Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
06/2004
06/02/2004EP1424614A2 Flow control of process gas in semiconductor manufacturing
06/02/2004EP1424405A2 Method and apparatus for fabricating coated substrates
06/02/2004EP1423558A2 Susceptor with epitaxial growth control devices and epitaxial reactor using the same
06/02/2004EP1423480A1 Cubic boron nitride composition, coating and articles made therefrom, methods of making and using said composition, coating and articles
06/02/2004EP1423259A1 Free-standing (al, ga, in)n and parting method for forming same
06/02/2004EP0975435A4 Modular coating fixture
06/02/2004EP0552375B1 Method of forming a semiconductor film with a chemical vapor deposition apparatus
06/02/2004CN1502121A Microwave plasma process device, plasma ignition method, plasma forming method, and plasma process method
06/02/2004CN1501895A Photo-induced hydrophilic article and method of making same
06/02/2004CN1501751A 有机电致发光器件及其制造方法 Organic electroluminescent device and manufacturing method
06/02/2004CN1501513A Stacked photovoltaic device
06/02/2004CN1501455A Method of fabricating semiconductor device
06/02/2004CN1501452A Plasma machining apparatus
06/02/2004CN1501440A Semiconductor manufacturing apparatus enabling inspection of mass flow controller maintaining connection thereto
06/02/2004CN1501438A Method for manufacturing lead straight pattern layer by silicon dioxide
06/02/2004CN1501435A Gas injection apparatus for semiconductor processing system
06/02/2004CN1500909A Raw material for chemical gas phase growth and manufacturing method for thin film using the raw material
06/02/2004CN1500582A 被覆切削工具 Coated cutting tool
06/01/2004US6745096 Maintenance method and system for plasma processing apparatus etching and apparatus
06/01/2004US6744559 Color shifting carbon-containing interference pigments and foils
06/01/2004US6744098 Transistor devices
06/01/2004US6744085 Electronic device with electrode and its manufacture
06/01/2004US6743934 Such as bis(6-methyl-2,4-heptanedionate)(1,5-cyclooctadiene) ruthenium
06/01/2004US6743933 Process of forming thin film and precursor for chemical vapor deposition
06/01/2004US6743739 Fabrication method for semiconductor integrated devices
06/01/2004US6743738 Dopant precursors and processes
06/01/2004US6743737 Forming integrated circuits; plasma vapor deposition
06/01/2004US6743736 Reactive gaseous deposition precursor feed apparatus
06/01/2004US6743718 Process for producing barrier film and barrier film thus produced
06/01/2004US6743714 Low temperature integrated metallization process and apparatus
06/01/2004US6743700 Semiconductor film, semiconductor device and method of their production
06/01/2004US6743531 Oxide superconducting conductor and its production method
06/01/2004US6743524 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
06/01/2004US6743475 Process for producing aluminum oxide films at low temperatures
06/01/2004US6743474 High purity and low porosity, which may be more effective as barrier layers.
06/01/2004US6743473 Semiconductor devices, method for depositing metal and metal nitride layers by chemical vapor deposition of a precursor, cyclopentaidenely complex
06/01/2004US6743340 Posiitoning in vacuum; magnetron sputtering ferromagnetic material on wafer
06/01/2004US6743328 Grounded centering ring for inhibiting polymer build-up on the diaphragm of a manometer
06/01/2004CA2290514C A method of coating edges with diamond-like carbon
05/2004
05/27/2004WO2004045248A2 Barrier coatings and methods in discharge lamps
05/27/2004WO2004044970A1 Substrate processing device
05/27/2004WO2004044969A1 Valve unit and heat treatment system
05/27/2004WO2004044963A2 Atomic layer deposition methods
05/27/2004WO2004044958A2 Composition and method for low temperature deposition of silicon-containing films
05/27/2004WO2004044957A2 Method and apparatus for providing and integrating a general metal delivery source (gmds) with atomic layer deposition (ald)
05/27/2004WO2004044039A2 Process and apparatus for depositing plasma coating onto a container
05/27/2004WO2004043691A1 Extremely strain tolerant thermal protection coating and related method and apparatus thereof
05/27/2004WO2004038783A3 Pecvd of organosilicate thin films
05/27/2004WO2004029325A9 High velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and a plasma reactor for carrying out said method
05/27/2004WO2004009861A8 Method to form ultra high quality silicon-containing compound layers
05/27/2004WO2004009299B1 Loading and unloading device for a coating unit
05/27/2004WO2004008493A3 Method and apparatus for supporting semiconductor wafers
05/27/2004WO2004007793A3 Method and apparatus for providing gas to a processing chamber
