Patents for C23F 1 - Etching metallic material by chemical means (16,062)
01/2005
01/27/2005WO2004083485A3 Methods and apparatus for atomic layer deposition
01/27/2005WO2004067292A3 A door skin, a method of etching a plate for forming a wood grain pattern in the door skin, and an etched plate formed therefrom
01/27/2005WO2004030049A3 A method and system for etching high-k dielectric materials
01/27/2005US20050020081 Etchant composition for molybdenum and method of using same
01/27/2005US20050020078 Method of planarizing a surface
01/27/2005US20050016961 Etchant, replenishment solution and method for producing copper wiring using the same
01/27/2005US20050016958 Cleaning process and apparatus for silicate materials
01/27/2005US20050016956 Methods and apparatus for cycle time improvements for atomic layer deposition
01/27/2005US20050016952 System and method of altering a very small surface area by multiple channel probe
01/26/2005EP1500719A1 Etchant, replenishment solution and method for producing copper wiring using the same
01/26/2005CN2673883Y Specimen desk of reaction ion etching machine
01/26/2005CN1570212A Etching solution of copper or copper alloy and method for producing electronic substrate using the solution
01/26/2005CN1186801C Process improvements for titanium-tungsten alloy etching in presence of connecting solder project of electroplated control sagging chip
01/26/2005CN1186213C Substrate treatment method
01/25/2005US6846427 Dry etching method and apparatus for use in the LCD device
01/25/2005US6846424 Plasma-assisted dry etching of noble metal-based materials
01/25/2005US6846401 Method of plating and pretreating aluminium workpieces
01/20/2005US20050011863 Method for inspecting a titanium-based component
01/20/2005US20050011454 Liner for use in processing chamber
01/20/2005US20050011400 Adhesion of copper electroconductive layer and dielectric materials; mixture of corrosion inhibitor, acid and alcohol
01/19/2005EP1498731A2 Method for inspecting a titanium-base component
01/19/2005EP1498513A1 Process for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode and process for producing electrode material for electrolytic capacitor
01/19/2005EP0801606B1 Method for treating a surface
01/19/2005CN1566401A Regeneration method for ferric chloride etching solution containing nickel
01/19/2005CN1566400A Silver alloy etching solution
01/19/2005CN1185615C Etching liquid for indium oxide tin film
01/19/2005CN1185367C Regeneration method for etching waste liquid containing iron chloride
01/18/2005US6844304 Storage stability; reduced formation of nitrous fumes; coatings for heat treated stainless steel; removing oxides
01/18/2005US6844132 Positive photosensitive compositions
01/18/2005US6843929 Accelerated etching of chromium
01/18/2005US6843928 Removing titanium cladding that is adhered to a turbine (fan) blade via etching with hydrofluoric acid
01/18/2005US6843880 Enhanced endpoint detection for wet etch process control
01/13/2005US20050009213 Substrate processing method and apparatus
01/13/2005US20050008945 plasma/dry etching; photolithographic reticle; oxygen-free gas etches anti-reflective coating and patterned photoresistive material; integrated circuits
01/13/2005US20050008360 Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate
01/13/2005US20050006346 Method for providing uniform removal of organic material
01/13/2005US20050006341 Interferometric endpoint detection in a substrate etching process
01/13/2005US20050006340 Method for preventing formation of photoresist scum
01/13/2005US20050006254 Using aqueous solution containing base; monitoring variations in potentials
01/13/2005US20050006205 Transporting device for a vertical-type thin circuit board etching machine
01/13/2005US20050006027 of wafers; circuit with a variable capacitor that sets the initial phase angle of the measurement circuit to about zero and alters the phase angle; improved detection under noisy conditions
01/13/2005US20050006026 Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate
01/13/2005US20050005948 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads
01/12/2005EP1496543A1 Polishing device and substrate processing device
01/12/2005EP1496141A1 Transporting device for a vertical-type thin circuit board etching machine
01/12/2005EP1495803A1 Process for leaching of aluminum alloys
01/12/2005EP1095172B1 Method of stripping a coating from a rotary seal of an aircraft engine
01/12/2005CN1565049A 抛光装置及基片处理装置 A polishing apparatus and a substrate processing apparatus
01/12/2005CN1564310A Appts. for silicon anisotropic corrosion
01/12/2005CN1563493A Etching solution of tetramethyl ammonium hydroxide in use for etching silicon, and preparation method
