Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
04/2001
04/04/2001EP1089325A2 Support frame for substrates
04/04/2001EP1089319A1 Uniform gas distribution in large area plasma treatment device
04/04/2001EP1088874A1 Moisture insensitive electroluminescent phosphor
04/04/2001EP1088332A2 Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber
04/04/2001EP1088331A1 Cleaning process end point determination using throttle valve position
04/04/2001EP1088330A1 Cvd apparatus and process for depositing titanium films
04/04/2001EP1088329A1 Method and apparatus for stabilising a plasma
04/04/2001EP1088118A1 Method for applying a lubricating layer on an object and object with an adhesive lubricating layer
04/04/2001EP1088116A1 Method for applying a coating system to surfaces
04/04/2001EP1087857A1 Diamond cutting tool
04/04/2001EP0852628B1 Process chamber with inner support
04/04/2001EP0848658A4 Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
04/04/2001EP0839217A4 A plasma enhanced chemical processing reactor and method
04/04/2001CN1290309A Organocuprous precursors for chemical vapor deposition of copper film
04/04/2001CN1290308A Plasma reactor with a deposition shield
04/04/2001CN1289866A Process for growing gallium nitride and its compound film
04/04/2001CN1289860A Chemical vapor phase deposition apparatus, its purification and apparatus for manufacturing semiconductors
04/04/2001CN1289816A Humidity insensitive electroluminescent phosphor
04/03/2001US6212059 Capacitor including barium strontium titanate film
04/03/2001US6211495 Temperature control system for a thermal reactor
04/03/2001US6211082 Chemical vapor deposition of tungsten using nitrogen-containing gas
04/03/2001US6211081 Method of manufacturing a semiconductor device in a CVD reactive chamber
04/03/2001US6211080 Repair of dielectric-coated electrode or circuit defects
04/03/2001US6211072 Fabricating a titanium nitride layer on an underlying structure. tetrakis-dimethyl-amino-titanium vapor is decomposed to deposit a layer containing titanium nitride,
04/03/2001US6211066 Electronic devices with barium barrier film and process for making same
04/03/2001US6211065 Method of depositing and amorphous fluorocarbon film using HDP-CVD
04/03/2001US6211043 Thermal decomposition of a metal organic compound and a solar cell using the above thin film, metal sulfide thin films of high purity, density and quality for photoelectric devices or solarcells
04/03/2001US6210813 Disrupted grain structure and smaller grain sizes; increases the resistance of the material to stress cracks in subsequent thermal processing and reduces the overall residual stress of the material
04/03/2001US6210754 Providing level-adjusting devices mounted on heater platform, wherein the turning of one or more of the level-adjusting devices allows positioning of the heater platform relative to the lower surface of the shower head; integrated circuits
04/03/2001US6210749 Applying fillerless coating formulation comprising hydrogen silsesquioxane resin onto substrate to form film; heating film in inert or oxygen containing atmosphere to produce insoluble coating free of cracks; depositing silicon dioxide layer
04/03/2001US6210745 Method of quality control for chemical vapor deposition
04/03/2001US6210592 Deposition of resistor materials directly on insulating substrates
04/03/2001US6210487 Disposable seal system with integral buffer
04/03/2001US6210486 CVD film forming method in which a film formation preventing gas is supplied in a direction from a rear surface of an object to be processed
04/03/2001US6210485 Chemical vapor deposition vaporizer
04/03/2001US6210483 Anti-notch thinning heater
04/03/2001US6210482 Apparatus for feeding gases for use in semiconductor manufacturing
04/03/2001US6209484 Method and apparatus for depositing an etch stop layer
04/03/2001US6209483 Apparatus and method for removing silicon dioxide residues from CVD reactors
04/03/2001US6209482 Large area microwave plasma apparatus with adaptable applicator
04/03/2001US6209221 Wafer rack provided with a gas distribution device
04/03/2001US6209220 Apparatus for cooling substrates
04/03/2001CA2196589C Titanium nitride doped with boron, substrate coating based on this new compound, with good hardness conferring very good resistance to wear, and parts bearing such a coating
03/2001
03/29/2001WO2001022479A1 Gas distribution apparatus for semiconductor processing
03/29/2001WO2001022478A1 Semiconductor processing equipment having radiant heated ceramic liner
03/29/2001WO2001022471A1 Semiconductor processing equipment having tiled ceramic liner
03/29/2001WO2000070117A8 Low-temperature compatible wide-pressure-range plasma flow device
03/29/2001DE19945299A1 Plasmabeschichtungsverfahren und dreidimensionales Kunststoffsubstrat mit einer metallhaltigen Beschichtung auf der Kunststoffoberfläche Plasma coating method, and three-dimensional plastic substrate having a metal-containing coating on the plastic surface
03/29/2001DE10046052A1 Zuführung von flüssigen Vorläufern zu Halbleiterbearbeitungsreaktoren Introduction of liquid precursors to semiconductor processing reactors
03/28/2001EP1087437A2 A multistep chamber cleaning process using a remote plasma that also enhances film gap fill
