Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
09/2000
09/20/2000CN1267061A Electrically conducting transparent film and its preparing process
09/20/2000CN1266912A Super-lattice BaTiO3 material with new structure and multiple performance
09/19/2000US6121647 A perovskite crystalline lead, titanium and a rare earth oxide used in a semiconductor device, e.g., nonvolatile memories; infrared sensors; optical modulators, switches, integrated circuits; reduced leakage; reverse polarity
09/19/2000US6121630 Layer of a mixed oxide of yttrium or a lathanide, barium and copper deposited on a sapphire substrate and covered with a protective layer comprising a crystalline film of strontium titanate; high critical temperature; storage stability
09/19/2000US6121178 Sintered ITO and an ITO sputtering target
09/19/2000US6121161 Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions
09/19/2000US6121134 High aspect ratio metallization structures and processes for fabricating the same
09/19/2000US6120975 Methods for production of a plasma display panel
09/19/2000US6120891 Comprises an oxide of at least one of niobium, titanium, tantalum, zirconium, cerium, tungsten, molybdenum, iron, or lead; chemical sensors and electrochromic devices
09/19/2000US6120857 Low work function surface layers produced by laser ablation using short-wavelength photons
09/19/2000US6120844 Depositing self-aligning epsilon layer ofdeposition material on workpiece; depositing conducting material over epsilon layer
09/19/2000US6120660 Removable liner design for plasma immersion ion implantation
09/19/2000US6120656 Topographically precise thin film coating system
09/19/2000US6120286 Vaporizer boat for metal vaporizing
09/19/2000US6119626 Vacuum apparatus for forming a thin-film and method for forming thin-film
09/19/2000US6119485 Press-molding die, method for manufacturing the same and glass article molded with the same
09/14/2000WO2000038213A3 Physical vapor deposition of semiconducting and insulating materials
09/14/2000WO2000018980A8 An in-line sputter deposition system
09/14/2000DE19910786A1 Magnetron cathode used in atomizing target, includes sealed liquid cooling system to prevent former corrosive damage, in construction dispensing with costly special fasteners
09/13/2000EP1035757A1 Substrate electrode plasma generator and substance/material processing method
09/13/2000EP1035589A2 Iridium composite barrier structure and method for same
09/13/2000EP1035561A2 Refractory coated component for use in thin film deposition and method for making
09/13/2000EP1035553A1 Laminate, capacitor, and method for producing laminate
09/13/2000EP1034316A1 High purity cobalt sputter target and process of manufacturing the same
09/13/2000EP0820359B1 Method and apparatus for circuit board treatment
09/13/2000EP0811237B1 Deposition apparatus
09/13/2000CN1266279A Method for forming barrier layer used for copper interconnection
09/13/2000CN1266107A Apparatus for preparing diamond-like film
09/13/2000CN1056465C Thin-film scandium series cathode and its preparation process
09/12/2000US6117771 Method for depositing cobalt
09/12/2000US6117572 A barrier dielectric in high critical temperature thin film superconductors, ferroelectrics, pyroelectrics, piezoelectrics and microwave devices
09/12/2000US6117560 A ceramic surface coatings has a cubic pyrochlore structure
09/12/2000US6117559 Double-sided reflector films
09/12/2000US6117533 Substrate with a superhard coating containing boron and nitrogen and method of making the same
09/12/2000US6117498 Single source thermal ablation method for depositing organic-inorganic hybrid films
09/12/2000US6117283 Forming a slider body having a leading end, a trailing end, and an air-bearing surface, forming a single exterior layer of elemental silicon on air-bearing surface to form an exterior wear resistance protective contact layer
09/12/2000US6117282 Method of producing amorphous Co-Tb magnetic recording thin films
09/12/2000US6117281 A magnetron sputtering target is formed with radially extending grooves to reduce particle contamination during sputtering, which attract redeposited material for resputtering during early stages fine particle nucleation
09/12/2000US6117280 Duplex coated steel composite products and method of manufacturing them
09/12/2000US6117279 Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition
09/12/2000US6117238 End effector assembly for inclusion in a system for producing uniform deposits on a wafer
09/12/2000CA2190086C An electron jet vapor deposition system
09/08/2000WO2000052734A1 Method and apparatus for ionized physical vapor deposition
09/08/2000WO2000052221A1 Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
09/08/2000WO2000052220A1 Method and device for coating a product
09/08/2000WO2000029636A3 High purity tantalum targets for sputtering
09/08/2000CA2363470A1 Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
09/07/2000DE19913802C1 Thermal barrier coatings are electron beam vapor deposited on high temperature substrates using transport units coupled to media supplies within chambers and briefly uncoupled for transport to the next chamber
09/06/2000EP1033745A2 Method for forming a barrier layer for use in a copper interconnect