01/12/2005CN1184362C Electrochemical corrosion of high-tin solder ridge
01/12/2005CN1184352C Convex angle compensation method of crystal orientation on silicon by potassium hydroxide solution
01/12/2005CN1184351C Upper sacrificial layer processing method
01/11/2005US6841084 Etching solution for forming an embedded resistor
01/06/2005WO2005001160A1 Method for manufacturing water appliance made from copper alloy containing lead
01/06/2005WO2005000363A2 Atmospheric pressure non-thermal plasma device to clean and sterilize the surface of probes, cannulas, pin tools, pipettes and spray heads
01/06/2005WO2004067291A3 A door skin, a method of etching a plate, and an etched plate formed therefrom
01/06/2005WO2004055855A3 Gas distribution apparatus and method for uniform etching
01/06/2005WO2004048636A3 Method of cleaning a coated process chamber component
01/06/2005US20050003676 Use of ammonia for etching organic low-k dielectrics
01/06/2005US20050000942 Using mixture of mineral acid and peroxy compound
01/06/2005US20050000936 Methods of forming patterned compositions
01/06/2005US20050000932 Multi-metal layer MEMS structure and process for making the same
01/06/2005US20050000816 Multilater; dielectric and electroconductive layers
01/06/2005US20050000653 Method and apparatus of arrayed sensors for metrological control
01/06/2005CA2528194A1 Atmospheric pressure non-thermal plasma device to clean and sterilize the surface of probes, cannulas, pin tools, pipettes and spray heads
01/05/2005DE10326767A1 Verfahren zur Regenierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben The same process for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys, as well as an apparatus for performing
01/05/2005DE10326273A1 Verfahren zur Reduzierung der Scheibenkontaminierung durch Entfernen von Metallisierungsunterlagenschichten am Scheibenrand Method for reducing the Scheibenkontaminierung by removing Metallisierungsunterlagenschichten at the wafer edge
01/04/2005US6838009 Rework method for finishing metallurgy on chip carriers
01/04/2005US6837985 External counter electrode
01/04/2005US6837966 Method and apparatus for an improved baffle plate in a plasma processing system
12/2004
12/30/2004US20040266188 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
12/30/2004US20040266049 Micro device and process for producing it
12/30/2004US20040265780 Surface treatment process for implants made of titanium alloy
12/30/2004US20040262569 Etchant for etching double-layered copper structure and method of forming array substrate having double-layered copper structures
12/30/2004US20040262367 Forming a desired fillet on the peripheral portion of a metal circuit; brazing
12/30/2004US20040262262 Process for patterning high-k dielectric material
12/30/2004US20040261944 Polishing device and substrate processing device
12/29/2004WO2003085701A3 Methods of positions and/or orienting nanostructures
12/29/2004EP1492163A2 Substrate processing method and apparatus
12/29/2004EP1491950A1 Micro device and process for producing it
12/29/2004EP1490191A1 System and method for the manufacture of surgical blades
12/23/2004WO2004112092A2 Adjustable gas distribution system
12/23/2004WO2004111308A1 Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
12/23/2004WO2004111307A1 Method and apparatus for chemical etching on laminar components
12/23/2004US20040259344 Method for forming a metal layer method for manufacturing a semiconductor device using the same
12/23/2004US20040259300 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device
12/23/2004US20040256359 Self-filling wet electrochemical cells by laser processing
12/23/2004US20040256089 Method of surface treating aluminum alloy base body of heat exchanger and heat exchanger produced by the method
12/23/2004DE10321590A1 Function layer microstructuring method, using photochemical etching of outer lacquer layer to reveal chrome protection layer which is etched before microstructuring of underlying function layer
12/22/2004EP1487646A1 Method of stripping silver from a printed circuit board
12/22/2004EP1198620A4 Methods for wet processing electronic components having copper containing surfaces
12/22/2004EP1196788B1 Merged-mask micro-machining process
12/22/2004CN1557017A 等离子体处理装置 The plasma processing apparatus
12/22/2004CN1556249A Method of making hard alloy punching mould
12/22/2004CN1555980A Method of making picture on alumnium alloy shaping product
12/22/2004CN1180750C Method for making arteria coronaria undercarriadge
12/21/2004US6833328 Method for removing a coating from a substrate, and related compositions
12/16/2004WO2004109761A2 Gas distribution system
12/16/2004WO2004108353A2 Integrated tool with interchangeable wet processing components and automated calibration systems