Patents for C23F 1 - Etching metallic material by chemical means (16,062)
09/2007
09/25/2007US7273266 Micro-fluid ejection assemblies
09/20/2007WO2006068971A3 Sequentially alternating plasma process parameters to optimize a substrate
09/20/2007US20070218698 Plasma etching method, plasma etching apparatus, and computer-readable storage medium
09/20/2007US20070218691 Plasma etching method, plasma etching apparatus and computer-readable storage medium
09/20/2007US20070215573 Method for forming a resist pattern of magnetic device
09/20/2007US20070215285 Adjustable height PIF probe
09/20/2007US20070215284 Plasma processing apparatus and electrode assembly for plasma processing apparatus
09/20/2007US20070215283 Lightweight, more stable formulation to suppress a blast anddispersion of a radioactive material-containing device usedin an atgreater expansion ratio tack of terrorism; cellulose ether, two anionic surfactants, foaming agent, foam stabilizer, solvent, and alcohol; logistics; expansion ratio > AFC-380
09/20/2007US20070215282 Plasma processing apparatus
09/20/2007US20070215279 Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
09/20/2007DE102006012296A1 Etching process, for producing finely-structured printed circuit boards, uses etching solution containing copper chloride, iron chloride and hydrochloric acid, exhausted solution being treated in regeneration cell after adding more copper
09/19/2007EP1833684A2 Selective surface texturing through the use of random application of thixotropic etching agents
09/19/2007CN101039743A Filter for purifying hydrogen and method for manufacture thereof
09/19/2007CN101039553A Improved adhesion of polymeric materials to metal surfaces
09/19/2007CN101038863A Method and apparatus for processing workpiece
09/19/2007CN101037772A Chemical removing method of ion-plating TiAlN coating on stainless steel substrate
09/18/2007US7271096 Method for improved deposition of dielectric material
09/18/2007US7270764 Applying caustic solution then nitric acid; without damage to base metal from used turbine engine blade having a metal-based substrate and an aluminide coating
09/18/2007US7270763 Anisotropic wet etching of silicon
09/18/2007US7270715 Chemical vapor deposition apparatus
09/18/2007US7270713 Tunable gas distribution plate assembly
09/18/2007US7270533 System for creating a turbulent flow of fluid between a mold and a substrate
09/13/2007WO2007102923A2 Methods and arrangement for implementing highly efficient plasma traps
09/13/2007WO2005108641A3 Multi-workpiece processing chamber
09/13/2007US20070210030 Method of patterning conductive structure
09/13/2007US20070209759 Plasma etching apparatus and plasma etching method
09/13/2007US20070209686 Apparatus for cleaning chamber using gas separation type showerhead
09/12/2007EP1831430A2 An in-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber
09/12/2007EP1831427A1 Method of manufacturing a component part of a turbine and a component of a turbine
09/12/2007CN101034044A Preparation method for metallic phase sample of 1060 aluminium plate and MB3 magnesium alloy palate join
09/12/2007CN101033550A Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment
09/12/2007CN101033549A 蚀刻液组合物 Etchant compositions
09/11/2007US7268083 Plasma etching apparatus and plasma etching process
09/11/2007US7267755 Multilater; dielectric and electroconductive layers
09/11/2007US7267742 Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
09/11/2007US7267741 Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
09/11/2007US7267725 Thin-film deposition apparatus
09/11/2007US7267724 Thin-film disposition apparatus
09/07/2007WO2007100933A2 Etch selectivity enhancement, deposition quality evaluation, structural modification and three-dimensional imaging using electron beam activated chemical etch
09/07/2007WO2007068193A8 A process for recovering and recycling of waste ammoniacal alkaline copper etchant by using metallic aluminum
09/06/2007US20070205181 Substrate processing method
09/06/2007US20070205180 Nanoimprint lithography having solvent-free liquid polymer resist
09/06/2007US20070205179 Manufacturing method of liquid crystal display device
09/06/2007US20070204958 Plasma processing apparatus
09/06/2007US20070204957 Plasma processing of large workpieces
09/06/2007US20070204794 Method and apparatus for an improved baffle plate in a plasma processing system
09/06/2007DE102006003608A1 Process to recover high-purity silicon material from laser etching in polycrystalline form
09/06/2007DE102006003605A1 Process to recover high-purity silicon material from laser etching in polycrystalline form
09/05/2007EP1827731A2 Methods for manufacturing endodontic instruments
