Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892) |
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05/26/1999 | EP0918100A1 Method and apparatus for producing homoepitaxial diamond thin film |
05/26/1999 | EP0917596A1 Method of manufacturing a semiconductor device and a device for applying such a method |
05/26/1999 | EP0917494A1 Systems and methods for the combinatorial synthesis of novel materials |
05/26/1999 | CN1217569A Formation method of aluminium film for wiring |
05/25/1999 | US5907077 Method and apparatus for treatment of freon gas |
05/25/1999 | US5906895 Thermal barrier coating member and method of producing the same |
05/25/1999 | US5906866 High speed hydrogen reduction of tungsten hexafluoride without the use of silane to form a tungsten film |
05/25/1999 | US5906861 Heating the substrate, supplying a mixture of the gases tetramethylcyclotetrasiloxane, trimethylborate, trimethylphosphite, and oxygen to vapor deposit an inorganic coatings |
05/25/1999 | US5906688 Heating to oxidize stainless steel surface preteated by purging surface moisture using anhydrous inert gas |
05/25/1999 | US5906683 Lid assembly for semiconductor processing chamber |
05/25/1999 | US5906680 Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers |
05/25/1999 | US5906670 Spraying toward substrate aerosol droplets of metal salt dissolved in volatile solvent, desolventizing and reacting droplets while airborne with gas phase reagent to form a metal or metal compound to be coated onto substrate |
05/20/1999 | WO1999025012A1 ELIMINATION OF THE TITANIUM NITRIDE FILM DEPOSITION IN TUNGSTEN PLUG TECHNOLOGY USING PE-CVD-Ti AND IN-SITU PLASMA NITRIDATION |
05/20/1999 | WO1999025006A2 Electrostatic chuck having improved gas conduits |
05/20/1999 | WO1999024637A1 Method for annealing an amorphous film using microwave energy |
05/20/1999 | WO1999024636A1 Method for applying a diamond layer on substrates made of sintered metallic carbide |
05/20/1999 | WO1999024635A1 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor |
05/20/1999 | CA2309590A1 Method for applying a diamond layer on substrates made of sintered metallic carbide |
05/19/1999 | EP0916745A1 Two piece diamond deposition mandrel having graphite ring |
05/19/1999 | EP0916635A2 Ceramic coatings containing layered porosity |
05/19/1999 | EP0730670B1 Coated body, its method of production and its use |
05/19/1999 | CN1217031A Surface alloyed high temp. alloys |
05/18/1999 | US5904958 Coating a substrate, condensation and adjustment of apertures vacuum chamber; |
05/18/1999 | US5904957 Vapour phase chemical infiltration process for densifying porous substrates disposed in annular stacks |
05/18/1999 | US5904952 Oxidation of organosilicon compound with oxygen in helium; magnetically confined; controlling gas flow |
05/18/1999 | US5904872 Heating plate formed of silica for semiconductor vapor deposition process |
05/18/1999 | US5904776 Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
05/18/1999 | US5904771 Stable evaporation rate |
05/18/1999 | US5904769 Epitaxial growth method |
05/18/1999 | US5904757 Trap apparatus |
05/18/1999 | US5904573 PE-TEOS process |
05/18/1999 | US5904567 Layer member forming method |
05/18/1999 | US5904553 Fabrication method for a gate quality oxide-compound semiconductor structure |
05/18/1999 | US5904491 Planar waveguides |
05/14/1999 | WO1999023707A1 CONSTRUCTION WITH HIGH Tc SUPERCONDUCTOR MATERIAL AND METHOD FOR PRODUCING SAID CONSTRUCTION |
05/14/1999 | WO1999023698A1 Titanium nitride contact plug formation |
05/14/1999 | WO1999023695A1 Method of plasma processing |
05/14/1999 | WO1999023691A2 Improved low mass wafer support system |
05/14/1999 | WO1999023276A1 Long life high temperature process chamber |
05/14/1999 | WO1999023275A1 Cemented carbide body with high wear resistance and extra tough behaviour |
05/14/1999 | WO1999023273A1 Coating method and device |
05/14/1999 | WO1999023042A1 Improvements in coating glass |
05/14/1999 | WO1999022878A2 Method for corrosion-resistant coating of metal substrates by means of plasma polymerisation |
05/14/1999 | CA2308480A1 Construction with high tc superconductor material and process for producing the construction |
05/12/1999 | EP0914497A1 Hard graphite-like material bonded by diamond-like framework |
05/12/1999 | EP0914496A1 Microwave applicator for an electron cyclotron resonance plasma source |
05/12/1999 | EP0914486A1 Coating substrate |
05/12/1999 | EP0843747B1 Treatment of cemented carbide substrate to receive a diamond film by CVD |
05/12/1999 | EP0693975B1 Hollow containers with inert or impermeable inner surface through plasma-assisted surface reaction or on-surface polymerization |
05/12/1999 | DE19755902C1 Plasma surface treatment process involves hollow cathode self-cleaning |
05/11/1999 | US5903106 Plasma generating apparatus having an electrostatic shield |
05/11/1999 | US5902675 Diamond film and solid diamond particle composite compositions |
