| Patents for C23F 1 - Etching metallic material by chemical means (16,062) |
|---|
| 04/22/2008 | US7361287 Method for etching structures in an etching body by means of a plasma |
| 04/22/2008 | US7361285 Method for fabricating cliche and method for forming pattern using the same |
| 04/22/2008 | US7361228 Showerheads for providing a gas to a substrate and apparatus |
| 04/22/2008 | US7361016 Temperature control assembly for use in etching processes and an associated retrofit method |
| 04/17/2008 | WO2008043876A1 Method for measuring the active koh concentration in a koh etching process |
| 04/17/2008 | US20080090417 showerhead electrode assembly for processing semiconductor substrates; prevent aluminum fluoride formation; gas passages are positioned and sized such that they are misaligned at ambient temperature, concentric at high temperature; non-uniform shear stresses |
| 04/17/2008 | US20080089774 A method and apparatus for semconductor processing |
| 04/17/2008 | US20080087641 Components for a plasma processing apparatus |
| 04/17/2008 | US20080087633 Method for forming a metal line and method for manufacturing display substrate having the metal line |
| 04/17/2008 | US20080087381 Matching network characterization using variable impedance analysis |
| 04/16/2008 | CN101164121A Plasma oxidation and removal of oxidized material |
| 04/16/2008 | CN100382237C Vacuum treatment device |
| 04/15/2008 | US7359177 Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output |
| 04/15/2008 | US7358192 Method and apparatus for in-situ film stack processing |
| 04/15/2008 | US7357879 Cupric chloride solution and triazole compound; capable of forming an etching-inhibiting coating; nonuniform irregularities formed on the side wall of the circuit pattern by the etching improves the adhesion between the circuit pattern and an insulating resin layer covering the circuit pattern |
| 04/15/2008 | US7357878 Etchant, and method for fabricating a thin film transistor subtrate including conductive wires using the etchant and the resulting structure |
| 04/15/2008 | US7357874 Staggered vertical comb drive fabrication method |
| 04/15/2008 | US7357873 Polymide thin film self-assembly process |
| 04/15/2008 | US7357846 Substrate processing apparatus and substrate processing method |
| 04/10/2008 | WO2007100933A3 Etch selectivity enhancement, deposition quality evaluation, structural modification and three-dimensional imaging using electron beam activated chemical etch |
| 04/10/2008 | US20080083703 Method of plasma processing |
| 04/10/2008 | US20080083701 Oxygen conditioning of plasma vessels |
| 04/10/2008 | US20080083700 Method and Apparatus for Maximizing Cooling for Wafer Processing |
| 04/10/2008 | US20080083697 Porous silicon composite structure as large filtration array |
| 04/10/2008 | US20080083618 System and Methods for Determining an Analyte Concentration Incorporating a Hematocrit Correction |
| 04/10/2008 | US20080083501 Substrate processing apparatus |
| 04/09/2008 | EP1907596A1 Injection type plasma treatment apparatus and method |
| 04/09/2008 | CN101160207A Metal layered product, its manufacturing method and application |
| 04/09/2008 | CN101158052A Alkaline etching solution for semiconductor wafer and alkaline etching method |
| 04/09/2008 | CN100380628C Production method of semiconductor component and plug |
| 04/09/2008 | CN100380605C Plasma processing apparatus and method, and electrode plate for plasma processing apparatus |
| 04/09/2008 | CN100380599C 抛光装置及基片处理装置 A polishing apparatus and a substrate processing apparatus |
| 04/09/2008 | CN100380564C Method and apparatus for an improved baffle plate in a plasma processing system |
| 04/09/2008 | CN100379898C Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 04/09/2008 | CN100379897C Mask forming method, mask forming functional layer, dry etching method, and method of manufacturing an information recording medium |
| 04/09/2008 | CN100379896C Chemical processing method and chemical processing device |
| 04/08/2008 | US7354869 Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method |
| 04/08/2008 | US7354523 Methods for sidewall etching and etching during filling of a trench |
| 04/08/2008 | US7354500 Mask and apparatus using it to prepare sample by ion milling |
| 04/08/2008 | US7353863 Method of surface treating aluminum alloy base body of heat exchanger and heat exchanger produced by the method |
| 04/03/2008 | US20080081173 Aluminum substrate is subjected to a first film dissolution treatment for dissolving up to 20 wt % of the anodized layer, followed by an anodizing treatment and a second film dissolution treatment |
| 04/03/2008 | US20080079777 Droplet Ejection Head And Method Of Manufacturing The Same |
| 04/03/2008 | US20080078746 Substrate processing system, gas supply unit, method of substrate processing, computer program, and storage medium |
| 04/03/2008 | US20080078745 RF Coil Plasma Generation |
| 04/03/2008 | US20080078744 High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation |
| 04/03/2008 | US20080078743 Elevated temperature chemical oxide removal module and process |
| 04/03/2008 | US20080078742 Method of preparing a sample for transmission electron microscopy |
| 04/03/2008 | US20080078506 RF Coil Plasma Generation |