09/05/2007CN101030488A Production of electrolytic capacitor pure aluminum negative-electrode foil
09/05/2007CN101030485A Low-voltage anode foil pretreatment
09/05/2007CN100336182C Etching liquid reproducing method, etching method and system
09/05/2007CN100336143C Method for removing residual copper of aluminium corroding foil surface of negative electrode for aluminium electrolytic capacitor
09/04/2007US7264742 Method of planarizing a surface
09/04/2007US7264740 cleaning and drying the metal or alloy surfaces, then etching to remove defects on the surface, rinsing with water and coating with corrosion inhibitors; surface treatment
09/04/2007US7264688 Plasma reactor apparatus with independent capacitive and toroidal plasma sources
09/04/2007US7264677 Process for treating solid surface and substrate surface
09/04/2007US7264676 Plasma apparatus and method capable of adaptive impedance matching
09/04/2007CA2306235C Gas treating solution corrosion inhibitor
08/2007
08/30/2007WO2007098071A2 Process tuning gas injection from the substrate edge
08/30/2007WO2007096095A2 Etching solution and method for structuring a ubm layer system
08/30/2007US20070202700 Etch methods to form anisotropic features for high aspect ratio applications
08/30/2007US20070199658 Integrated capacitive and inductive power sources for a plasma etching chamber
08/30/2007US20070199657 Apparatus and method for plasma etching
08/30/2007CA2642206A1 Electrode for a contact start plasma arc torch and contact start plasma arc torch employing such electrodes
08/29/2007EP1753896B1 Method and system for selectively coating or etching surfaces
08/29/2007CN101026201A Method for making irregularly surfaced substrate and method for fabricating photovoltaic device
08/29/2007CN101024882A Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same
08/28/2007US7261830 Applying imprinting material to substrates employing electromagnetic fields
08/28/2007US7261826 Electrostatic actuator for microelectromechanical systems and methods of fabrication
08/28/2007US7261825 Method for the production of a micromechanical device, particularly a micromechanical oscillating mirror device
08/28/2007US7261824 Method of fabrication of a microfluidic device
08/23/2007WO2007093284A1 Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
08/23/2007WO2006055937A8 Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical systems
08/23/2007US20070197040 Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium
08/23/2007US20070197039 Anisotropic etching method
08/23/2007US20070197033 High aspect ratio contacts
08/23/2007US20070193978 Methods for forming banks and organic thin film transistors comprising such banks
08/23/2007US20070193977 Plasma etching methods using nitrogen memory species for sustaining glow discharge
08/23/2007US20070193976 Plasma processing apparatus and plasma processing method
08/23/2007US20070193975 Using positive DC offset of bias RF to neutralize charge build-up of etch features
08/23/2007US20070193973 Infinitely selective photoresist mask etch
08/23/2007US20070193688 Process tuning gas injection from the substrate edge
08/23/2007US20070193520 Lift pin calibrator and method of setting position of lift pin using the same
08/23/2007US20070193517 Plasma generation apparatus and work processing apparatus
08/23/2007US20070193516 Plasma generation apparatus and work processing apparatus
08/23/2007US20070193515 Apparatus for generating remote plasma
08/22/2007EP1820884A1 Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
08/22/2007CN2936196Y Metal magnesium implanted rack capable of absorbing
08/22/2007CN101023508A Improved method and apparatus for the etching of microstructures
08/22/2007CN101023201A Apparatus for the optimization of atmospheric plasma in a plasma processing system
08/22/2007CN101023197A 晶片加热器组件 Wafer heater assembly
08/22/2007CN101022912A Portable arc-seeded microwave plasma torch
08/22/2007CN101021011A Dry etching method, fine structure formation method, mold and mold fabrication method
08/22/2007CN101021010A Dry etching method, fine structure formation method, mold and mold fabrication method
08/21/2007US7259833 Substrate support method
08/21/2007US7258834 Methods and devices for modifying a substrate surface
08/21/2007US7258810 In-situ oxidized textured surfaces for prosthetic devices and method of making same
08/21/2007US7258809 Including selectively etching an exposed portion of the top magnetic layer, and underlying portions of the tunnel barrier and the pinned bottom magnetic film layer using an etchant solution containing an arylsulfonic acid and an aliphatic or alicyclic amine.
08/21/2007US7258806 Method of fabricating a diaphragm of a capacitive microphone device
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