Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
04/2002
04/25/2002WO2002033741A1 Method for forming insulation film and method for manufacturing semiconductor device
04/25/2002WO2002033144A1 Manifold for gas supply system
04/25/2002WO2002033143A1 Vortex based cvd reactor
04/25/2002WO2002032659A1 Barrier film and method for production thereof
04/25/2002WO2002032588A1 Coating formation by reactive deposition
04/25/2002WO2001085612A3 Process for preparing carbon nanotubes
04/25/2002WO2001061069A3 Plasma polymerized primers for metal pretreatment
04/25/2002US20020049127 Glass, plasma resisting component, component for electromagnetic wave-transparent window and plasma processing apparatus
04/25/2002US20020048971 Manufacturing method of semiconductor integrated circuit device
04/25/2002US20020048969 Method of forming film, method of manufacturing semiconductor device, and film forming apparatus
04/25/2002US20020048963 Plasma enhanced chemical vapor deposition process
04/25/2002US20020048949 Method of forming a metal wiring in a semiconductor device
04/25/2002US20020048940 Depositing a metal film at a first set of process conditions; and continuing to deposit the metal film at a second set of process conditions that are different from the first set of conditions.
04/25/2002US20020048938 Crystal grains of large grain sizes can be formed by using a gas containing hydrogen and a borane, such as diborane, for forming a tungsten film
04/25/2002US20020048926 Method for forming a self-aligned copper capping diffusion barrier
04/25/2002US20020048911 Selectively depositing polysilicon via chemical vapor deposition on the crystalline region and not the amorphous region of a substrate; conditions include chlorine gas-free and plasma-free
04/25/2002US20020048877 Forming a tantalum oxynitride film with a high dielectric constant on a rubidium film, and further forming an upper electrode
04/25/2002US20020048876 Method for fabricating capacitor of semiconductor device
04/25/2002US20020048638 Field emission from bias-grown diamond thin films in a microwave plasma
04/25/2002US20020048635 A first reactant is chemically adsorbed on the terminated substrate by injecting the first reactant into the reaction chamber; a solid thin film is formed through chemical exchange or reaction with a second reactant
04/25/2002US20020048634 And chemical vapor deposition; Group IIA or IVB metallates of Group IVA oxides
04/25/2002US20020048531 Deposited thin films and their use in detection, attachment, and bio-medical applications
04/25/2002US20020047536 Plasma processing apparatus
04/25/2002US20020047203 Semiconductor device having fluorine-added carbon dielectric film and method of fabricating the same
04/25/2002US20020047201 Semiconductor device with rare metal electrode
04/25/2002US20020047152 Semiconductor integrated circuit device and process for manufacturing the same
04/25/2002US20020047122 Polycrystalline silicon layer, its growth method and semiconductor device
04/25/2002US20020047095 Method and device for correcting pattern film on a semiconductor substrate
04/25/2002US20020047004 System and method for thermal processing of a semiconductor substrate
04/25/2002US20020046989 RF matching network with distributed outputs
04/25/2002US20020046941 Anode, evaporation source, electrode as a cathode and a current control unit
04/25/2002US20020046810 Processing apparatus
04/25/2002US20020046808 Plasma processing apparatus
04/25/2002US20020046807 Plasma processing apparatus
04/25/2002US20020046775 Gas panel
04/25/2002US20020046704 Infra-red transparent thermal reactor cover member
04/25/2002US20020046693 Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device
04/25/2002DE10046973A1 Manufacture of chemical vapor deposition diamond product, e.g. cutting tool, involves depositing chemical vapor deposition diamond to desired thickness at mold interface, dissolving mold, and mounting remaining diamond in holder
04/25/2002CA2425838A1 Coating formation by reactive deposition
04/24/2002EP1199743A2 Method of fabricating a stack consisting of a layer of Si3N4 topped by a layer of SiO2 on a semiconductor substrate
04/24/2002EP1199380A1 Film forming device
04/24/2002EP1199379A1 Low friction coefficient carbon film and method of forming the same
04/24/2002EP1199378A1 Method for forming metallic film and apparatus for forming the same
04/24/2002EP1199109A1 Method for preparation of metal coatings
04/24/2002EP1198612A1 Al2O3 COATED CUTTING TOOL
04/24/2002EP1198611A1 Device for treating a container with microwave plasma
04/24/2002EP1198610A1 Low-temperature compatible wide-pressure-range plasma flow device
04/24/2002EP1198431A1 Process for the production of photocatalytic coatings on substrates
04/24/2002EP1198283A1 Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases
04/24/2002CN2487743Y Pedestal for coating inner wall of device
