Patents for C23F 1 - Etching metallic material by chemical means (16,062)
08/2008
08/06/2008CN100409132C Method and device for treating objects by means of a liquid
08/05/2008US7407821 Substrate processing method
08/05/2008US7406925 Plasma processing method and apparatus
07/2008
07/31/2008US20080182424 Method for selectively controlling lengths of nanowires
07/31/2008US20080182421 Substrate processing method and substrate processing apparatus
07/31/2008US20080182414 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device
07/31/2008US20080182412 Configurable bevel etcher
07/31/2008US20080182079 Etching and hole arrays
07/31/2008US20080180824 Optical device, method of manufacturing the same, replica substrate for producing optical device, and method of producing the same
07/31/2008US20080179613 Silicon Deflector on a Silicon Submount For Light Emitting Diodes
07/31/2008US20080179292 Substrate processing method and substrate processing apparatus
07/31/2008US20080179291 Process for wafer backside polymer removal and wafer front side photoresist removal
07/31/2008US20080179290 Temperature-switched process for wafer backside polymer removal and front side photoresist strip
07/31/2008US20080179289 Process for wafer backside polymer removal with a plasma stream
07/31/2008US20080179288 Process for wafer backside polymer removal and wafer front side scavenger plasma
07/31/2008US20080179287 Process for wafer backside polymer removal with wafer front side gas purge
07/31/2008US20080179286 Dielectric plasma chamber apparatus and method with exterior electrodes
07/31/2008US20080179283 Plasma etching method and plasma etching apparatus
07/31/2008US20080179279 Method for Electrochemical Fabrication
07/31/2008US20080179011 Plasma reactor with wide process window employing plural vhf sources
07/31/2008US20080179010 Bevel etcher with vacuum chuck
07/31/2008US20080179007 Reactor for wafer backside polymer removal using plasma products in a lower process zone and purge gases in an upper process zone
07/31/2008US20080179005 Plasma processing apparatus and control method thereof
07/31/2008US20080178925 Thin film solar cell module of see-through type and method for fabricating the same
07/31/2008US20080178906 Bare aluminum baffles for resist stripping chambers
07/30/2008EP1950799A1 Method for production of nano-porous substrate
07/30/2008EP1950326A1 Method for removal of bulk metal contamination from III-V semiconductor substrates
07/30/2008CN101231943A Plasma processing apparatus and method
07/30/2008CN101230462A Etching liquid and method for manufacturing printed circuit board
07/30/2008CN101230461A Acid etching solution used for copper or copper alloy surface and surface treatment method
07/30/2008CN100407380C 等离子体处理设备以及设计等离子体处理设备的方法 The method of plasma processing apparatus and plasma processing apparatus designed
07/30/2008CN100406619C Electrolytic recycling device
07/29/2008US7405521 Multiple frequency plasma processor method and apparatus
07/29/2008US7405189 Surface treatment composition and method for removing Si component and reduced metal salt produced on the aluminum die cast material in etching process
07/29/2008US7404910 Etching solution, etched article and method for etched article
07/29/2008US7404874 Method and apparatus for treating wafer edge region with toroidal plasma
07/24/2008WO2008088831A2 Coiled circuit device with active circuitry and methods for making the same
07/24/2008WO2007146803A3 Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
07/24/2008WO2007089374A3 Method and apparatus for handling and aligning glass substrates
07/24/2008US20080176403 Method of polishing a layer and method of manufacturing a semiconductor device using the same
07/24/2008US20080176344 Feature Dimension Control in a Manufacturing Process
07/24/2008US20080176149 Endpoint detection for photomask etching
07/24/2008US20080174204 Electromechanical element, electric circuit device and production method of those
07/24/2008US20080174046 Capillary Imprinting Technique
07/24/2008US20080173403 Plasma stabilization method and plasma apparatus
07/24/2008US20080173401 Plasma etching apparatus
07/24/2008US20080173400 Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method
07/24/2008DE102007004060A1 Ätzlösung und Ätzverfahren Etching and etching
07/23/2008EP1947217A1 Method of removing an alpha-case titanium layer from a beta-phase titanium alloy
