Patents for C23F 1 - Etching metallic material by chemical means (16,062)
11/2008
11/18/2008US7452473 Laser marking of raw aluminum anode foil to induce uniform patterning etching
11/18/2008US7452443 Vacuum plasma generator
11/18/2008US7452423 Diffusion system
11/13/2008WO2008137433A1 Crystalline film devices, apparatuses for and methods of fabrication
11/13/2008WO2007008677A3 Load port module
11/13/2008US20080280756 Nano-skeletal catalyst
11/13/2008US20080277381 Etching Solutions
11/13/2008US20080277380 applying a magnetic field to a doped Si substrate in contact with an etchant, etching the substrate with the etchant while relative movement occurs between the substrate and the magnetic field; during etching, the charge carriers move relative to the substrate and magnetic field, etching forms porosity
11/13/2008US20080277377 Masking material for dry etching
11/13/2008US20080277064 Plasma processing apparatus
11/12/2008EP1989343A2 Etching solution and method for structuring a ubm layer system
11/12/2008CN100432294C High petential magnesium alloy sacrificial anode material and its manufacturing method
11/11/2008US7449214 Process for the preparation of solid oxide fuel cell
11/11/2008US7449124 Method of polishing a wafer
11/11/2008US7449071 Wafer holder with peripheral lift ring
11/06/2008WO2008134446A1 Annular baffle
11/06/2008WO2008133296A1 Stainless steel complex and its manufacturing method
11/06/2008WO2008133096A1 Magnesium alloy compound material, and its manufacturing method
11/06/2008WO2008133030A1 Titanium alloy compound material, and its jointing method
11/06/2008WO2007038514B1 Apparatus and method for substrate edge etching
11/06/2008DE102007006151B4 Verfahren zur Verringerung und Homogenisierung der Dicke einer Halbleiterschicht, die sich auf der Oberfläche eines elektrisch isolierenden Materials befindet A process for the reduction and homogenization of the thickness of a semiconductor layer which is located on the surface of an electrically insulating material
11/05/2008EP1730324B1 Process for recovering caustic soda solutions from pickling of aluminium extrusion dies
11/05/2008CN100431113C Etching liquid recovering system and method
11/04/2008US7445690 Plasma processing apparatus
11/04/2008US7445689 Substrate processing method and substrate processing system
11/04/2008US7445119 Chip receptacle, method for fabricating a chip receptacle and chip transport container
11/04/2008US7444739 Method for fabricating improved sensor for a magnetic head utilizing reactive ion milling process
10/2008
10/30/2008WO2008130894A1 Low temperature curing acrylate and maleimide based formulations and methods for use thereof
10/30/2008WO2008130078A1 Stainless steel separator for fuel cell and the manufacturing method thereof
10/30/2008WO2008129891A1 Composition for etching and method of etching
10/30/2008WO2007140421A3 Process chamber for dielectric gapfill
10/30/2008WO2007103902A3 Notched deposition ring
10/30/2008US20080268645 Method for front end of line fabrication
10/30/2008US20080268288 Spinodally Patterned Nanostructures
10/30/2008US20080264905 Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
10/30/2008US20080264904 Methods to eliminate "m-shape" etch rate profile in inductively coupled plasma reactor
10/30/2008US20080264903 Method of producing an article having patterned decorative coating
10/30/2008US20080264902 Method of forming a thin film pattern and method of fabricating a liquid crystal display device
10/30/2008US20080264897 Turbine component pattern forming method
10/30/2008US20080264567 Dry etching method and apparatus for performing dry etching
10/29/2008EP1729978A4 Method of dry plasma etching semiconductor materials
10/29/2008EP1633823B1 Process for etching a metal or alloy surface
10/29/2008CN101297396A Palladium-selective etching solution and method for controlling etching selectivity
10/29/2008CN100429079C Method for manufacturing droplet ejection head, droplet ejection head, and droplet ejection apparatus
10/28/2008US7442336 Capillary imprinting technique
10/28/2008US7442324 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/28/2008US7442275 Lateral temperature equalizing system for large area surfaces during processing
10/28/2008US7442274 Plasma etching method and apparatus therefor
10/28/2008US7442273 Apparatus using hybrid coupled plasma
10/28/2008US7442272 Apparatus for manufacturing semiconductor device
10/28/2008US7442271 Miniature microwave plasma torch application and method of use thereof
10/23/2008WO2008109207A9 Methods and devices for biomolecular arrays