04/24/2002CN1346453A Method of regulating high temperature gaseous phase process and use of said method
04/24/2002CN1346413A Compound gas injection system and methods
04/23/2002US6377437 High temperature electrostatic chuck
04/23/2002US6376808 Heating apparatus
04/23/2002US6376796 Plasma processing system
04/23/2002US6376781 Low resistance contacts fabricated in high aspect ratio openings by resputtering
04/23/2002US6376692 Zirconium alkoxytris (β-Diketonate), process for manufacturing the same, and liquid composition for formation of PZT film
04/23/2002US6376392 Forming silicon oxycarbide; antirefelctive coatings
04/23/2002US6376391 Pulsed or tailored bias for filling gaps with low dielectric constant material
04/23/2002US6376371 Method of forming a semiconductor device
04/23/2002US6376349 Forming dielectric; then amorphous metal; siliciding
04/23/2002US6376340 Methods for forming polycrystalline silicon film
04/23/2002US6376305 Method of forming DRAM circuitry, DRAM circuitry, method of forming a field emission device, and field emission device
04/23/2002US6376299 Capacitor for semiconductor memory device and method of manufacturing the same
04/23/2002US6376028 Device and method for treating the inside surface of a plastic container with a narrow opening in a plasma enhanced process
04/23/2002US6375860 Controlled potential plasma source
04/23/2002US6375811 Flexible, highly durable, transparent optical coatings
04/23/2002US6375756 Supplying cleaning gas into heated chamber so that gas is decomposed and activated by hot element to generate activated species that converts deposited film into gaseous substance
04/23/2002US6375753 Pumping a bulk amount of processing liquid from the processing liquid delivery line; and applying non-thermal energy to the processing liquid delivery line and thereby desorbing processing liquid from processing liquid delivery line
04/23/2002US6375750 Plasma enhanced chemical processing reactor and method
04/23/2002US6375749 Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
04/23/2002US6375748 Method and apparatus for preventing edge deposition
04/23/2002US6375745 Mobile cellular tumble coater
04/23/2002US6375744 Sequential in-situ heating and deposition of halogen-doped silicon oxide
04/23/2002US6375743 Method for improved chamber bake-out and cool-down
04/23/2002US6374859 Manifold system for enabling a distribution of fluids
04/23/2002US6374831 Reactive plasma cleaning process using a plasma formed in an astron fluorine source generator from a flow of pure inert-source gas. after formation of the plasma, a flow of a fluorine source gas is introduced to form radicals
04/23/2002US6374770 Apparatus for improving film stability of halogen-doped silicon oxide films
04/23/2002US6374512 Method for reducing contamination of a substrate in a substrate processing system
04/23/2002US6374508 Apparatus and method for aligning a substrate on a support member
04/23/2002CA2214276C Cvd diamond burrs for odontological and related uses
04/18/2002WO2002031891A1 Electrode and electron emission applications for n-type doped nanocrystalline materials
04/18/2002WO2002031875A2 Dielectric interface films and methods therefor
04/18/2002WO2002031839A1 N-type doping of nanocrystalline diamond films with nitrogen and electrodes made therefrom
04/18/2002WO2002031219A1 Electrostatically clamped edge ring for plasma processing
04/18/2002WO2002012585A3 Processing apparatus and cleaning method
04/18/2002WO2002007194A3 Cleaning gas for semiconductor production equipment
04/18/2002WO2002001608A3 METHOD FOR ACHIEVING IMPROVED EPITAXY QUALITY (SURFACE TEXTURE AND DEFECT DENSITY) ON FREE-STANDING (ALUMINUM, INDIUM, GALLIUM) NITRIDE ((Al,In,Ga)N) SUBSTRATES FOR OPTO-ELECTRONIC AND ELECTRONIC DEVICES
04/18/2002WO2001082958A3 Methods of producing membrane vesicles
04/18/2002WO2000074932A9 Deposited thin film void-column network materials
04/18/2002US20020045966 Chemical vapor deposition process and apparatus for performing the same
04/18/2002US20020045362 Method of forming a silicon nitride layer on a semiconductor wafer
04/18/2002US20020045361 Plasma processes for depositing low dielectric constant films
04/18/2002US20020045359 Fluorine-containing materials and processes
04/18/2002US20020045357 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small production runs
04/18/2002US20020045322 Method of depositing tungsten nitride using a source gas comprising silicon
04/18/2002US20020045146 Batch-type heat treatment apparatus and control method for the batch-type heat treatment apparatus
04/18/2002US20020045053 Where the surface has an original chemical composition that varies with depth and at least a portion of the surface is missing from the substrate
04/18/2002US20020045009 Method of chemically growing a thin film in a gas phase on a silicon semiconductor substrate
04/18/2002US20020043937 Magnetron having a lowered oscillation frequency and processing equipment employing the same