07/23/2008EP1946358A2 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
07/23/2008EP1689907A4 Plasma production device and method and rf driver circuit with adjustable duty cycle
07/23/2008EP1629522A4 Gas distribution system
07/23/2008CN101228288A Injection type plasma processing apparatus and method thereof
07/23/2008CN101227121A Production technology of oscillation ring
07/23/2008CN101225520A Printed circuit etching liquid
07/23/2008CN101225486A Copper-based in-situ composite material and preparation method thereof
07/23/2008CN101225473A Treatment method and system for etching liquid
07/23/2008CN100405559C Substrate etching method and etching disposal device
07/23/2008CN100405556C Method for controlling key size deviation in chip etching technology
07/22/2008US7402259 Chemical-mechanical polishing methods
07/22/2008US7402210 Apparatus and method for hybrid chemical processing
07/17/2008US20080169412 Investment casting cores and methods
07/17/2008US20080169270 Removing a surface layer of titanium alloy alpha-phase precipitation to expose a core having titanium alloy beta-phase with hydrofluoric acid, and a second solution having nitric acid; no smut formation
07/17/2008US20080169267 Solution for removing aluminum oxide film and method for surface treatment of aluminum or aluminum alloy
07/17/2008US20080169065 Plasma processing apparatus and plasma processing method
07/17/2008US20080168650 Thermal Type Fluid Flow Sensor and Manufacturing Method Thereof
07/17/2008DE10128507B4 Verwendung einer Vorrichtung zum chemischen oder elektrochemischen Bearbeiten von Bauteilen Use of a device for chemical or electrochemical machining components
07/16/2008CN101220476A Environment protection regeneration method for tin-stripping solution
07/16/2008CN101219417A Gas injection apparatus
07/16/2008CN101219416A Gas refiller
07/16/2008CN100402702C Single-acid micro adding device and method
07/15/2008US7400096 Large area plasma source
07/15/2008US7399713 Selective treatment of microelectric workpiece surfaces
07/15/2008US7399422 System and method for forming nanodisks used in imprint lithography and nanodisk and memory disk formed thereby
07/10/2008WO2008083329A2 Precision oscillator having linbus capabilities
07/10/2008WO2008082923A2 Methods and apparatus for wafer edge processing
07/10/2008WO2008081933A1 Metal/resin composite and process for producing the same
07/10/2008US20080166545 Radiation curable maskant and line sealer for protecting metal substrates
07/10/2008US20080164472 Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
07/10/2008US20080164239 Triangular nanoframes and method of making same
07/10/2008US20080163893 Substrate cleaning processes through the use of solvents and systems
07/09/2008CN201084711Y A chip-gripping device for a serial-press corrosion of semiconductor chips
07/09/2008CN201084710Y A semiconductor-device chip surface spray-up magnetic-adsorption local protector
07/09/2008CN100401560C Magnesium-polar board surface chemical corrosion treatment for seawater battery
07/09/2008CN100401338C Apparatus for manufacturing flat-panel display
07/08/2008US7396480 Method for front end of line fabrication
07/08/2008US7396477 Method for manufacturing a thermal interface material
07/08/2008US7396476 Method for reducing harmonic distortion in comb drive devices
07/08/2008US7396431 Plasma processing system for treating a substrate
07/08/2008US7395779 Plasma processing apparatus
07/03/2008WO2008078714A1 Metal/resin composite and process for producing the composite
07/03/2008US20080160775 Method and apparatus for processing a substrate using plasma
07/03/2008US20080156773 End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatus
07/03/2008US20080156772 Method and apparatus for wafer edge processing
07/03/2008US20080156771 Etching apparatus using neutral beam and method thereof
07/03/2008US20080156769 Advanced mixing system for integrated tool having site-isolated reactors
07/03/2008US20080156440 Surface processing apparatus
07/02/2008EP1843863A4 Method and apparatus for cleaning and surface conditioning objects with plasma
07/02/2008CN101210341A Method for producing reaming electrolyte and high specific surface area aluminum electrolytic capacitor electrode foil
07/02/2008CN100399518C Etching system and treatment of etching agent
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