C23F 1 - Etching metallic material by chemical means

Patents for C23F 1 - Etching metallic material by chemical means (16,062)
12/2004
12/16/2004	WO2004073893A3 Gas gate for isolating regions of differing gaseous pressure
12/16/2004	US20040251518 Method of reducing wafer contamination by removing under-metal layers at the wafer edge
12/16/2004	US20040251229 Manufacturing method for membrane member
12/15/2004	CN1555510A Etching method and composition for forming etching protective layer
12/15/2004	CN1180459C Etching composition and use thereof
12/14/2004	US6830653 Generating plasma in vacuum; controlling distribution
12/14/2004	US6830651 Load port capable of coping with different types of cassette containing substrates to be processed
12/14/2004	US6830629 Method for treating brass
12/14/2004	US6830627 Copper cleaning compositions, processes and products derived therefrom
12/14/2004	US6830007 Apparatus and method for forming low dielectric constant film
12/09/2004	WO2004106437A1 Process
12/09/2004	WO2004063083A3 Apparatus for transfer of an array of liquids and methods for manufacturing same
12/09/2004	US20040245110 Overcoating substrate with film; electrolysis plating; overlapping film; preferential removing segments of film; wet etching
12/09/2004	US20040244912 Method and apparatus for photomask fabrication
12/09/2004	US20040244910 Generating a multihydrated hydronium ion agitating water to reduce cluster size, mixing with sulfuric acid, adding a solution containing Ca3+ ions, removing precipitated Ca sulfate, cooling to form a slush, filtering out ice from the slush, distilling free water from the remaining liquid, which is H9O4+
12/09/2004	US20040244823 Cleaning solution and cleaning method of a semiconductor device
12/09/2004	US20040244817 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
12/09/2004	DE10360969A1 Verfahren zum Trockenätzen eines mehrlagigen Schichtmaterials A method for dry etching of a multilayer coating material
12/07/2004	US6828249 System and method for enhanced monitoring of an etch process
12/07/2004	US6828167 Method for manufacturing a thin film transistor for a liquid crystal display
12/07/2004	US6827871 Ruthenium and ruthenium dioxide removal method and material
12/07/2004	US6827870 Method and apparatus for etching and deposition using micro-plasmas
12/07/2004	US6827789 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
12/02/2004	WO2004104269A1 Method for recovering copper from a used ammoniacal etching solution and for regenerating an ammonium salt
12/02/2004	US20040242445 Surface treatment composition and method for removing si component and reduced metal salt produced on the aluminum die cast material in etching process
12/02/2004	US20040242005 Method of etching metal layers
12/02/2004	US20040242000 Etchant and array substrate having copper lines etched by the etchant
12/02/2004	US20040241554 Substrate having first index of refraction and level of transmittance to a wavelength of light; second portions of substrate are impregnated with dope; opaque layer rising above planar upper surface; image resolution
12/02/2004	US20040238492 Planarization with reduced dishing
12/02/2004	US20040238491 Fine-dimension masks and related processes
12/02/2004	US20040238486 Improve etching resistance of photoresist; forming protection layer which is insoluble in water containing developer; finer pattern formation
12/02/2004	US20040238483 Reducing corrugated edge pattern range and skirt spreading length variation; can employ aluminum metal or alloy and brazing filler bonding; utilizing acid free ferric chloride and water
12/02/2004	US20040238481 Rotating wafer chuck with sufficient speed that electrolyte fluid flows towards edge; eliminates unwanted metal removal and overpolishing
12/02/2004	US20040238370 Producing high density device; electroless copper deposition of etchable seed insulating layer, photolithographically producing resist pattern and electrolytically plating etch resistant copper layer
12/02/2004	US20040238125 Plasma processing device
12/02/2004	DE10320679A1 Process for treating a workpiece, especially a substrate for a mask for producing semiconductor elements, comprises using water in a super-critical state
12/01/2004	EP1482771A2 Metal/ceramic circuit board and method for producing same
12/01/2004	CN1550893A Solidified resin pattern forming method
12/01/2004	CN1550575A Method of dry-etching a multi-layer film material
12/01/2004	CN1177954C Micro etching agent for copper or copper alloy micro-etching method with same, and method for mfg. printed circuit plate
11/2004
11/25/2004	WO2004103040A2 Method for coating blanks for the production of printed circuit boards (pcb)
11/25/2004	WO2004102307A2 Method and system for monitoring and control of a chamber process
11/25/2004	WO2004101116A1 Method and reactor arrangement for reducing the emission of nitrogen oxides
11/25/2004	US20040235308 Substrate treatment method and sustrate treatment apparatus
