Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
02/2001
02/14/2001EP1076355A2 Method and apparatus for cleaning a chamber configured for copper deposition
02/14/2001EP1076354A2 Vacuum processing apparatus and operating method therefor
02/14/2001EP1076352A2 High-density plasma source for ionized metal deposition
02/14/2001EP1076110A1 Cooling gas used with a self-sputtering method
02/14/2001EP1076108A1 Process for treating the surface of a component, made from a Ni based superalloy, to be coated
02/14/2001EP1076106A1 Process for masking cooling holes of a gas turbine component
02/14/2001EP1075707A1 Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
02/14/2001EP0828696B1 Mixed oxide high index optical coating material and method
02/14/2001CN1284136A Modification of surfaces in order to increase surface tension
02/14/2001CN1283952A Method for mag. electroluminescence display and appts. for forming film
02/14/2001CN1283895A Film Resonator device and its mfg. method
02/14/2001CN1283709A Method for treating Ni-based high temp alloy parts surface of ready-plating coat
02/13/2001US6188134 Electronic devices with rubidium barrier film and process for making same
02/13/2001US6187682 Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material
02/13/2001US6187453 Article having a durable ceramic coating
02/13/2001US6187445 In compact disk(cd) players and digital video disk(dvd) players
02/13/2001US6187253 Annealing powder mixture consisting of coprecipitated indium oxide and tin oxide to form solid solution of specified grain size, partially reducing, compacting by hot isostatic pressing
02/13/2001US6187160 Apparatus for the coating of substrates in a vacuum chamber
02/13/2001US6187159 Mechanism for setting optical lens base material on holder
02/13/2001US6187158 Device for coating plate-shaped substrates
02/13/2001US6187151 Method of in-situ cleaning and deposition of device structures in a high density plasma environment
02/13/2001US6187101 Substrate processing device
02/13/2001US6187089 Depositing tungsten on the inside surface of the crucible and diffusing the tungsten into the inside surface and depositing tungsten on the outside surface of the crucible and diffusing the tungsten into the outside surface
02/13/2001US6186091 Shielded platen design for plasma immersion ion implantation
02/13/2001US6186090 Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
02/08/2001WO2001009406A1 Method of surface modification for metal product
02/08/2001WO2001009052A1 Transparent conductor and means for making same
02/08/2001WO2001009051A1 Decorative coating
02/08/2001DE19938945C1 Application of carbon layers to a substrate for producing hard carbon layers for e.g. barcodes, infra-red absorbers, comprises an evacuated chamber containing a graphite target, argon gas and an applied electric field
02/08/2001DE19935181A1 Organische Schutzschicht für vakuumtechnisch bearbeitete Produkte Organic protective layer for vacuum-processed products
02/08/2001DE19930312C1 Process for treating a surface of a workpiece comprises implanting ions into the workpiece at a specified temperature up to a specified depth
02/08/2001CA2345365A1 Method of surface modification for metal product
02/07/2001EP1075023A1 Unprocessed material storing device and carry-in/out stage
02/07/2001EP1074639A1 Fabrication of clad hollow cathode magnetron sputter targets
02/07/2001EP1074638A1 Process for coating an article
02/07/2001EP1074637A1 Method for forming a thermal barrier coating by electron beam physical vapor deposition
02/07/2001EP1074045A1 Method for forming a multi-layered aluminum-comprising structure on a substrate
02/07/2001EP1073776A1 Method for electron beam applying leader free coating
02/07/2001CN1283213A Electrically conductive filer and method for the preparation thereof
02/07/2001CN1282980A Method of manufacturing semi-conductor device
02/06/2001US6184550 For use as conductive barrier layers in integrated circuit memory cell structures including ferroelectric or high permittivity capacitors; the nitride-carbide material includes specified metal(s)
02/06/2001US6184536 Ion implantation process
02/06/2001US6184532 Ion source
02/06/2001US6184157 Stress-loaded film and method for same
02/06/2001US6183884 Metallic article having a thermal barrier coating and a method of application thereof
02/06/2001US6183883 Soldering and brazing material comprising metal base and halide layer having specified thickness formed on surface of said metal base
