Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
05/2000
05/03/2000EP0996767A1 Reflective surface for cvd reactor walls
05/03/2000EP0996765A1 Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
05/03/2000EP0996762A2 Method for bias sputtering
05/03/2000EP0745147B1 Method and apparatus for coating a substrate
05/03/2000EP0729520B1 Method for coating the inside walls of hollow articles, in particular of small dimensions
05/03/2000CN1251934A Aluminium oxide film and magnetic memory unit having same
05/03/2000CN1251866A Vapor deposition apparatus
05/02/2000US6057237 Tantalum-containing barrier layers for copper
05/02/2000US6057236 CVD/PVD method of filling structures using discontinuous CVD AL liner
05/02/2000US6057233 Laser ablation in a vacuum chamber to cause emission of a substance from the target and vapor depositing a thin film on a substrate
05/02/2000US6057223 Passivated copper conductive layers for microelectronic applications
05/02/2000US6057047 Porous ceramic material of at least 10 layers where at least three layers have 20% by volume porosity and at least one other layer has less than 5% by vol. porosity; thermal barrier; coated gas turbine engine components
05/02/2000US6057038 Organic insulating film, and either an inorganic insulating film or transparent conductive film; the two films are adhered with a silane coupling having alkoxy group and either a polyether, alkyl, or epoxy group; silazane; or chlorosilane
05/02/2000US6056857 Cryogenic annealing of sputtering targets
05/02/2000US6056849 Apparatus for the surface treatment of workpieces by means of a plasma
05/02/2000US6056826 Vacuum coating device for coating substrates on all sides
05/02/2000US6056825 Rotary chuck including pins for lifting wafers
05/02/2000US6055928 Plasma immersion ion processor for fabricating semiconductor integrated circuits
05/02/2000US6055740 Vacuum processing apparatus and operating method therefor
05/02/2000CA2077902C Arc diverter
04/2000
04/27/2000WO2000023634A1 Method and device for cleaning a product
04/27/2000WO2000023633A1 Shutter for thin-film processing equipment
04/27/2000WO2000023201A1 Superalloy component with abrasive grit-free coating
04/27/2000WO2000004209A3 Method for covering bodies made of light metal or light metal alloys by means of a plasma activated process
04/27/2000DE19848177A1 Vapor deposition of release agent for capacitor film has a closed hollow body evaporation vessel connected to the jet body with a shut off device
04/27/2000DE19834733C1 Vorrichtung und Verfahren zur Beschichtung und/oder Oberflächenmodifizierung von Gegenständen im Vakuum mittels eines Plasmas Apparatus and method for coating and / or surface modification of articles by means of a plasma in a vacuum
04/26/2000EP0996316A1 Tunable and matchable resonator coil assembly for ion implanter linear accelerator
04/26/2000EP0995812A1 Apparatus for flow-line treatment of articles in an artificial medium
04/26/2000EP0995811A2 Process for depositing a protective coating
04/26/2000EP0995220A2 Target cathode assembly
04/26/2000EP0995217A1 Scanning wheel for ion implantation process chamber
04/26/2000EP0995214A1 Method and apparatus for neutralising space charge in an ion beam
04/26/2000CN1051878C Semiconductor device and its mfg. method, and mfg. method for transparent film
04/25/2000US6054744 Grain boundary stuffing provides for structural film stability required during severe thermal cycles that occur during subsequent processing of semiconductors
04/25/2000US6054331 Apparatus and methods of depositing a platinum film with anti-oxidizing function over a substrate
04/25/2000US6054191 Decarbonization of a titanium nitride/silicon interface with an plasma gas activated to react with the carbon present from the organotitanium compound used in the vapor disposition of the nitride layer; transforming to a lower electrical
04/25/2000US6054185 Substrate with superhard coating containing boron and nitrogen and method of making the same
04/25/2000US6054184 Supporting article in proximity to separate deposition sources of different ceramic materials in a vessel; simultaneously heating and melting ceramics to produce vaoprs; exposing and interrupting exposure of surface of article to deposit vapors
04/25/2000US6054029 Device for gripping, holdings and/or transporting substrates
04/25/2000US6054024 Apparatus for forming transparent conductive film by sputtering and method therefor
04/25/2000US6053981 Effusion cell and method of use in molecular beam epitaxy
04/25/2000CA2017206C Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
04/20/2000WO2000022652A2 Superconducting structure including mixed rare earth barium-copper compositions
04/20/2000WO2000022648A1 Ionized metal plasma source, comprising a centrally arranged additional rf coil
04/20/2000WO2000022186A1 Apparatus for flow-line treatment of articles in an artificial medium
04/20/2000WO2000022185A1 Sputter target/backing plate assembly and method of making same
04/20/2000WO2000022184A1 Laser deposition of thin films
04/20/2000DE19947983A1 Aluminum oxide film, especially for a magnetic storage device magnetic head or an ink jet print head drive mechanism, contains magnesium oxide, lanthanum oxide and/or yttrium oxide
04/20/2000DE19944977A1 Beschichtungen zur Anwendung bei Brennstoffeinspritzvorrichtungskomponenten Coatings for use in fuel injector components
