Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
01/2007
01/30/2007CA2159296C Glass coating method and glass coated thereby
01/25/2007WO2007011666A2 Method and apparatus for semiconductor processing
01/25/2007WO2007011581A1 Improved support structure for radiative heat transfer
01/25/2007WO2007010887A1 Gas treatment apparatus
01/25/2007WO2007010568A1 System for supporting and rotating a susceptor inside a treatment chamber of a water treating apparatus
01/25/2007WO2007009190A1 Duplex surface treatment of metal objects
01/25/2007WO2006127462A3 Method to increase the compressive stress of pecvd silicon nitride films
01/25/2007WO2006101697A3 Vaporizer and method of vaporizing a liquid for thin film delivery
01/25/2007WO2006000561A8 Container-treatment machine comprising controlled gripping means for seizing containers by the neck
01/25/2007US20070020940 Method of forming fluorinated carbon film
01/25/2007US20070020924 Tungsten nitride atomic layer deposition processes
01/25/2007US20070020890 Method and apparatus for semiconductor processing
01/25/2007US20070020885 Tube Formed of Bonded Silicon Staves
01/25/2007US20070020477 Cemented carbide body
01/25/2007US20070020394 Methods and apparatus for vapor processing of micro-device workpieces
01/25/2007US20070020393 Oxide coated cutting tool
01/25/2007US20070020392 Functional organic based vapor deposited coatings adhered by an oxide layer
01/25/2007US20070020391 heating to gas phase polymerization in one reactor to form polyimide; free of hazardous waste; free of support structure; flexibility in material selection
01/25/2007US20070020390 Supplying method of chemicals
01/25/2007US20070020389 Method of forming film, patterning and method of manufacturing electronic device using thereof
01/25/2007US20070017700 Sp3 bonding boron nitride nitride thin film having self-forming surface shape being advantageous in exhibiting property of emitting electric field electrons, method for preparation thereof and use thereof
01/25/2007US20070017637 Inductively coupled plasma processing apparatus
01/25/2007US20070017446 Apparatus to treat a substrate
01/25/2007US20070017445 Hybrid PVD-CVD system
01/25/2007US20070017444 Rotatable valve
01/25/2007US20070017443 Wireless operator interface for material application system
01/25/2007DE102005033579A1 Verfahren zur Herstellung dünner Hafnium- oder Zirkonnitrid-Schichten A process for the production of thin hafnium or zirconium nitride layers
01/25/2007DE102005033102A1 New tantalum- or niobium compounds useful as precursors for tantalum nitride- and niobium nitride layering by means of chemical vapor deposition procedure
01/25/2007DE10150822B4 Verfahren zum Entfernen oxidierter Bereiche auf einer Grenzfläche einer Metalloberfläche A method for removing oxidized areas on a interface of a metal surface
01/24/2007EP1746653A1 Method of fabrication of background noise standards, containing nanostructures on an insulating thin film.
01/24/2007EP1746183A1 Process for obtaining thin films of zirconium nitride
01/24/2007EP1746182A2 Hybrid pvd-cvd system
01/24/2007EP1745504A1 An improved method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
01/24/2007EP1745160A1 Apparatuses and methods for atomic layer deposition of hafnium-containing high-k dielectric materials
01/24/2007EP1745159A2 Apparatuses and methods for atomic layer deposition
01/24/2007EP1451861A4 Apparatus and method for reactive atom plasma processing for material deposition
01/24/2007EP1444724B1 Method for photolithographic structuring by means of a carbon hard mask layer which has a diamond-like hardness and is produced by means of a plasma-enhanced deposition method
01/24/2007EP1222679B1 Method and apparatus for controlling wafer uniformity using spatially resolved sensors
01/24/2007CN1902738A Atomic layer deposition of high k metal silicates
01/24/2007CN1902737A Substrate processing apparatus
01/24/2007CN1902732A Edge flow faceplate for improvement of cvd film properties
01/24/2007CN1902337A CVD tantalum compounds for FET gate electrodes
01/24/2007CN1901222A Method and apparatus for epitaxially coating semiconductor wafer, and coated semiconductor wafer
01/24/2007CN1900359A Hybrid PVD-CVD system
01/24/2007CN1900356A Process for preparing diamond film under strong magnetic field
01/24/2007CN1296975C Processing apparatus for plasma
01/24/2007CN1296528C Apparatus and method for diamond production
01/24/2007CN1296518C Composite material and method for production thereof
01/24/2007CN1296517C Preparation for amorphous carbon thin-film hydrophobic material with rear surface fluorating process
01/23/2007US7166965 Waveguide and microwave ion source equipped with the waveguide
01/23/2007US7166884 Method for fabricating semiconductor device and semiconductor device
01/23/2007US7166732 Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices; chemical vapor deposition or atomic layer deposition of the precursors on barrier substrates, especially Ti, TA, Nb or W silicides, nitrides or siliconitrides
01/23/2007US7166516 Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCN
01/23/2007US7166480 Particle control device and particle control method for vacuum processing apparatus