05/27/2004WO2004001808A3 Method and system for atomic layer removal and atomic layer exchange
05/27/2004WO2003087431B1 Deposition methods utilizing phased array microwave excitation, and deposition apparatuses
05/27/2004WO2003076184A9 Method of making window unit including diamond-like carbon (dlc) coating
05/27/2004WO2003016240A3 Components with bearing or wear-resistant surfaces
05/27/2004WO2002101784B1 Plasma processor
05/27/2004US20040102040 Film depositon on a semiconductor wafer
05/27/2004US20040102038 MOCVD formation of Cu2S
05/27/2004US20040101636 Plasma enhanced chemical vapor deposition; for production of optical lenses
05/27/2004US20040101633 Chemical vapor deposition; low dielectric constant (k)
05/27/2004US20040101632 Plasma enhanced chemical vapor deposition; for production of integrated circuits
05/27/2004US20040101622 Comprises spraying ozone and inert gases, purging the ozone, then spraying trimethylaluminum; atomic layer deposition
05/27/2004US20040101468 Using metal substrate, catalyst
05/27/2004US20040101460 Air pollution control during semiconductor forming; removal trace elements; circulating polishing scrubbers
05/27/2004US20040099899 High K dielectric material and method of making a high K dielectric material
05/27/2004US20040099378 Gas injection apparatus for semiconductor processing system
05/27/2004US20040099282 Monitoring and decomposition of deposits in enclosures used for chemical vapor deposition of semiconductors, using gas generators, radiation measuring instruments and analysis apparatus
05/27/2004US20040099281 Method for cleaning plasma enhanced chemical vapor deposition chamber using very high frequency energy
05/27/2004US20040099220 [laser annealing apparatus and application of the same]
05/27/2004US20040099219 Semiconductor manufacturing system
05/27/2004US20040099215 Chamber for constructing a film on a semiconductor wafer
05/27/2004US20040099214 Production device for dlc film-coated plastic container and production method therefor
05/27/2004US20040099213 Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation
05/27/2004DE10352606A1 Device for producing a semiconductor component comprises a chamber containing an inner structure, a reaction gas feed unit for introducing reaction gas into the inner chamber, a cathode and anode for plasma discharge and a heater
05/27/2004DE10296988T5 Bearbeitungsvorrichtung und -verfahren Processing apparatus and method
05/26/2004EP1422762A1 PHOTOELECTRIC CONVERSION DEVICE−USE SUBSTRATE
05/26/2004EP1422761A1 Glass plate having electroconductive film formed thereon
05/26/2004EP1422749A1 Purging method for semiconductor production device and production method for semiconductor device
05/26/2004EP1422747A1 APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR CLEANING SEMICONDUCTOR PRODUCING APPARATUS
05/26/2004EP1422743A1 Treatment system
05/26/2004EP1422317A1 Gas treating device and gas treating method
05/26/2004EP1422316A1 Method for cleaning reaction container and film deposition system
05/26/2004EP1422315A1 Metallic material equipped with a protective layer realised through silicon oxides
05/26/2004EP1422314A1 Dispositive and process to clean process chambers and vacuum lines
05/26/2004EP1421630A2 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
05/26/2004EP1421607A2 Improved process for deposition of semiconductor films
05/26/2004EP1421606A1 Plasma enhanced atomic layer deposition (peald) equipment and method of forming a conducting thin film using the same thereof
05/26/2004EP1421599A2 Suspended gas distribution manifold for plasma chamber
05/26/2004EP1421414A1 Optically coated article and method for its preparation
05/26/2004EP1421227A2 Device for reactive plasma treatment of substrates and method for the use thereof
05/26/2004EP1421226A1 Method for the deposition of silicon nitride
05/26/2004EP1275129A4 E-beam/microwave gas jet pecvd method and apparatus for depositing and/or surface modification of thin film materials
05/26/2004EP0988407B1 Method for producing coated workpieces, which are coated with an epitactic layer
05/26/2004CN2617779Y Chemical gas phase depositing devices
05/26/2004CN1500370A Device and control method for micro wave plasma processing
05/26/2004CN1499586A Manufacturing method for continuous forming oxide/nitride/oxide insulation layer by using single wafer type reactor of chemical vapor deposition
05/26/2004CN1499575A Island projection-modified part, method for producing same, and appts. comprising same
05/25/2004US6740977 Insulating layers in semiconductor devices having a multi-layer nanolaminate structure of SiNx thin film and BN thin film and methods for forming the same