Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
02/2000
02/22/2000CA2054917C Reflecting objects and production process
02/19/2000CA2280294A1 Black roll for optical measurement, thin film forming apparatus including the same, and thin film forming method using the same
02/17/2000WO2000008691A1 Zinc oxide films containing p-type dopant and process for preparing same
02/17/2000WO2000008671A2 Device for coating panel-shaped substrates
02/17/2000WO2000008670A2 Dose monitor for plasma-monitor ion implantation doping system
02/17/2000WO2000008228A1 Dual collimator physical-vapor deposition apparatus
02/17/2000WO2000008227A1 Device and method for the vacuum plasma processing of objects
02/17/2000WO2000008226A2 Vapor deposition system
02/17/2000DE19913554A1 Manufacturing semiconductor component with barrier layer which is made of titanium, titanium nitride etc. to prevent oxidation of tungsten plug
02/17/2000DE19837045A1 Vorrichtung zum Beschichten von Substraten mit dünnen Schichten Apparatus for coating substrates with thin layers
02/17/2000DE19836652A1 Installation for coating substrates comprises chambers which are arranged one after another at successively lower levels, and are supplied with substrates by means of a gravity conveyor unit
02/17/2000CA2338352A1 Plasma-enhanced vaccum vapor deposition systems including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation
02/16/2000EP0980090A2 Sputtering device with a cathode comprising a permanent magnet assembly
02/16/2000EP0980088A1 Toroidal filament for plasma generation
02/16/2000EP0979733A2 Ink-filling device
02/16/2000EP0979315A1 Titanium crystal and titanium
02/16/2000EP0832313B1 Superalloy component with a protective coating system
02/16/2000CN1244826A Method of making high purity copper sputtering targets
02/15/2000US6025266 Controlling formation of film on backside of wafer, using moveable cover shield
02/15/2000US6025205 Apparatus and methods of forming preferred orientation-controlled platinum films using nitrogen
02/15/2000US6025110 Irradiating transfer carrier to cause ablative ejection of transfer material onto receiver surface according to pattern; building up object in successive layers
02/15/2000US6025036 Method of producing a film coating by matrix assisted pulsed laser deposition
02/15/2000US6025021 Multilayer coating of a nitride-containing compound and method for producing it
02/15/2000US6024852 Made of ti or a ti alloy
02/15/2000US6024851 Apparatus for magnetic field pulsed laser deposition of thin films
02/15/2000US6024847 Producing titanium sponge in a container and performing titanium fused salt electrolysis in situ in the same container to produce high purity titanium crystal
02/15/2000US6024844 Enhanced reactive DC sputtering system
02/15/2000US6024843 Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
02/14/2000CA2271282A1 Process for fabricating device comprising lead zirconate titanate
02/10/2000WO2000007223A2 Method for reducing particle emission or absorption on a surface
02/10/2000WO2000007216A1 A ceramic composition for an apparatus and method for processing a substrate
02/10/2000WO2000007072A1 Photomask blank, photomask, methods of manufacturing the same, and method of forming micropattern
02/10/2000WO2000006793A1 Sputtering target assembly
02/10/2000WO2000006489A1 Method for forming an oxide film with non-uniform thickness at a silicon substrate surface
02/10/2000WO2000006332A1 Die and surface treating method for die
02/10/2000DE19835154A1 Apparatus for vacuum coating of substrates, in particular, those with spherical surfaces comprises two vacuum chambers which are located adjacent to one another and have rotating transport arms
02/10/2000DE19833718A1 Verfahren zur Verringerung der Partikelabgabe und Partikelaufnahme einer Oberfläche A method for reducing the particle charge and particle of a surface
02/09/2000EP0978754A2 Non-linear optical silica thin film manufacturing method and non-linear optical silica element
02/09/2000EP0978138A1 Method and apparatus for ionized sputtering of materials
02/09/2000EP0977907A1 Combination antiabrasion layer
02/09/2000EP0977905A1 Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
02/09/2000EP0977904A1 Plasma processing system utilizing combined anode/ion source
02/09/2000EP0977903A1 Vacuum deposition apparatus using electron beams
02/09/2000EP0894153B1 Apparatus for matrix coating fibres with metal vapour
02/09/2000CN1244143A Processf or making a parylene coating
02/08/2000US6023038 Resistive heating of powered coil to reduce transient heating/start up effects multiple loadlock system
02/08/2000US6022805 Method of fabricating semiconductor device with a multi-layered interconnection structure having a low contact resistance
02/08/2000US6022598 Providing sapphire material in tungsten cruucible, heating to cause tungsten vapor to form, mixing tungsten material with sapphire material, ejecting vapor through nozzle, forming clusters, bombarding with electrons, accelerating to substrate
02/08/2000US6022462 DC sputtering system
02/08/2000US6022461 Sputtering apparatus
02/08/2000US6022460 Enhanced inductively coupled plasma reactor
02/08/2000US6021964 Gas introduction pipe and magnetic recording medium production method using the pipe
02/08/2000US6021738 Carriage electrode contact system used in coating objects by vacuum deposit
