Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
12/2001
12/25/2001US6333103 Aluminum oxide-coated article
12/25/2001US6333099 For metal machining
12/25/2001US6333098 For dry milling of grey cast iron
12/25/2001US6333079 Feeding material gas for film formation into reactor inside of which is kept evacuated; decomposing gas into plasma by using power having high frequency to form deposited film on substrate provided inside reactor
12/25/2001US6333066 Method for forming PZT thin film using seed layer
12/25/2001US6333010 Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases
12/25/2001US6332947 Plasma processing apparatus and plasma processing method using the same
12/25/2001US6332928 High throughput OMPVE apparatus
12/25/2001US6332927 Substrate processing apparatus
12/25/2001US6332926 Apparatus and method for selectively coating internal and external surfaces of an airfoil
12/25/2001US6332925 Evacuation system
12/25/2001US6332898 Substrate processing apparatus and maintenance method therefor
12/25/2001US6332601 Liquid vaporizers for semiconductor processing systems
12/25/2001US6332425 Surface treatment method and system
12/25/2001US6332363 Biosensor, method of forming and use
12/25/2001CA2229423C Method of and device for measuring return losses in optical fibre components
12/20/2001WO2001097264A1 Hot plate
12/20/2001WO2001097263A1 Hot plate
12/20/2001WO2001096634A1 Thick single crystal diamond layer method for making it and gemstones produced from the layer
12/20/2001WO2001096633A1 Single crystal diamond prepared by cvd
12/20/2001WO2001096407A2 Apparatus and process for plasma treatment of particulate matter
12/20/2001WO2001038625A3 Method for making a bowl in thermostructural composite material, resulting bowl and use of same as crucible support
12/20/2001WO2001038596A3 Plasma coating metals at atmospheric pressure
12/20/2001WO2000019481A3 Low contamination high density plasma processing chamber and methods for processing a semiconductor substrate
12/20/2001US20010053615 Ammonia activation gas is delivered into a reactor at the same time as trimethylaluminum and using methanol, ethanol or isopropanol as oxygen source instead of water vapor
12/20/2001US20010053614 Semiconductor device and method of manufacturing the same
12/20/2001US20010053603 Method of manufacturing a copper metal wiring in a semiconductor device
12/20/2001US20010053587 Apparatus for supplying a liquid raw material and method of manufacturing a copper layer using the same
12/20/2001US20010053558 Oxidizing in the presence of an organometallic catalyst using chemical vapor deposition; for use in dynamic random access memory devices; integrated circuits; semiconductors
12/20/2001US20010053423 Improvement includes a second process gas distributor having a second process gas exit spaced apart from the substrate support, and an oxygen-supplying gas distributor have a third exit spaced above the substrate support
12/20/2001US20010053422 Diamond film depositing apparatus and method thereof
12/20/2001US20010053412 Method of curing hydrophobic coating with DLC & FAS on substrate, and resulting coated article
12/20/2001US20010052596 Semiconducting devices and method of making thereof
12/20/2001US20010052556 Injector
12/20/2001US20010052393 Vacuum processing apparatus
12/20/2001US20010052359 Method of substrate temperature control and method of assessing substrate temperature controllability
12/20/2001US20010052325 Substrate processing apparatus
12/20/2001US20010052324 Device for producing and processing semiconductor substrates
12/20/2001US20010052323 Method and apparatus for forming material layers from atomic gasses
12/20/2001US20010052322 Plasma process device
12/20/2001US20010052321 Single-substrate-processing apparatus for semiconductor
12/20/2001US20010052319 Plasma processing apparatus and plasma processing method
12/20/2001US20010052316 Apparatus for reduced-pressure epitaxial growth and method of controlling the apparatus
12/20/2001EP1145273A3 Low contamination high density plasma etch chambers and methods for making the same
12/20/2001DE10120295A1 Vapor deposition apparatus for producing stacked layer structure, includes first and second run lines, vent lines, and line-switching mechanism
12/20/2001DE10119049A1 Thermische Bearbeitungseinrichtung und thermisches Bearbeitungsverfahren Thermal processing device and thermal processing method
12/20/2001DE10028792A1 Messer Knife
12/19/2001EP1164632A2 Method of forming a fluoro-organosilicate layer on a substrate
12/19/2001EP1164628A2 Processing system and method
12/19/2001EP1164620A2 Plasma display panel suitable for high-quality display and production method
12/19/2001EP1164388A2 Device with optical layers
12/19/2001EP1164206A2 Chemical vapor deposition method for amorphous silicon and resulting film