| 04/03/2008 | US20080078504 Self-Calibrating Optical Emission Spectroscopy for Plasma Monitoring |
| 04/02/2008 | CN101153395A Metal removing solution and metal removing method using the same |
| 04/02/2008 | CN101153388A Plating liquid for electroless zinc plating for magnesium alloy |
| 04/02/2008 | CN101152820A Technique for producing multicolor pattern on stainless steel surface |
| 04/02/2008 | CN100378924C Plasma etching reactor |
| 04/02/2008 | CN100378911C Process for titanium nitride removal |
| 04/01/2008 | USH2212 Method and apparatus for producing an ion-ion plasma continuous in time |
| 04/01/2008 | US7352266 Head electrode region for a reliable metal-to-metal contact micro-relay MEMS switch |
| 04/01/2008 | US7351354 comprising orthoperiodic acid, hydrofluoric acid and water; for removing tungsten and forming a film on semiconductor substrate; free of sulfuric acid; demetallization |
| 04/01/2008 | US7351353 Method for roughening copper surfaces for bonding to substrates |
| 04/01/2008 | US7351349 Method and apparatus for real-time dynamic chemical analysis |
| 04/01/2008 | US7351346 Non-photolithographic method for forming a wire grid polarizer for optical and infrared wavelengths |
| 04/01/2008 | US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure |
| 04/01/2008 | US7351292 Assembly for processing substrates |
| 04/01/2008 | US7351291 Semiconductor processing system |
| 03/27/2008 | US20080073321 Method of patterning an anti-reflective coating by partial etching |
| 03/27/2008 | US20080073031 Method and apparatus for semiconductor processing |
| 03/26/2008 | EP1901983A2 Load port module |
| 03/26/2008 | CN101148765A Silicon chip etching method |
| 03/26/2008 | CN101148764A Steel ring repairing technique |
| 03/26/2008 | CN100377315C Silicon gate etching method |
| 03/26/2008 | CN100377314C Method for removing residual polymer in polysilicon etching technology |
| 03/26/2008 | CN100377308C Particle-removing process before semiconductor etching |
| 03/26/2008 | CN100377301C Gas injection and diffusion system |
| 03/26/2008 | CN100377300C Reaction chamber for semiconductor treatment |
| 03/26/2008 | CN100376721C Chemical etching solution for molybdenum |
| 03/20/2008 | WO2008033928A2 Electron beam enhanced surface wave plasma source |
| 03/20/2008 | US20080070327 Plasma processing method and plasma processing apparatus |
| 03/20/2008 | US20080069966 A protective film of oxides of aluminum and yttrium formed on an inner wall surface of the chamber and the internal exposed surfaces of the apparatus for processing semiconductor wafers; high-corrosion resistance and dielectric property; etching resistance; spraying yttrium, aluminum and amorphous garnet |
| 03/20/2008 | US20080067148 Peracetic acid; stabilizer; organic acid of acetic, citric, oxalic, and/or tartaric acid; inorganic acid of sulfuric, nitric, hydrochloric, and/or phosphoric acid; salt and water; thin film transistor liquid crystal displays; one step; damage prevention; eliminates Galvanic effect |
| 03/20/2008 | US20080067147 Processing apparatus and processing method |
| 03/20/2008 | US20080066867 Semiconductor etching apparatus |
| 03/20/2008 | US20080066866 Method and apparatus for reducing plasma-induced damage in a semiconductor device |
| 03/20/2008 | US20080066865 Device and process for liquid treatment of wafer-shaped articles |
| 03/20/2008 | US20080066862 Substrate holding apparatus and substrate polishing apparatus |
| 03/20/2008 | US20080066861 Plasma processing chamber with an apparatus for measuring set of electrical characteristics in a plasma |
| 03/20/2008 | US20080066860 Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION |
| 03/20/2008 | US20080066779 Removing the palladium metal layer using a cerium (IV) nitrate salt |
| 03/20/2008 | US20080066679 Processing system and plasma generation device |
| 03/19/2008 | EP1899111A2 Integrated chemical mechanical polishing composition and process for single platen processing |
| 03/19/2008 | CN101145522A Gas injection device |
| 03/19/2008 | CN101144181A Film formation apparatus for semiconductor process and method for using the same |
| 03/19/2008 | CN101144163A Air separation device |
| 03/18/2008 | US7344998 Wafer recovering method, wafer, and fabrication method |
| 03/18/2008 | US7344988 Alumina abrasive for chemical mechanical polishing |
| 03/18/2008 | CA2460520C Metal-containing web processed with a continuous etch process |
| 03/13/2008 | WO2008031031A2 Cartesian cluster tool configuration for lithography type processes |
| 03/13/2008 | US20080061033 processing method of a polymer product is provided. This method first supplies a gas to an atmospheric pressure plasma machine to generate an ionized gas. Then, bombard the ionized gas to the surface of the polymer product to create a surface reaction. Afterwards, a dying treatment or electroplating |
| 03/13/2008 | US20080061032 Electrostatic chuck cleaning during semiconductor substrate processing |
| 03/13/2008 | US20080061030 Methods for patterning indium tin oxide films |
| 03/13/2008 | US20080061026 Gimbal-less micro-electro-mechanical-system tip-tilt and tip-tilt-piston actuators and a method for forming the same |
| 03/13/2008 | US20080060760 Radial line slot antenna having a conductive layer |