02/08/2000US6021737 Ion plating apparatus that prevents wasteful consumption of evaporation material
02/03/2000WO2000005745A1 Physical vapor processing of a surface with non-uniformity compensation
02/03/2000WO2000005429A1 Method and system for manufacturing disperse composite materials
02/03/2000WO2000005017A1 Method and apparatus for producing material vapour
02/03/2000DE19850415C1 Substrate holder for multi chamber vacuum coating installations is a trolley consisting of transport and holding units which are movable on different roller conveyors and joined to one another by a flexible connector
02/03/2000DE19834592A1 Vorrichtung zum Beschichten von plattenförmigen Substraten Device for coating disc-shaped substrates
02/03/2000DE19834314A1 Application of a scratch resistant coating and an antireflective system onto a plastic substrate, in particular spectacle lenses by consecutive plasma and sputtering methods
02/02/2000EP0977065A2 Ultrasound welding of optical components
02/02/2000EP0975819A1 Apparatus and method for inductively-coupled-plasma-enhanced ionized physical-vapor deposition
02/02/2000EP0975818A1 Method and device for pvd coating
02/02/2000EP0975435A1 Modular coating fixture
02/02/2000EP0910683B1 Vacuum coating system with a coating chamber and at least one source chamber
02/02/2000CN2361639Y Anti-forging marker device for metal device
02/02/2000CN1243599A Vapour deposition coating apparatus
02/02/2000CN1243330A System and method for cleaning ion source in course of using
02/02/2000CN1243323A Metal oxidation film resistor and mfg. technology thereof
02/02/2000CN1243322A Metal film high-resistance resistor and mfg. technology thereof
02/02/2000CN1243171A High sputtering-resistant target material containing mixed rare-earth elements
02/02/2000CN1049017C Method for sedimenting TiO2/TiN composite pellicle on artificial organ surface
02/01/2000US6021152 Reflective surface for CVD reactor walls
02/01/2000US6020686 Inductively and multi-capacitively coupled plasma reactor
02/01/2000US6020592 Dose monitor for plasma doping system
02/01/2000US6020035 Film to tie up loose fluorine in the chamber after a clean process
02/01/2000US6019913 Low work function, stable compound clusters and generation process
02/01/2000US6019876 Pulsed DC sputtering method of thin film magnetic disks
01/2000
01/27/2000WO2000004575A2 Collimated sputtering of semiconductor and other films
01/27/2000WO2000004209A2 Method for covering bodies made of light metal or light metal alloys by means of a plasma activated process
01/27/2000WO2000004204A1 Thin film stent
01/27/2000WO2000004203A1 Sputtering target and part for thin film-forming apparatus
01/27/2000WO2000004202A1 Method for preparing high purity ruthenium sputtering target and high purity ruthenium sputtering target
01/27/2000WO2000004201A1 Method for improving the corrosion protection of permanent magnets containing rare earth metals
01/27/2000DE19935053A1 Ultrafine particle deposition method for formation of thin film
01/27/2000DE19833123A1 Adherent cubic boron nitride layer production, especially for iron alloy machining tools or optical components, comprises initially depositing an adhesion promoting boron nitride layer by pulsed laser deposition
01/27/2000DE19833056A1 PVD of titanium aluminum nitride coatings for metal substrates, e.g. high speed steel or tungsten carbide cutting or working tools, comprises vanadium ion etching of the substrate surfaces prior to coating
01/27/2000DE19832908A1 Dispersed composite materials, e.g. catalysts, abrasives, resistors, soldering or welding materials, or nuclear conversion materials, are produced by plasma deposition on a dust plasma of fine particles
01/27/2000DE19832571A1 Mehrlagenschicht und Verfahren zu deren Herstellung The multilayered sheet and process for their preparation
01/27/2000DE19832299A1 Corrosion resistant sintered material, especially a sintered rare earth permanent magnet, is produced by pickling to remove adhering surface particles and surface passivation prior to metal coating
01/27/2000DE19831370A1 Plasma aided coating of workpieces made of light metals or light-metal alloys includes production of an intermediate metal oxide layer on the workpiece surface by anodic oxidation, and drying of this layer prior to plasma aided coating
01/27/2000DE19830404A1 Apparatus for sputter coating of substrates with use of variable plasma potential has an additional electrode in at least one plasma space between magnetrons and substrate
01/27/2000DE19826583A1 Method for measuring gaseous chemical constituents in process reactor serving for treatment of electrical components, measurements taking place in situ by means of at least one residual gas analysis unit communicating with process chamber
01/27/2000CA2337863A1 Thin film stent
01/26/2000EP0975013A2 Method of manufacturing an oxide layer on a GaAs-based semiconductor body
01/26/2000EP0975006A2 Plasma density measuring method, probe used for measuring plasma density and plasma density measuring apparatus
01/26/2000EP0974684A1 Multilayer and method for its manufacture
01/26/2000EP0974681A1 Method and apparatus for calibrating the gas pressure in a vacuum working chamber (vacuum coating chamber or recipient)
01/26/2000EP0974615A1 Aliphatic polyester film and gas barrier film
01/26/2000EP0974162A1 A low-stress and low-resistivity metal film