10/23/2008WO2008103456A3 Pulsed plasma system with pulsed sample bias for etching semiconductor structures
10/23/2008WO2007140426A9 Process chamber for dielectric gapfill
10/23/2008US20080261149 3-hydroxy-1-methacryloyloxy-adamantane-2-acryloyloxypropyl phthalate copolymer; exposing layer of a photosensitive etching resistance material on a substrate made of semiconductor or quartz glass, heating, development, fluoric acid etching
10/23/2008US20080261059 Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same
10/23/2008US20080257864 Methods and devices to reduce defects in dielectric stack structures
10/23/2008US20080257863 Plasma processing apparatus and method for stabilizing inner wall of processing chamber
10/23/2008US20080257862 Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator
10/23/2008US20080257498 Plasma processing apparatus
10/23/2008US20080257496 Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium
10/23/2008US20080257495 Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium
10/23/2008US20080257494 Substrate processing apparatus
10/22/2008CN201136897Y Near-etched etching machine for circuit board
10/22/2008CN101288863A Conveyer belt of substrate material
10/21/2008US7439188 Reactor with heated and textured electrodes and surfaces
10/21/2008US7438822 Apparatus and method for shielding a wafer from charged particles during plasma etching
10/21/2008US7438765 Adjustable shielding plate for adjusting an etching area of a semiconductor wafer and related apparatus and methods
10/21/2008US7438018 Confinement ring assembly of plasma processing apparatus
10/16/2008WO2008020974A3 Method and apparatus for single-sided etching
10/16/2008US20080254469 Method for Regenerating Hydrophilic and Osteophilic Surface of an Implant
10/16/2008US20080254291 Apparatus, Method and Computer Program Product Providing Radial Addressing of Nanowires
10/16/2008US20080253928 Substrate for Biochip and Method for Manufacturing Substrate for Biochip
10/16/2008US20080251208 Plasma Treatment Apparatus
10/16/2008DE102006017995B4 Galvanisierungsverfahren für Aluminiumlegierungsmaterial Plating process for aluminum alloy material
10/15/2008EP1666136B1 Microreactor including magnetic barrier
10/15/2008CN101287860A Sequentially alternating plasma process parameters to optimize a substrate
10/15/2008CN101287849A Functional member from co-based alloy and process for producing the same
10/15/2008CN101284438A High mesh size print cylinder mould production method
10/15/2008CN100425734C Surface treatment method of Mg alloy
10/14/2008US7435926 Methods and array for creating a mathematical model of a plasma processing system
10/14/2008US7434537 Device for the coating of objects
10/09/2008WO2005114719A3 Method of forming a recessed structure employing a reverse tone process
10/09/2008US20080248266 Method of manufacturing laminated material for security tag
10/09/2008US20080248240 Cavity electroluminescent devices and methods for producing the same
10/09/2008US20080248182 if the carrier openings have a rounded cross-section an improved mechanical strength is obtained; increased further by embodying the carrier openings with a very low surface roughness of smaller than 3 micrometres
10/09/2008US20080245771 Method for processing a surface
10/09/2008US20080245769 Nanoparticles and method of making thereof
10/09/2008US20080245768 Solidifying the printed etch-resist ink carrier vehicle including one or more preferably two metal chelating compounds by cooling and then removing the exposed metal or alloy by chemical etching; the ink has a viscosity of not greater than 30 cPs (mPa*s) at the firing temperature
10/09/2008US20080245765 Electrical contacts
10/09/2008US20080245764 Method for producing a device including an array of microneedles on a support, and device producible according to this method
10/09/2008US20080245478 Surface treatment apparatus
10/09/2008US20080245389 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/09/2008US20080245388 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/09/2008US20080245387 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/08/2008EP1978133A1 Coating removal from turbine components via tumble strip
10/08/2008CN101280425A Method for non-phosphate electroless nickel plating on silicon nanowires
10/08/2008CN101279108A Method for preparing titanium-base/silicon-substituted hydroxyapatite biological coating
10/08/2008CN100424831C Electroconductive pattern, manufacturintg method for electronic device and electronic device
10/08/2008CN100424814C Vacuum processing device
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