Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23C - Coating metallic material; Coating material with metallic material; Surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general › C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes
Patents for C23C 16 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (cvd) processes (71,892)
12/2007
12/19/2007CN101088915A Single-wall carbon tube preparing process
12/19/2007CN101088759A Coated inserts for milling
12/19/2007CN101088758A Coated inserts for milling
12/19/2007CN101088757A Coated inserts for milling
12/19/2007CN100356581C Semiconductor device and method of manufacturing the same
12/19/2007CN100356522C Method for preparing titanium silicide nano line by chemical gas phase deposition method
12/19/2007CN100356519C Precursor containing a nitrogen compound bound to hfcl4 for hafnium oxide layer and method for forming hafnium oxide film using the precursor
12/19/2007CN100355937C System for CD glow plasma CVD zin oxide film and preparing process
12/19/2007CN100355936C Surface treatment method and surface treatment apparatus
12/19/2007CA2591663A1 Metal-organic vaporizing and feeding apparatus, metal-organic chemical vapor deposition apparatus, metal-organic chemical vapor deposition method, gas flow rate regulator, semiconductor manufacturing apparatus, and semiconductor manufacturing method
12/18/2007USRE39939 Processing system
12/18/2007US7310563 Fabrication system and fabrication method
12/18/2007US7309889 Constructions comprising perovskite-type dielectric
12/18/2007US7309662 Method and apparatus for forming a film on a substrate
12/18/2007US7309514 Electron beam modification of CVD deposited films, forming low dielectric constant materials
12/18/2007US7309395 System for forming composite polymer dielectric film
12/18/2007US7309394 Ultraviolet light-emitting device in which p-type semiconductor is used
12/18/2007CA2294261C Method and apparatus for gas phase coating complex internal surfaces of hollow articles
12/13/2007WO2007143359A1 Photochromatic effect for polycarbonate glazing applications
12/13/2007WO2007143301A2 Controlled zone microwave plasma system
12/13/2007WO2007142850A2 Gas flow control by differential pressure measurements
12/13/2007WO2007142700A1 Copper (i) amidinates and guanidinates for forming copper thin films
12/13/2007WO2007142690A2 Apparatus and process for plasma-enhanced atomic layer deposition
12/13/2007WO2007142329A1 Film forming apparatus, film forming method, computer program and storage medium
12/13/2007WO2007142059A1 Plastic optical element with gas barrier film, method for manufacturing the plastic optical element, and light pickup device using the plastic optical element with gas barrier film
12/13/2007WO2007142056A1 Gas introduction device, method of manufacturing the same, and processing device device
12/13/2007WO2007141059A2 Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnum precursors and their use for semiconductor manufacturing
12/13/2007WO2007140931A1 Coated body and method for its production
12/13/2007WO2007140813A1 Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing
12/13/2007WO2007117838A3 Atomic layer deposition coatings for implantable medical devices
12/13/2007WO2007117741A3 A reduced contaminant gas injection system and method of using
12/13/2007WO2007117320A3 A method to improve the ashing/wet etch damage resistance and integration stability of low dielectric constant films
12/13/2007WO2007109214A3 Vaporizer for delivery of low vapor pressure gasses
12/13/2007WO2006017340A3 Plasma enhanced chemical vapor deposition system for forming carbon nanotubes
12/13/2007US20070287248 Method for manufacturing capacity element, method for manufacturing semiconductor device and semiconductor-manufacturing apparatus
12/13/2007US20070287027 Laser based metal deposition (lbmd) of antimicrobials to implant surfaces
12/13/2007US20070287026 Method for Manufacturing Ultra-Hydrophilic Thin Film Coated Metal Film Coated Metal Product
12/13/2007US20070286979 Surface treatment device for optical discs
12/13/2007US20070286965 Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon
12/13/2007US20070286956 Cluster tool for epitaxial film formation
12/13/2007US20070286955 Method for producing fiber-reinforced composite
12/13/2007US20070286954 Methods for low temperature deposition of an amorphous carbon layer
12/13/2007US20070284588 Follicle stimulating hormone supreagonists
12/13/2007US20070284574 Method of Forming a Transistor Having a Dual Layer Dielectric
12/13/2007US20070284045 Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
12/13/2007US20070284044 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
12/13/2007US20070283891 Table for supporting substrate, and vacuum-processing equipment
12/13/2007US20070283890 Evaporation source
12/13/2007US20070283889 Apparatus of processing substrate
12/13/2007US20070283888 Plasma Reactor for the Treatment of Large Size Substrates
12/13/2007US20070283887 Microwave Plasma Processing Apparatus