12/19/2001EP1163544A1 Ultraviolet filters with enhanced weatherability and method of making
12/19/2001EP1034320B1 Method and apparatus for coating diamond-like carbon onto particles
12/19/2001EP0960435A4 Apparatus and methods for minimizing as-deposited stress in tungsten silicide films
12/19/2001CN1327612A Semiconductor processing equipment having tiled ceramic liner
12/19/2001CN1327490A Reaction chamber for an epitaxial reactor
12/19/2001CN1327486A Apparatus for forming thin film
12/19/2001CN1327434A Method for the production of single isotope silicon Si-28
12/19/2001CN1327259A Low resistant tungsten silicide rigidly adhesive to low layer and semiconductor device using it
12/19/2001CN1327084A Method for preparing wire drawing mold with diamond compoiste coating
12/19/2001CN1327082A Computer control device for vacuum coating
12/19/2001CN1076518C Plasma treating device
12/18/2001US6331697 System and method for rapid thermal processing
12/18/2001US6331494 Deposition of low dielectric constant thin film without use of an oxidizer
12/18/2001US6331485 Electron cyclotron resonance plasma/chemical vapor deposition of titanium, zirconium or hafnium by reducing halide; conformally covering; noncracking; forming barrier layer; filling with electroconductive material
12/18/2001US6331483 Method of film-forming of tungsten
12/18/2001US6331330 Pressure feeding precursor solvent and a ph-modifying catalyst, generating electric providing corona spray of droplets, electrostatically guiding towards the substrate, decreasing temperature gradient, evaporating from solvent,
12/18/2001US6331260 VD process and apparatus for producing stand-alone thin films
12/18/2001US6331212 Methods and apparatus for thermally processing wafers
12/18/2001US6331211 Method and apparatus for forming low dielectric constant polymeric films
12/18/2001US6331209 Method of forming carbon nanotubes
12/18/2001US6331095 Transportation system and processing apparatus employing the transportation system
12/18/2001CA2091711C Method for producing glass thin film
12/13/2001WO2001095376A2 Methods for forming rough ruthenium-containing layers and structures/methods using same
12/13/2001WO2001094662A1 Method for preparing a coating on a substrate by ald process using a deuterized reactant
12/13/2001WO2001094661A1 A method of growing a zno film
12/13/2001WO2001094657A2 Bearing with amorphous boron carbide coating
12/13/2001WO2001094448A2 Barrier layer for polymers and containers
12/13/2001WO2001048263A3 Method for producing a layer which influences the orientation of liquid crystal and a liquid crystal cell which has at least one layer of this type
12/13/2001WO2001041942A3 Method for depositing a coating on the wall of metallic containers
12/13/2001WO2001040535A3 System and method relating to vapor deposition
12/13/2001WO2001032359A3 Ultrasonic metal finishing involving cavitational erosion
12/13/2001US20010051499 Substrate rotating apparatus
12/13/2001US20010051447 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer
12/13/2001US20010051445 Semiconductor device and method of manufacturing the same
12/13/2001US20010051444 Method for manufacturing aluminum oxide film for use in semiconductor device
12/13/2001US20010051435 Chemical-organic planarization process for atomically smooth interfaces
12/13/2001US20010051429 High vacuum apparatus for fabricating semiconductor device and method for forming epitaxial layer using the same
12/13/2001US20010051428 Low-resistive tungsten silicide layer strongly adhered to lower layer and semiconductor device using the same
12/13/2001US20010051289 Anti-corrosion ceramic member
12/13/2001US20010051232 Plasma processing method
12/13/2001US20010051231 Method for improving electrical conductivity of metals, metal alloys and metal oxides
12/13/2001US20010051228 Method of forming interlayer insulating film
12/13/2001US20010051216 Corrosion resistant coating
12/13/2001US20010051215 Silicon titanium nitrides formed by reacting titanium halide such as titanium tetraiodide, a vapor phase silicon compound and a reactive nitrogen gas such as ammonia in presence of the substrate at given temperature range until nitride forms
12/13/2001US20010051214 Includes two manifolds capable of separating, so it is easy to separate the second manifold supporting the inner tube from the first manifold supporting the outer tube; inner tube can be exchanged without cooling for cleaning
12/13/2001US20010051081 Processes for vacuum treating workpieces, and corresponding process equipment
12/13/2001US20010050391 Liquid chemical vapor deposition source material including at least one organometallic compound of platinum group metal dissolved in tetrahydrofuran and having moisture content of not more than 200 ppm
12/13/2001US20010050146 Substrate processing apparatus and substrate processing method