04/20/2000DE19848025A1 Verfahren zur Oberflächenbehandlung von Werkzeugen und Werkzeuge mit behandelter Oberfläche A method of surface treatment of tools and tools with a treated surface
04/20/2000DE19842515C1 Surface treatment of metallic materials comprises plasma-activated thermo-chemical diffusion of a property-changing material from the plasma of a gaseous treatment atmosphere using a target positioned in an electric field
04/20/2000CA2344040A1 Superconducting structure including mixed rare earth barium-copper compositions
04/19/2000EP0994203A2 Dosimetry cup charge collection in plasma immersion ion implantation
04/19/2000EP0994202A2 Method for improving electrical conductivity of metals, metal alloys and metal oxides
04/19/2000EP0994201A2 Method for surface treatment of tools
04/19/2000EP0993511A1 Apparatus and method for multi-target physical vapour deposition
04/19/2000EP0795041B1 A PROCESS FOR IN-SITU DEPOSITION OF A Ti/TiN BARRIER METAL STACK
04/19/2000CN2374553Y Mussel dual-chamber column arc source multi-arc ion film coating machine
04/19/2000CN1251142A Method and apparatus for mfg. thin film, thin film laminate, and electronic parts
04/19/2000CN1250822A Surface treatment holder and holding frame, and method and equipment therefor
04/19/2000CN1250821A Automatically disinfecting and zinc-supplementing stainless steel utensils and its manufacture process
04/19/2000CN1250762A Process for preparing boron nitride compounded conducting ceramic evaporator by non-pressure sinter method
04/18/2000US6051743 Process for the preparation of predominantly unbranched higher primary alcohols
04/18/2000US6051121 Deposition chamber with a biased substrate configuration
04/18/2000US6051120 Thin film forming apparatus
04/18/2000US6051115 Adhesive strength increasing method for metal thin film
04/18/2000US6051114 Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition
04/18/2000US6051113 Vacuum chamber containing a substrate support, stationary target(s) and movable target(s) each of a different deposition material wherein the targets can be accurately aligned over substrate for controlled deposition
04/18/2000US6051066 End effector assembly for inclusion in a system for producing uniform deposits on a wafer
04/18/2000US6050218 Dosimetry cup charge collection in plasma immersion ion implantation
04/13/2000WO2000021120A1 Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system
04/13/2000WO2000021079A2 Optical data storage disk
04/13/2000WO2000020656A1 A method of metallizing the surface of a solid polymer substrate and the product obtained
04/13/2000WO2000020654A1 Sputtering target assembly of oxide sintered body
04/13/2000DE19947174A1 Mask holder with clamps on disc-shaped frame for exposure of semiconductor wafers in ion lithography
04/13/2000DE19846602A1 Vaporizer for vaporizing e.g. aluminum to coat substrates in a vacuum deposition apparatus has a housing for the vaporizing chamber and an electrical heater
04/12/2000EP0992612A2 Nickel aluminide coating systems
04/12/2000EP0992607A1 Substrate holder
04/12/2000EP0992606A2 A method of applying a coating to a metallic article and an apparatus for applying a coating to a metallic article
04/12/2000EP0992605A2 Support member, holder, process, and apparatus in the field of surface-treatment
04/12/2000EP0992604A2 Method for controlling the refractive index of a dry plating film
04/12/2000EP0992603A1 Thermal barrier coating systems and materials
04/12/2000EP0992472A2 Corrosion-resistant members against a chlorine-based gas
04/12/2000EP0992281A2 The combinatorial synthesis of novel materials
04/12/2000EP0992072A1 Controlled conversion of metal oxyfluorides into superconducting oxides
04/12/2000EP0992063A1 A titanium nitride diffusion barrier for use in non-silicon technologies and metallization method
04/12/2000EP0991791A1 Packaging material
04/12/2000EP0721438B1 Method of manufacturing a composite material with lamellar interphase between reinforcing fibres and matrix, and material obtained
04/12/2000CN1250587A Model based temperature controller for semiconductor thermal processors
04/12/2000CN1250487A Method of forming internal passages within articles and articles formed by same
04/12/2000CN1250486A Plastic containers with an external gas barrier coating
04/12/2000CN1051263C 氧化物涂层切削刀具 Oxide coated cutting tool
04/11/2000US6048786 Process for forming fluorinated resin or amorphous carbon layer and devices containing same
04/11/2000US6048442 Forming on the back electrode layer a stacked precursor film including a copper-gallium alloy layer and an indium layer by sputtering, and then heating the precursor film in an atmosphere of selenium and/or sulfur.
04/11/2000US6048154 High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
04/11/2000US6047660 Apparatus and method to form coated shielding layer for coaxial signal transmission cables
04/11/2000CA2134217C Anti-microbial coating for medical devices
04/11/2000CA2128743C An optical film, an antireflection film, a reflection film, a method for forming the optical film, the antireflection film or the reflection film and an optical device
04/11/2000CA2060956C Evaluation of the extent of wear of articles
04/06/2000WO2000019494A1 Method for manufacturing carbon nanotubes as functional elements of mems devices