12/13/2007US20070283886 Apparatus for integration of barrier layer and seed layer
12/13/2007US20070283885 Device for vaporizing materials with a vaporizer tube
12/13/2007US20070283884 Ring assembly for substrate processing chamber
12/13/2007US20070283554 Cutting tool insert
12/13/2007DE102006027098A1 Production of layers by physical or chemical vapor deposition comprises using radicals of an element of the layer material in the vapor phase
12/12/2007EP1865091A2 High flow GaCI3 delivery
12/12/2007EP1864334A1 Process for preparing a metal film on a substrate
12/12/2007EP1863950A1 Multi-tray film precursor evaporation system and thin film deposition system incorporating same
12/12/2007EP1863949A1 Method and system for coating internal surfaces using reverse-flow cycling and other techniques
12/12/2007EP1863595A2 Surface treatment
12/12/2007EP1560280B1 Thin film multilayer body, electronic device using such thin film multilayer body, actuator, and method for manufacturing actuator
12/12/2007EP1515835B1 Honeycomb-shaped carbon element
12/12/2007CN200990717Y Big size graphite electrode
12/12/2007CN101088151A System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process
12/12/2007CN101088150A Tensile and compressive stressed materials for semiconductors
12/12/2007CN101088148A Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance
12/12/2007CN101088146A Substrate surface treating apparatus
12/12/2007CN101087900A Corrosion resistant apparatus for control of a multi-zone nozzle in a plasma processing system
12/12/2007CN101087899A Vertical production of photovoltaic devices
12/12/2007CN101086061A Apparatus of processing substrate
12/12/2007CN101086060A Method for preparing dilute magnetic semiconductor film based on zinc oxide possessing room temperature ferromagnetism
12/12/2007CN100355045C Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
12/12/2007CN100355043C Method for forming an oxynitride spacer for a metal gate electrode using a PECVD process with a silicon-starving atmosphere
12/12/2007CN100355038C Plasma processor and variable impedance apparatus correcting method
12/12/2007CN100355029C Surface treating method for substrate
12/12/2007CN100355028C Vapor phase epitaxy device
12/12/2007CN100355026C Method and apparatus for producing polysilicon film, semiconductor device, and manufacture thereof
12/12/2007CN100355020C Wafer holder and semiconductor manufacturing apparatus
12/12/2007CN100355019C Substrate processing apparatus, pressure control method for substrate processing apparatus
12/12/2007CN100354453C Layer formation method, and substrate with a layer formed by the method
12/12/2007CN100354451C Process for making angstrom scale and high aspect functional platelets
12/12/2007CN100354286C Organometallic compounds and their use as precursors for forming films and powders of metal or metal derivatives
12/11/2007US7307303 Semiconductor device and method for manufacturing same
12/11/2007US7307029 Plasma treatment apparatus and method for plasma treatment
12/11/2007US7307028 Film-forming method, method of manufacturing semiconductor device, semiconductor device, method of manufacturing display device, and display device
12/11/2007US7306985 Method for manufacturing semiconductor device including heat treating with a flash lamp
12/11/2007US7306956 Variable temperature and dose atomic layer deposition
12/11/2007US7306852 A laminate containing an electroconductive layer and a transparent inorganic oxide barrier film; improved permselectivity of water vapor and molecular oxygen while retaining a predetermined thickness; food, medicine and electronics packaging materials, light emitting diode display panels
12/11/2007US7306845 Optical materials and optical devices
12/11/2007US7306830 High intensity-discharge lamps; applying amorphous thin layers of TiO2 and SiO2 by plasma impulse chemical vapor deposition at high power density and increased substrate temperatures using small growth rates to form interference layer less than 1200 nm thick and a minimized UV-active defective spot rate
12/11/2007US7306829 RF plasma reactor having a distribution chamber with at least one grid
12/11/2007US7306826 Orientation of the first warp direction of a preselected number of plies lie in the direction of maximum tensile stress during normal operation; rigidizing the shape with a layer of BN and a layer of SiC using chemical vapor infiltration; densifying using a carbon slurry; further densifying with silicon
12/11/2007US7306778 Diamond films and methods of making diamond films
12/11/2007US7306745 Method and apparatus for stabilizing a plasma
12/11/2007US7306707 Adaptable processing element for a processing system and a method of making the same
12/11/2007US7306696 Interferometric endpoint determination in a substrate etching process
12/11/2007US7306636 Oxide coated cutting tool
12/11/2007US7305935 Slotted antenna waveguide plasma source
12/11/2007US7305934 Plasma treatment apparatus and plasma generation method
1 ... 292 293 294 295 296 297 298 299 300 301 302 303 304 305 306 307 308 309 310 311 312 ... 719