Patents for C23F 1 - Etching metallic material by chemical means (16,062)
09/2008
09/11/2008DE102008010038A1 Verfahren zum Verbessern der Haftung zwischen einer Formgedächtnislegierung und einem Polymer A method for improving the adhesion between a shape memory alloy and a polymer
09/10/2008EP1967613A1 Apparatus for satinizing and finishing manufactured articles preferably made of aluminum
09/10/2008EP1966410A2 Ultrapure colloidal silica for use in chemical mechanical polishing applications
09/10/2008EP1667850A4 Methods for cleaning a set of structures comprising yttrium oxide in a plasma processing system
09/10/2008CN101263092A Methods and apparatus for the optimization of etch resistance in a plasma processing system
09/10/2008CN101262026A Method for making multi-crystal Hg iodide film room temperature nucleus emission detector
09/10/2008CN101260193A Method for improving adhesion between a shape memory alloy and a polymer
09/09/2008US7422980 Methods of positioning and/or orienting nanostructures
09/09/2008US7422696 Multicomponent nanorods
09/09/2008US7422656 Dry etching method and apparatus for use in the LCD device
09/09/2008US7422654 Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
09/09/2008US7422653 Single-sided inflatable vertical slit valve
09/09/2008US7422637 Processing chamber configured for uniform gas flow
09/04/2008WO2008106222A1 Method of plasma etching transition metal oxides
09/04/2008US20080211068 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
09/04/2008US20080210665 Polishing composition and polishing method
09/04/2008US20080210664 Method of Surface Treatment and Surface-Treated Article
09/04/2008US20080210660 Medium For Etching Oxidic, Transparent, Conductive Layers
09/04/2008US20080210378 Plasma Reactor Having Multiple Antenna Structure
09/04/2008US20080210377 Uniform etch system
09/04/2008US20080210376 Plasma processing apparatus capable of controlling plasma emission intensity
09/04/2008US20080210270 Removing unwanted film from wafer edge region with reactive gas jet
09/04/2008US20080210269 Removing unwanted film from wafer edge region with reactive gas jet
09/04/2008US20080209703 Piezoelectric vibrators, piezoelectric devices comprising same, and methods for producing same
09/03/2008EP1332241B1 Electrostatically clamped edge ring for plasma processing
09/03/2008CN101256953A Semiconductor substrate surface chemical processing method apparatus
09/03/2008CN101254138A Micropore processing method of bone repairing body rough surface
09/03/2008CN100416771C Combined wet etching method and system for stacked films
09/03/2008CN100416758C Method for releasing chip static electricity thoroughly in chip etching equipment
09/03/2008CN100415934C High-purity alkali etching solution for silicon wafers and alkali etching method for silicon wafers
09/02/2008US7419911 high polishing efficiency, uniformity, and removal rate, and leaves a high quality polish with minimal surface defects; uses an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid; abrasives
08/2008
08/28/2008WO2008103456A2 Pulsed plasma system with pulsed sample bias for etching semiconductor structures
08/28/2008WO2008103454A2 Pulsed plasma system for etching semiconductor structures
08/28/2008WO2008102172A1 Photovoltaic device and manufacturing method therefor
08/28/2008US20080207468 Micro-fabricated stamp array for depositing biologic diagnostic testing samples on bio-bindable surface
08/28/2008US20080206684 Method for forming ring pattern
08/28/2008US20080206562 Methods of generating supported nanocatalysts and compositions thereof
08/28/2008US20080204713 Methods and Apparatus for Label-Independent Monitoring of Biological Interactions on Sensitized Substrates
08/28/2008US20080204693 Substrate Support Method
08/28/2008US20080203060 etching silicon nitride using water, a phosphorus compound, a boron compound, a silicon compound and/or their fluorides, and optionally nitric acid, with no precipitation of silicon oxide
08/28/2008US20080203058 Substrate developing method and developing apparatus
08/28/2008US20080203056 Methods for etching high aspect ratio features
08/28/2008US20080203053 Method for manufacturing magnetic recording medium, stamper, transferring apparatus, and method for forming resin mask
08/28/2008US20080202562 for removing copper from a surface, comprising polyphosphonic acid, hydroxyl-substituted primary amine, and water; for cleaning gun bores; effective in removing copper and other deposits without flammable solvents or ammonia
08/27/2008CN100413999C Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
08/26/2008US7416681 Etching solution for multiple layer of copper and molybdenum and etching method using the same
08/26/2008US7416677 Exhaust assembly for plasma processing system and method
08/26/2008US7416676 Plasma etching method and apparatus, control program for performing the etching method, and storage medium storing the control program
08/26/2008US7416634 Method and apparatus for processing nanoscopic structures
