frequency grounding rod
05/24/2007US20070113785 Radio frequency grounding apparatus
05/24/2007US20070113783 Band shield for substrate processing chamber
05/23/2007EP1788125A2 Strip process for superalloys
05/23/2007CN1969060A Gas distribution system having fast gas switching capabilities
05/23/2007CN1967773A Etching method of ditch road device
05/23/2007CN1967752A A low-voltage anode foil used for aluminium electrolytic capacitor and its manufacturing method
05/23/2007CN1966773A Method for simultaneous electrolysis and regeneration of acid etching solution and micro-etching solution
05/23/2007CN1966772A Composition for etching metal layer and method for forming metal pattern by using same
05/23/2007CN1966548A Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
05/23/2007CN1317738C Etching method, a substrate with a plurality of concave portions, a microlens substrate, a transmission screen and a rear projection
05/22/2007US7221495 Thin film precursor stack for MEMS manufacturing
05/22/2007US7220604 Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those
05/22/2007US7220362 Planarization with reduced dishing
05/22/2007US7219826 Method for producing metal/ceramic bonding substrate
05/18/2007WO2007055670A1 Method for recycling an etching solution used for treating printed cards
05/18/2007WO2007055371A1 Method for production of nano-porous substrate
05/18/2007WO2005112092A3 CARBON-DOPED-Si OXIDE ETCH USING H2 ADDITIVE IN FLUOROCARBON ETCH CHEMISTRY
05/17/2007US20070111532 PAA-based etchant, methods of using same, and resultant structures
05/17/2007US20070108163 Stamper, imprinting method, and method of manufacturing an information recording medium
05/17/2007US20070108160 Plasma etching of tapered structures
05/17/2007US20070108159 Probe for scanning probe microscope and method of producing the same
05/17/2007US20070107845 Semiconductor processing system
05/17/2007US20070107844 Broadband Techniques to Reduce the Effects of Impedance Mismatch in Plasma Chambers
05/17/2007US20070107842 Corrosion-resistant member
05/17/2007US20070107841 Ion implantation ion source, system and method
05/17/2007US20070107749 Process chamber cleaning method
05/16/2007EP1436142B1 Metal-containing web processed with a continuous etch process
05/16/2007CN1316547C Plasma reactor coil magnet system
05/15/2007US7218046 Unitized chemically etched tungsten electrode
05/15/2007US7217369 Meso-microelectromechanical system having a glass beam and method for its fabrication
05/15/2007US7217337 Plasma process chamber and system
05/15/2007US7216653 Mixture containing oxidizer, water, reducing agents and charging controllers; removal oxides formed
05/10/2007US20070105392 Batch photoresist dry strip and ash system and process
05/10/2007US20070105377 Fabrication of semiconductor interconnect structure
05/10/2007US20070104624 Microreactor including magnetic barrier
05/10/2007US20070102400 Systems and methods for processing microfeature workpieces
05/10/2007US20070102399 Method and apparatus for manufacturing a semiconductor device, control program and computer-readable storage medium
05/10/2007US20070102397 Method for printing contacts on a substrate
05/10/2007US20070102119 Plasma processing system and plasma processing method
05/10/2007US20070102118 Method and apparatus for controlling temperature of a substrate
05/10/2007US20070102117 Substrate processing system and substrate processing method
05/10/2007US20070101938 Inductively coupled plasma processing apparatus having internal linear antenna for large area processing
05/09/2007EP1310142B1 Improved adhesion of polymeric materials to metal surfaces
05/09/2007CN1961410A Reactive fluid systems for removing deposition materials and methods for using same
05/09/2007CN1959939A Etching method, and method for forming opening
05/08/2007US7214327 Anisotropic dry etching of Cu-containing layers
05/08/2007US7214326 Increased capacity leadframe and semiconductor package using the same
05/08/2007US7214324 Technique for manufacturing micro-electro mechanical structures
05/08/2007US7214289 Method and apparatus for wall film monitoring
05/08/2007US7214274 Method and apparatus for thermally insulating adjacent temperature controlled processing chambers
05/03/2007WO2007049750A1 Palladium-selective etching solution and method for controlling etching selectivity
05/03/2007WO2007049494A1 Process for producing patterned substance
05/03/2007WO2007048559A1 Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
05/03/2007US20070099432 Method for photolithography in semiconductor manufacturing
05/03/2007US20070099424 Reduction of mechanical stress on pattern specific geometries during etch using double pattern layout and process approach
05/03/2007US20070098890 Lowering dielectric constant of insulating film formed by chemical vapor deposition, where process gas containing hydrogen atoms is supplied into reaction vessel, and microwave is introduced into vessel to supply uniform electromagnetic wave, thereby generating plasma containing hydrogen radical
05/03/2007US20070098527 Equipment storage for substrate processing apparatus
05/03/2007US20070096658 Method and apparatus for an improved upper electrode plate in a plasma processing system
05/03/2007US20070095791 Substrate processing apparatus and substrate processing method
05/03/2007US20070095789 Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoring
05/03/2007US20070095788 Method of controlling a chamber based upon predetermined concurrent behavoir of selected plasma parameters as a function of selected chamber paramenters
05/03/2007US20070095786 Selective reactive ion etching of wafers
05/03/2007US20070095477 Plasma processing apparatus
05/03/2007US20070095476 Plasma discharger
05/03/2007US20070095289 Heat treatment apparatus
05/03/2007US20070094867 Bond Surface Conditioning System for Improved Bondability
05/02/2007EP1780748A1 Group III-nitride layers with patterned surfaces
05/02/2007EP1780309A1 Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
05/02/2007CN2895432Y Furnace hearth of annealing section for zinc-plating production line
05/02/2007CN1957449A Electroconductive pattern, manufacturintg method for electronic device and electronic device
05/02/2007CN1957111A Improved micro-fluid ejection assemblies
05/02/2007CN1314084C Etching method, etching apparatus, and method for manufacturing semiconductor device
05/01/2007US7211333 Electroconductive aluminum film with uneven portions on its front face and an electroformed electroconductive layer (especially Ni) on its back face with a continuously changing compounding ratio of Al to electroconductive metal from front face to back face; used for making light guides for LCDs
05/01/2007US7211154 Electrode-built-in susceptor
05/01/2007US7210424 High-density plasma processing apparatus
04/2007
04/26/2007WO2007047055A2 Reaction chamber with opposing pockets for gas injection and exhaust
04/26/2007WO2005098091B1 A method of plasma etch endpoint detection using a v-i probe diagnostics
04/26/2007US20070093061 Solvent removal of photoresist mask and gold impregnated residue and process
04/26/2007US20070090094 Polishing with a composition of an abrasive, hydrogen peroxide, an organic acid, a heterocyclic compound, a phosphonic acid, and water
04/26/2007US20070090093 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, control program and computer storage medium
04/26/2007US20070090092 Method and device for removing layers in some areas of glass plates
04/26/2007US20070090090 Dry etching method
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