11/25/2004	US20040231794 Substrate processing apparatus and method
11/25/2004	CA2525576A1 Method and reactor arrangement for reducing the emission of nitrogen oxides
11/24/2004	CN1549874A Method for removing at least one area of a layer of a component consisting of metal or a metal compound
11/24/2004	CN1549311A Equipment and method for etching silicon nitride thin film
11/24/2004	CN1548580A Hydrogen peroxide soaking process for separating waste zinc containing nickel alloy sheet
11/23/2004	US6821901 Method of through-etching substrate
11/23/2004	US6821452 Etchant
11/23/2004	US6821450 Substrate and method of forming substrate for fluid ejection device
11/23/2004	US6821447 Friction member and a method for its surface treatment
11/23/2004	US6821404 Copper recovery process
11/18/2004	WO2004100247A1 Plasma etching chamber and plasma etching system using same
11/18/2004	WO2004087281A9 Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system
11/18/2004	US20040229409 Method for fabricating nanometer gate in semiconductor device using thermally reflowed resist technology
11/18/2004	US20040227864 Thin film transistor for liquid crystal display and method of manufacturing the same
11/18/2004	US20040226913 Preparing a porous silicon structure having a surface terminated with hydrogen atoms; organic thermal processing with reactants having unsaturated group or nucleophilic center for stabilization of structure
11/18/2004	US20040226814 Electron beam processing for mask repair
11/17/2004	EP1477849A2 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
11/17/2004	EP1477141A1 Surface treatment process for implants made of titanium alloy
11/17/2004	CN1547680A An etchant for a wire, a method for manufacturing the wire and a method for manufacturing a thin film transistor array panel including the method
11/17/2004	CN1547243A Wet etching method for lead zirconate titanate ferroelectric film
11/17/2004	CN1547242A Two-stage step structured wet chemical corrosion method for silicon semiconductor device
11/16/2004	US6818964 Selectively-etched nanochannel electrophoretic and electrochemical devices
11/16/2004	US6818142 Potassium hydrogen peroxymonosulfate solutions
11/11/2004	WO2004097895A2 A method of adding mass to mems structures
11/11/2004	WO2004027840A3 Process for etching silicon wafers
11/11/2004	US20040224518 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
11/11/2004	US20040224509 Method to remove copper without pattern density effect
11/11/2004	US20040222190 Plasma processing method
11/11/2004	US20040222185 a combination of a gas containing a carbonyl group, a gas with a halogen element, and an electron donating gas is used as an etching gas; better etching rate and anisotropy
11/11/2004	US20040221957 Method system and computer readable medium for monitoring the status of a chamber process
11/10/2004	EP1474811A1 Etching solution for forming an embedded resistor
11/10/2004	EP1165861B1 Copper recovery process
11/10/2004	CN1545722A Plasma reactor coil magnet
11/09/2004	US6815357 Process and apparatus for manufacturing a semiconductor device
11/04/2004	US20040219340 Method of adding mass to MEMS structures
11/04/2004	US20040217085 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
11/04/2004	US20040216841 Substrate processing apparatus
11/03/2004	EP0706582B9 Improved compositions and methods for polishing
11/03/2004	CN2652949Y Multiipurpose laser electrochemical micro producing device
11/03/2004	CN1543672A Use of ammonia for etching organic low-K dielectrics
11/03/2004	CN1542550A Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
10/2004
10/28/2004	WO2004092440A1 Method for forming porous thin film
10/28/2004	US20040211441 Water solution using in metal surface treating process and process for removing oxidized film and burred edge using the same
10/27/2004	CN1540036A Method for regenerating etching waste fluid of iron protochloride of containing nickel
10/26/2004	US6809039 Method for forming a silicide layer
10/26/2004	US6808646 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
10/26/2004	US6808641 Method of wiring formation and method for manufacturing electronic components
10/26/2004	US6808590 Method and apparatus of arrayed sensors for metrological control
10/21/2004	WO2004089817A1 Potassium hydrogen peroxymonosulfate solutions
10/21/2004	US20040209172 Defect correction method for a photomask
10/21/2004	US20040206455 Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
10/21/2004	US20040206029 Door skin, a method of etching a plate, and an etched plate formed therefrom
10/21/2004	CA2517511A1 Potassium hydrogen peroxymonosulfate solutions
10/20/2004	EP1274881A4 Surface treatment method for magnesium alloys and magnesium alloy members thus treated
10/20/2004	CN1537971A Electroplating pretreatment solution and electroplating pretreatment method
10/20/2004	CN1172024C Iron trichloride etching liquid controlling method during etching Fe-Ni alloy plate shadow mask

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