03/28/2001EP1087430A2 A method and apparatus for integrating a metal nitride film in a semiconductor device
03/28/2001EP1087426A2 Integrated method and apparatus for forming an enhanced capacitor
03/28/2001EP1087036A1 Method and apparatus for observing porous amorphous film, and method and apparatus for forming the same
03/28/2001EP1087035A1 Method and apparatus for formation of thin film
03/28/2001EP1087034A1 Plasma coating method and three dimentional coated substrate
03/28/2001EP1086489A1 Chemical vapor deposition fabrication of hybrid electrodes for ferroelectric device structures
03/28/2001EP1086482A1 Gas distribution system
03/28/2001EP1086481A1 Chamber having improved process monitoring window
03/28/2001EP1086355A1 Ellipsometric method and control device for making a thin-layered component
03/28/2001EP1086260A1 Oxygen-argon gas mixture for precleaning in vacuum processing system
03/28/2001EP1086259A1 A method and apparatus for forming a ti doped ta2o5 layer
03/28/2001CN1289405A Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
03/28/2001CN1288975A Alpha-SiCoF film as insulating dielectric with low dielectric constant and its preparation
03/27/2001US6208453 Oriented niobate ferroelectric thin films for electrical and optical devices
03/27/2001US6208234 Resistors for electronic packaging
03/27/2001US6208033 A memory, comprising a memory array, control circuit and address logic, having contact(s) made by reacting titanium tetrachloridesilane to hydrogen to form titanium silicide
03/27/2001US6207937 Temperature control system for a thermal reactor
03/27/2001US6207844 Thin films
03/27/2001US6207590 Flowing silane into the process chamber; flowing n2o into the process chamber; generating a rf signal at a first predetermined power at a first frequency; and generating a rf signal at a second predetermined power at a second frequency.
03/27/2001US6207589 Method of forming a doped metal oxide dielectric film
03/27/2001US6207586 Oxide/nitride stacked gate dielectric and associated methods
03/27/2001US6207585 Method of forming stacked insulating film and semiconductor device using the same
03/27/2001US6207558 For improved via fill in high aspect ratio sub-micron apertures at low temperature, particularly at the contact level on a substrate.
03/27/2001US6207489 Dielectric film includes a first dielectric layer deposited at a first temperature selected from a designated temperature range, and a second dielectric layer deposited at a second temperature different from the first temperature
03/27/2001US6207487 Method for forming dielectric film of capacitor having different thicknesses partly
03/27/2001US6207305 Corrosion-resistant members against a chlorine-based gas
03/27/2001US6207304 Substrate with ammonia-free silicon oxynitride passivation film
03/27/2001US6207302 Electroluminescent device and method of producing the same
03/27/2001US6207281 Electrostatic-erasing abrasion-proof coating and method for forming the same
03/27/2001US6207263 Anti-reflection film and process for preparation thereof
03/27/2001US6207262 Coated cemented carbide endmill having hard-material-coated-layers excellent in adhesion
03/27/2001US6207238 Flash evaporating a crosslinkable monomer into a polymer with the selected index of refraction, forming an evaporate, passing it to a glow discharge electrode creating a monomer plasma, cryocondensing plasma on a substrate and
03/27/2001US6207233 Positioning airfoil within internal space in coating chamber, placing activator within internal space below airfoil, placing chemical coating composition within annular space, closing, heating chamber to form coating
03/27/2001US6207232 Producing bis(ethylcyclopentadineyl)ruthenium containing less than eleven parts per million metallic impurities by reacting ruthenium chloride trihydrate and ethyl cyclopentadiene with zinc powder in alcohol solvent; vaporizing to form film
03/27/2001US6207006 Vacuum processing apparatus
03/27/2001US6207005 Cluster tool apparatus using plasma immersion ion implantation
03/27/2001US6206976 Deposition apparatus and related method with controllable edge exclusion
03/27/2001US6206973 Chemical vapor deposition system and method
03/27/2001US6206972 Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes
03/27/2001US6206971 Integrated temperature controlled exhaust and cold trap assembly
03/27/2001US6206970 Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
03/27/2001US6206967 Low resistivity W using B2H6 nucleation step
03/27/2001US6206012 Method of avoiding wall particle contamination in depositing films
03/27/2001CA2194323C Apparatus and method for plasma processing
03/22/2001WO2001020687A1 New methods of fabricating devices and semiconductor layers comprising cadmium mercury telluride, mercury telluride, and cadmium telluride
03/22/2001WO2001020652A1 Method and apparatus for cleaning film deposition device
03/22/2001WO2001020640A1 Device and method for generating a local plasma by micro-structure electrode discharges with microwaves
03/22/2001WO2001020638A1 A surface treatment process used in growing a carbon film
03/22/2001WO2001020057A1 Method and device for producing process gas-vapor mixtures
03/22/2001WO2001020056A1 Substrate surface preparation