09/06/2000EP1033417A1 Process and apparatus for coating a product, especially a high temperature gas turbine component
09/06/2000EP1033416A1 Decorative corrosion and abrasion resistant coating
09/06/2000EP1033355A1 Target for transparent electroconductive film, transparent electroconductive material, transparent electroconductive glass and transparent electroconductive film
09/06/2000EP1033068A1 Plasma processing apparatus having rotating magnets
09/06/2000EP1032947A1 Uhv-compatible in-situ pre-metallization clean and metallization of semiconductor wafers
09/06/2000EP1032944A1 Planar magnetron with moving magnet assembly
09/06/2000EP1032727A1 Thin films having a rock-salt-like structure deposited on amorphous surfaces
09/06/2000EP1032721A2 Wear-resistant, mechanically highly stressed and low-friction boundary coating construction for titanium or the alloys thereof and a method for producing the same
09/06/2000CN1265714A Surface coatings
09/06/2000CN1265431A Vapor deposition device
09/05/2000US6113993 Contacting the gas flow of calcium compounds and phosphate compounds and plasma with a heated substrat at a minimum temperature to decompose the precursor and forming calcium phosphate compund coating having specific thickness
09/05/2000US6113985 In the lower temperature zone, the solid reactant is vaporized and transported toward the molten metal, the reaction occurs in higher temperature zone, where metal reacts with halide to produce desired metal nitride and by-products
09/05/2000US6113761 Copper sputtering target assembly and method of making same
09/05/2000US6113754 Sputtering apparatus having a target backing plate equipped with a cooling line and sputtering method using the same
09/05/2000US6113753 Systems and methods for making a magnetic recording medium on a flexible metal substrate
09/05/2000US6113752 Sputtering
09/05/2000US6113751 Electromagnetic beam assisted deposition method for depositing a material on an irradiated substrate
09/05/2000US6113750 Method of forming thin metal films
09/05/2000US6113749 Sputtering method in multi-chambered device
09/05/2000US6113702 Wafer support system
09/05/2000US6113700 Gas diffuser having varying thickness and nozzle density for semiconductor device fabrication and reaction furnace with gas diffuser
09/05/2000US6112431 Vacuum processing and operating method
08/2000
08/31/2000WO2000051139A1 Transparent conductive laminate, its manufacturing method, and display comprising transparent conductive laminate
08/31/2000WO2000050663A1 Diffusion method for coating high temperature nickel chromium alloy products
08/31/2000WO2000050662A1 Magnetron sputtering method and apparatus
08/31/2000WO2000028103A3 Vapor source having linear aperture and coating process
08/30/2000EP1032032A2 Tailoring of a wetting/barrier layer to reduce electromigration in an aluminium interconnect
08/30/2000EP1031639A1 Apparatus for gas flow sputtering
08/30/2000EP1030880A1 Electrically conductive filler and method for the production thereof
08/30/2000EP0907764B1 Cutting tool and manufacturing method therefor
08/30/2000CN1265222A Method and appts. for ionized sputtering of materials
08/30/2000CN1265052A Method and appts. for zone lubrication of magnetic media
08/29/2000US6111648 Black roll for optical measurement, thin film forming apparatus including the dame, and thin film forming method using the same
08/29/2000US6110844 Reduction of particle deposition on substrates using temperature gradient control
08/29/2000US6110840 Method of passivating the surface of a Si substrate
08/29/2000US6110821 Sputtering metal material from target while maintaining power to coil, shutting off power to target and passing gas through substrate support to backside, powering target and coil and passing gas to backside of substrate to heat to form silicide
08/29/2000US6110604 Metallic article having a thermal barrier coating and a method of application thereof
08/29/2000US6110598 Low resistive tantalum thin film structure and method for forming the same
08/29/2000US6110571 Having a first diffusion layer formed of steel alloy with nitrogen atoms diffused therein, and a second layer of a hard film which contains at least one of a nitride, carbide or carbonitride of a metal
08/29/2000US6110337 Sputtering method and apparatus with optical monitoring
08/29/2000US6110330 Process for bonding lubricant to magnetic disk
08/29/2000US6110329 Method of manufacturing a composite material
08/29/2000US6110328 Method of an apparatus for sputtering
08/29/2000US6110291 Thin film forming apparatus using laser
08/29/2000US6110204 Implant substrate being coated with a material which contains chemical compounds between one or more metals of group iv a of the periodic system, nitrogen and oxygen
08/29/2000US6109880 Getter pump module and system including focus shields
08/29/2000US6109207 Process for fabricating semiconductor device with shallow p-type regions using dopant compounds containing elements of high solid solubility
08/29/2000US6108929 Vacuum processing apparatus
08/25/2000CA2299482A1 Magnetron sputtering method and apparatus
08/24/2000WO2000049201A1 Method for providing machining tools with a protective coating and associated tool set
08/24/2000WO2000049196A1 Plasma deposition method and apparatus with magnetic bucket and concentric plasma and material source