Patents for C23F 1 - Etching metallic material by chemical means (16,062)
01/2008
01/01/2008US7314526 Reaction chamber for an epitaxial reactor
12/2007
12/27/2007WO2007149694A2 Apparatuses, systems and methods for rapid cleaning of plasma confinement rings with minimal erosion of other chamber parts
12/27/2007WO2007149210A2 Gas injection to etch a semiconductor substrate uniformly
12/27/2007US20070298551 Fabrication of silicon nano wires and gate-all-around MOS devices
12/27/2007US20070295690 Method of Plasma Etching Transition Metal Oxides
12/27/2007US20070295686 Methods of forming semiconductor constructions, light-conducting conduits, and optical signal progapation assemblies
12/27/2007US20070295600 Wet chemical processing chambers for processing microfeature workpieces
12/27/2007US20070295356 In-situ method to reduce particle contamination in a vacuum plasma processing tool
12/26/2007EP1339625B1 Throughput enhancement for single wafer reactor
12/26/2007CN101094938A Window protector for sputter etching of metal layers
12/26/2007CN101094933A A method and apparatus for semiconductor processing
12/26/2007CN101092697A Fluid for removing vacuum plating aluminum on nonmetallic surface
12/26/2007CN101092696A Fluid for removing vacuum metallic coated nickel layer for decorating nonmetallic surface
12/26/2007CN100358098C Semiconductor arts piece processing device
12/26/2007CN100358097C Semiconductor technology processing system and method
12/25/2007US7313462 Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
12/25/2007US7312160 Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
12/25/2007US7311857 Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device
12/21/2007WO2007146803A2 Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
12/21/2007WO2006098888A3 Plasma oxidation and removal of oxidized material
12/21/2007WO2006068971B1 Sequentially alternating plasma process parameters to optimize a substrate
12/20/2007US20070293043 Edge gas injection for critical dimension uniformity improvement
12/20/2007US20070292710 Method for repairing components using environmental bond coatings and resultant repaired components
12/20/2007US20070292077 Beam steering element with built-in detector and system for use thereof
12/20/2007US20070289945 Dissolving an anodized film on an Al substrate with an acid or alkali using no electrical current to form ordered pores, anodizing, and dissolving the anodized film to form an ordered array of pits; hexavalent chromium-free
12/20/2007US20070289944 Method for engraving a golf club head
12/20/2007US20070289943 Block copolymer mask for defining nanometer-scale structures
12/20/2007US20070289710 Apparatuses, systems and methods for rapid cleaning of plasma confinement rings with minimal erosion of other chamber parts
12/20/2007US20070289533 Plasma processing apparatus and plasma processing method
12/19/2007CN101090998A Multi-gas distribution injector for chemical vapor deposition reactors
12/18/2007US7309448 Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
12/18/2007US7309395 System for forming composite polymer dielectric film
12/13/2007WO2007143301A2 Controlled zone microwave plasma system
12/13/2007WO2007143127A1 Potassium monopersulfate solutions
12/13/2007WO2007109356A3 Device and method for etching flash memory gate stacks comprising high-k dielectric
12/13/2007WO2006119251A3 Ultrathin porous nanoscale membranes, methods of making, and uses thereof
12/13/2007WO2006113808A3 Methods of making and modifying porous devices for biomedical applications
12/13/2007US20070287297 Plasma etching method, plasma processing apparatus, control program and computer readable storage medium
12/13/2007US20070287295 Adaptively Plasma Source And Method Of Processing Semiconductor Wafer Using The Same
12/13/2007US20070286967 Plasma processing apparatus and plasma processing method
12/13/2007US20070284337 Etching method, plasma processing system and storage medium
12/13/2007US20070284335 Etching method and etching apparatus
12/13/2007US20070284045 Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
12/13/2007US20070284043 Plasma processing apparatus and cleaning method thereof
12/13/2007US20070283891 Table for supporting substrate, and vacuum-processing equipment
12/13/2007US20070283884 Ring assembly for substrate processing chamber
12/13/2007CA2652151A1 Potassium monopersulfate solutions
12/12/2007EP1447461B1 Product and method for cleaning titanium surfaces
12/12/2007CN101088148A Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance
12/11/2007US7307013 Nonselective unpatterned etchback to expose buried patterned features
12/11/2007US7306748 Methods for machining ceramics
12/11/2007US7305935 Slotted antenna waveguide plasma source
12/11/2007US7305934 Plasma treatment apparatus and plasma generation method
12/06/2007WO2007140377A2 A novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide
12/06/2007WO2007137412A1 Nanoporous material
12/06/2007WO2006080977A3 Method and apparatus for cleaning and surface conditioning objects with plasma
12/06/2007US20070281491 Residue free hardmask trim
12/06/2007US20070281479 Process including silo-chloro passivation for etching tungsten silicide overlying polysilicon
12/06/2007US20070281478 Plasma processing method and apparatus
12/06/2007US20070281477 Process for etching tungsten silicide overlying polysilicon particularly in a flash memory
12/06/2007US20070281448 Novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide
12/06/2007US20070278184 Cyanide-free chemical-mechanical polishing (CMP); useful for polishing a gold-containing surface of a substrate; abrasive, a gold-oxidizing agent, gold-solubilizing agent, and an aqueous carrier
12/06/2007US20070278179 Radiation sensitive self-assembled monolayers and uses thereof
12/06/2007US20070277931 Semiconductor substrate processing apparatus, method, and medium
12/06/2007US20070277861 Wafer thinning apparatus and wafer treating system
12/05/2007EP1523586B1 In-line demetallization process for flexible metallized substrates
12/05/2007CN101084573A Fine processing treatment agent and fine processing treatment method using same
12/05/2007CN101083289A Method for processing surface oxidation film of mercury cadmium telluride film material
12/05/2007CN100353485C Method and system for analyzing data from a plasma process
12/05/2007CN100353484C Method for adjusting voltage on a powered faraday shield
12/04/2007US7303998 Plasma processing method
12/04/2007US7303690 Microlens forming method
12/04/2007US7302910 Plasma apparatus and production method thereof
12/04/2007CA2283850C Method for manufacturing a stent
11/2007
11/29/2007WO2006039133A3 Cluster tool process chamber having integrated high pressure and vacuum chambers
11/29/2007US20070275560 Method of manufacturing semiconductor device
11/29/2007US20070272656 Method for forming contact hole on semiconductor device
11/29/2007US20070272654 Method for Manufacturing Circuit Board
11/29/2007US20070272358 Method and apparatus for etching a structure in a plasma chamber
11/29/2007US20070272356 Multipe zone carrier head with flexible membrane
11/29/2007US20070272355 Apparatus for processing substrate and method of doing the same
11/28/2007EP1446514A4 Electropolishing assembly and methods for electropolishing conductive layers
11/28/2007CN200981894Y Spraying type label etching machine
11/28/2007CN101078121A Basic etching solution and producing method
11/28/2007CN101078120A Etching solution for preparing grating in semiconductor laser and preparation method thereof
11/28/2007CN101078114A Magnesium alloy surface chemistry transformation treatment technique
11/28/2007CN100351998C Method of surface texturizing
11/27/2007US7301692 Micro mirror and method for fabricating the same
11/27/2007US7301238 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
11/27/2007US7300854 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
11/27/2007US7300597 Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
11/22/2007WO2007133356A1 Method for forming self-aligned metal silicide contacts
11/22/2007WO2006038975A3 Method and system for improving coupling between a surface wave plasma source and a plasma space
11/22/2007US20070269748 Method for manufacturing an array of interferometric modulators
11/22/2007US20070269721 partially etching a carbon layer through a pattern in a photoresist silicon layer in an oxygen plasma, the oxygen ions in the plasma react with silicon in the photoresist to form a surface layer of silica on the photoresist and etching the remaining carbon layer in a hydrogen ion plasma; process control
11/22/2007US20070267143 In situ cleaning of CVD system exhaust
11/22/2007US20070266948 Device for Controlling Electron Temperature in an Ecr Plasma
11/22/2007US20070266947 Plasma generating device
11/22/2007DE102006022722A1 Verfahren zur Herstellung eines Pressbleches oder eines Endlosbandes A method for producing a press plate or an endless belt
11/21/2007CN101076456A Method and device for regulating a set of plasma treatment step
1 ... 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 ... 161