08/26/2008US7416633 Plasma processing apparatus
08/26/2008US7416632 Substrate processing apparatus and substrate processing method
08/26/2008US7415940 Plasma processor
08/21/2008WO2008098593A1 Titanium etchant composition
08/21/2008US20080200028 Methods of positioning and/or orienting nanostructures
08/21/2008US20080199767 Corrosion-resistant interconnects for fuel cells
08/21/2008US20080197110 Pulsed-plasma system with pulsed sample bias for etching semiconductor substrates
08/21/2008US20080197109 Etch pattern definition using a CVD organic layer as an anti-reflection coating and hardmask
08/20/2008EP1957207A1 Method of enhancing biocompatibility of elastomeric materials by microtexturing using microdroplet patterning
08/20/2008CN101248215A Batch deposition tool and compressed boat
08/20/2008CN101247700A Stirring type wet process machine and stirring type wet process
08/20/2008CN101246780A Production method of low pressure formed foil
08/20/2008CN101246779A Production method of medium and high pressure formed foil
08/20/2008CN101245462A Etching liquid composition and etching method
08/20/2008CN101244803A Method for producing alloy phase change material nano-dot matrix
08/20/2008CN100412697C Method for manufacturing substrate for discrete track recording media and method for manufacturing discrete track recording media
08/19/2008US7413673 Method for adjusting voltage on a powered Faraday shield
08/19/2008US7413628 Substrate treatment method and substrate treatment apparatus
08/19/2008US7413612 In situ substrate holder leveling method and apparatus
08/19/2008CA2413640C Process for rejuvenating a diffusion aluminide coating
08/19/2008CA2406430C Method for removing metal cladding from airfoil substrate
08/14/2008WO2008097670A1 Multi-zone gas distribution system for a treatment system
08/14/2008WO2008048240A3 Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition
08/14/2008US20080194111 Removal of process residues on the backside of a substrate
08/14/2008US20080193739 Fabrication of composite materials using atomic layer deposition
08/14/2008US20080190894 Chemical Mechanical Polishing Slurries, Their Applications and Method of Use Thereof
08/14/2008US20080190893 Plasma processing method and plasma processing apparatus
08/14/2008US20080190890 Method for forming mask for using dry-etching and method for forming fine structure pattern
08/14/2008US20080190886 Differential etch rate control of layers deposited by chemical vapor deposition
08/14/2008US20080190557 Apparatus for real-time dynamic chemical analysis
08/14/2008US20080190482 Process for Manufacturing Pieces of a Foil Having an Inorganic Coating
08/14/2008US20080190307 Pattern transcription device and method of fabricating cliche for the same
08/14/2008DE102007006151A1 Verfahren zur Verringerung und Homogenisierung der Dicke einer Halbleiterschicht, die sich auf der Oberfläche eines elektrisch isolierenden Materials befindet A process for the reduction and homogenization of the thickness of a semiconductor layer which is located on the surface of an electrically insulating material
08/13/2008EP1606431B1 Solution for etching copper surfaces and method of depositing metal on copper surfaces
08/13/2008CN101241844A In-situ dry clean chamber for front end of line fabrication
08/13/2008CN100410357C Cleaning composition for semiconductor components and process for manufacturing semiconductor device
08/12/2008US7410590 Transferable micro spring structure
08/12/2008US7410552 Electron cyclotron resonance equipment with variable flare angle of horn antenna
08/12/2008CA2277048C Method of removing reactive metal from a metal-coated reactor system
08/07/2008WO2008094752A1 Processing chamber with heated chamber liner
08/07/2008WO2008063980A3 Independent radiant gas preheating for precursor disassociation control and gas reaction kinetics in low temperature cvd systems
08/07/2008US20080188013 In-situ dose monitoring using optical emission spectroscopy
08/07/2008US20080185364 Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium
08/07/2008US20080185286 Semiconductor wafers; rigid copper segment; exterior edge and carbon support film; thinning using ion beams; better adjustment of sample in carrier; transporting with electrically charging glass needle
08/07/2008US20080185105 Apparatus for defining regions of process exclusion and process performance in a process chamber
08/07/2008US20080185103 Control of Critical Dimensions of Etched Structures on Semiconductor Wafers
08/07/2008US20080185102 Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (cmp) slurry
08/06/2008CN101238242A Stabilized etching solutions for cu and cu/ni layers
08/06/2008CN101235503A Method for preparing natural gas conveying pipeline inner wall corrosion inhibitor
08/06/2008CN101235502A Screen printing carbon electrode pretreatment method
08/06/2008CN101235501A Corrosion solution for polycrystal ''carbon head material'' silicon carbon separation and preparation method thereof
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