05/11/1999 | US5902671 Coated with refractory alumina layer |
05/11/1999 | US5902651 Providing a gaseous tetrakisdimethylamidotitanium precursor within reactor, exposing the gaseous tetrakisdimethylamidotitanium precursor to light, causing titanium to be deposited |
05/11/1999 | US5902650 Depositing on substrate amorphous silicon based film having predetermined resistivity by chemical vapor deposition using gas mixture comprising silane, hydrogen, phosphine, nitrogen-containing gas with adjusted flow rate |
05/11/1999 | US5902649 Vacuum treatment system for homogeneous workpiece processing |
05/11/1999 | US5902640 Method of improving field emission characteristics of diamond thin films |
05/11/1999 | US5902639 Liquid delivery vaporization of a bismuth amide source reagent to form a bismuth-containing source vapor, and deposition on the substrate of bismuth from the bismuth-containing source vapor to form the bismuth layerbismuth-containing material |
05/11/1999 | US5902638 Method for producing spallation-resistant protective layer on high performance alloys |
05/11/1999 | US5902563 The energies of particles are limited by selecting frequency, pressure, magnetic field and electric bias to the deposition region and chemical vapor depositing the diamond from the plasma source |
05/11/1999 | US5902494 Method and apparatus for reducing particle generation by limiting DC bias spike |
05/11/1999 | US5902407 Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
05/11/1999 | US5902406 Low pressure CVD system |
05/11/1999 | US5902405 Plasma processing apparatus |
05/11/1999 | US5902403 Method and apparatus for cleaning a chamber |
05/11/1999 | US5902369 Carbon coated metallic mold for making a glass plate |
05/11/1999 | US5902103 Vertical furnace of a semiconductor manufacturing apparatus and a boat cover thereof |
05/06/1999 | WO1999022165A1 Gas panel |
05/06/1999 | WO1999022043A1 New deposition systems and processes for transport polymerization and chemical vapor deposition |
05/06/1999 | WO1999021932A1 Low dielectric constant materials with improved thermal and mechanical properties |
05/06/1999 | WO1999021924A1 Precursors for making low dielectric constant materials with improved thermal stability |
05/06/1999 | WO1999021706A1 Low dielectric constant materials prepared from photon or plasma assisted cvd |
05/06/1999 | WO1999014787A3 Method for producing plasma by microwave irradiation |
05/06/1999 | EP0913496A1 High-temperature spray coated member and method of production thereof |
05/06/1999 | EP0912775A1 Process for coating the interior wall of a container |
05/06/1999 | EP0912460A1 Densification of a porous structure (iii) |
05/06/1999 | EP0912459A1 Densification of a porous structure (i) |
05/06/1999 | EP0912279A1 Diamond coated cutting member and method of making the same |
05/06/1999 | EP0787221A4 Platinum aluminide cvd coating method |
05/06/1999 | DE19748240A1 Verfahren zur korrosionsfesten Beschichtung von Metallsubstraten mittels Plasmapolymerisation A process for the corrosion-resistant coating of metal substrates by means of plasma |
05/06/1999 | DE19747813A1 Element used in manufacture of electronic components |
05/06/1999 | DE19727432A1 Growth substrate holder has a heat conductive screen for providing uniform temperature distribution |
05/06/1999 | CA2307663A1 Gas panel |
05/05/1999 | CN1216015A Abrasive body |
05/05/1999 | CN1215764A Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
05/04/1999 | US5901271 Process of evaporating a liquid in a cyclone evaporator |
05/04/1999 | US5900699 Plasma generator with a shield interposing the antenna |
05/04/1999 | US5900498 Single source metal imido-amido-amine precursors prepared by the reaction of a pentavalent or tetravalent metal halide with a primary amine or hydrazine |
05/04/1999 | US5900297 Friction disk with an annular porous structure with a vapor deposited binding matrix; simultanious processing of large quantities of aircraft brake disks |
05/04/1999 | US5900290 Method of making low-k fluorinated amorphous carbon dielectric |
05/04/1999 | US5900289 Method of producing a colorating coating |
05/04/1999 | US5900288 Method for improving substrate adhesion in fluoropolymer deposition processes |
05/04/1999 | US5900285 Method of making a vessel having a wall surface having a barrier coating |
05/04/1999 | US5900279 Processes for the chemical vapor deposition and solvent used for the processes |
05/04/1999 | US5900161 Apparatus and method for detecting end point of post treatment |
05/04/1999 | US5900105 Wafer transfer system and method of using the same |
05/04/1999 | US5900103 Plasma treatment method and apparatus |
05/04/1999 | US5900065 Apparatus for the plasma-chemical deposition of polycrystalline diamond |
05/04/1999 | US5900064 Plasma process chamber |
05/04/1999 | US5899720 Process of fabricating salicide structure from high-purity reproducible cobalt layer without sacrifice of leakage current and breakdown voltage of P-N junction |