01/23/2007US7166470 Dissolving two or more reagents in solvent, mixing together in different ratios, dispensing on subtrate, heating for calcining
01/23/2007US7166372 creep resistance and high strength overcoatings comprising alloys of chromium, aluminum, yttrium and nickel, cobalt, iron or hafnium having discrete nitride particles, used on substrates such as blades and vanes for gas turbine engines
01/23/2007US7166371 cutters comprising blades having tungsten carbide multilayer coatings, that wear uniformly thereby keeping the edge smooth
01/23/2007US7166366 Chemical, mechanical and/or optical protective and/or diffusion barrier layer (16) disposed on a metal or plastic substrate (14). Said layer consists of an organic layer matrix (10) with metal-containing particles (12) dispersed therein
01/23/2007US7166336 DLC film, DLC-coated plastic container, and method and apparatus for manufacturing DLC-coated plastic container
01/23/2007US7166335 Layer formation method, and substrate with a layer formed by the method
01/23/2007US7166325 Carbon nanotube devices
01/23/2007US7166233 Introducing process gas into reactor chamber, creating plasma within chamber by establishing an RF electromagnetic field within chamber and allowing the field to interact with the process gas
01/23/2007US7166206 Generating a stream of bubbles containing a source of the material, and applying a potential difference across the cathode and anode so that the resulting glow discharge forms a plasma of ionised gaseous molecules within the bubbles
01/23/2007US7166187 Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
01/23/2007US7166185 Forming system for insulation film
01/23/2007US7166170 Cylinder-based plasma processing system
01/23/2007US7166167 Laser CVD device and laser CVD method
01/23/2007US7166166 Method and apparatus for an improved baffle plate in a plasma processing system
01/23/2007US7166165 Barrier coating for vitreous materials
01/23/2007CA2368712C Coating method on the inner walls of the reaction tubes in a hydrocarbon pyrolysis reactor
01/18/2007WO2007008677A2 Load port module
01/18/2007WO2007008653A2 Method for depositing silicon-containing films
01/18/2007WO2007008606A1 Method and system for deposition tuning in an epitaxial film growth apparatus
01/18/2007WO2007008515A2 Seal arrangement with corrosion barrier and method
01/18/2007WO2007007782A1 Multilayer structure and method for cleaning same
01/18/2007WO2007007744A1 Substrate stage mechanism and substrate processing apparatus
01/18/2007WO2007007680A1 Method of forming film and apparatus for film formation
01/18/2007WO2007007395A1 Device for forming coating film on inner surface of container and method for producing container having coated inner surface
01/18/2007WO2007006977A2 Apparatus for the pecvd deposition of an inner barrier layer on a container, comprising an optical plasma analysis device
01/18/2007WO2007006525A1 Method and reactor for growing crystals
01/18/2007WO2006122015A3 Isolation valve for energetic and high temperature gasses
01/18/2007WO2006062576A3 Method and apparatus for improved baffle plate
01/18/2007WO2006012179A3 Expanded thermal plasma apparatus
01/18/2007WO2004114432A3 Improved electrode and associated devices and methods
01/18/2007US20070015374 Apparatus and method for atomic layer deposition on substrates
01/18/2007US20070015335 Production method for antenna and production device for antenna
01/18/2007US20070014996 compliant layer having an elastic modulus of between 30 and 130 GPa is provided between the silicon based substrate and a silicon metal containing oxygen gettering layer; does not adversely affect the mechanical behavior of the substrate such as reduction in the flexure or tensile strength
01/18/2007US20070014932 Placing a substrate on a susceptor including a center pin for lifting the substrate; energizing an electrode to applying a uniform electric field to the substrate; grounding the center pin; and forming a film on the substrate by chemical vapor deposition; uniform thickness
01/18/2007US20070014925 Method for slot extrusion coating a liquid composition
01/18/2007US20070014919 Atomic layer deposition of noble metal oxides
01/18/2007US20070014714 at a relatively low temperature using water plasma; purity, quality for e.g. semiconductor devices; vacuum deposition
01/18/2007US20070012402 Apparatus and method for downstream pressure control and sub-atmospheric reactive gas abatement
01/18/2007US20070012401 Plasma processing apparatus
01/18/2007US20070012251 Seal arrangement with corrosion barrier and method
01/18/2007US20070012250 Inductively coupled plasma processing apparatus for very large area using dual frequency
01/18/2007US20070012249 Film forming apparatus
01/18/2007US20070012241 Methods of assessing the temperature of semiconductor wafer substrates within deposition apparatuses
01/18/2007DE10205167C5 In-Line-Vakuumbeschichtungsanlage zur Zwischenbehandlung von Substraten In-line vacuum coating system for temporary treatment of substrates
01/18/2007DE102006025683A1 Method of applying catalytically active material, directly to heat exchanger internal surfaces without use of a carrier layer uses streamless deposition (ELP) or chemical gas phase deposition (CVD)
01/17/2007EP1743954A1 An ALD method for depositing a layer