02/06/2001US6183843 Method for producing low reflectance diamond and products therefor
02/06/2001US6183831 Hard disk vapor lube
02/06/2001US6183820 Method of internally coating a metal tube by explosive evaporation of the coating substance
02/06/2001US6183686 Sputter target assembly having a metal-matrix-composite backing plate and methods of making same
02/06/2001US6183614 Rotating sputter magnetron assembly
02/06/2001US6183613 Sputter target/backing plate assembly and method of making same
02/06/2001US6183612 Sputtering cathode
02/06/2001US6183606 Manufacture method of high coercivity FePt-Si3N4 granular composite thin films
02/06/2001US6183605 Sputtering dielectrics
02/06/2001US6183564 Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system
02/06/2001US6183552 Vapor deposition
02/06/2001US6182604 Hollow cathode for plasma doping system
02/01/2001WO2001008199A1 Substrate and workpiece support for receiving a substrate
02/01/2001WO2001007249A2 Protective organic layer for vacuum technology processed products
02/01/2001WO2001007197A1 Apparatuses and methods for applying an indelible and contrasting pattern onto a carrier
02/01/2001DE19932444C1 Production of a texture layer made of an oxide material on a substrate comprises partially fading out sputter ions that are scattered back from the sputtering target so that the larger part
02/01/2001CA2379397A1 Apparatuses and methods for applying an indelible and contrasting pattern onto a carrier
01/2001
01/31/2001EP1073198A2 Thin film resonator apparatus and method of making same
01/31/2001EP1073197A2 Method for producing oriented piezoelectric films
01/31/2001EP1073114A2 Integrated circuit capacitor including anchored metal plug
01/31/2001EP1073102A2 Liners formed by ionized metal plasma deposition for gate electrode applications
01/31/2001EP1072692A2 Method and assembly for assessing quality of a coating process
01/31/2001EP1072418A2 High efficiency printhead containing a nitride-based resistor system
01/31/2001EP1072055A1 Means for controlling target erosion and sputtering in a magnetron
01/31/2001EP1072054A1 Retaining ring and target and method for producing same
01/31/2001EP1071832A1 Organic substrate having optical layers deposited by magnetron sputtering and method for preparing it
01/31/2001CN2417168Y Self-cleaning type glass sheet
01/31/2001CN1282384A Magnetron sputtering source
01/31/2001CN1282091A Method for manufacturing display base plate and display base plate made by said method
01/31/2001CN1061387C Method for forming diamond-like carbon film (DLC), DLC film formed thereby, use of the same, field emitter array and field emitter cattodes
01/31/2001CN1061386C 密封装置 Sealing device
01/30/2001US6181727 Coating for reducing operating temperatures of chamber components of a coating apparatus
01/30/2001US6180954 Dual-walled exhaust tubing for vacuum pump
01/30/2001US6180912 Fan-out beams for repairing an open defect
01/30/2001US6180570 Biaxially textured articles formed by plastic deformation
01/30/2001US6180253 Brazing or soldering material and production method thereof
01/30/2001US6179976 Surface treatment and method for applying surface treatment to suppress secondary electron emission
01/30/2001US6179975 Method of monitoring target/component consumption for dual use titanium/titanium nitride sputtering
01/30/2001US6179974 Apparatus and methods for sputtering
01/30/2001US6179923 Deposition apparatus for an organic thin-film light-emitting element
01/30/2001US6179921 Backside gas delivery system for a semiconductor wafer processing system
01/29/2001CA2314302A1 Method for producing oriented piezoelectric films
01/25/2001WO2001006318A1 Phase shifter film and production method therefor
01/25/2001WO2001006284A1 Solderable thin film
01/25/2001WO2001006033A1 Method of coating an article
01/25/2001WO2001006032A1 Method for forming metallic tungsten film
01/25/2001WO2001006030A1 High throughput thin film deposition for optical disk processing
01/25/2001WO2001006029A1 Sputtering target
01/25/2001WO2001006026A2 Aluminium-titanium alloy with high specular reflectivity, reflecting coatings comprising same and mirrors and parts comprising said coating
01/25/2001WO2000058995A3 Apparatus for improving plasma distribution and performance in an inductively coupled plasma
01/25/2001DE19934418A1 Verfahren zum Beschichten einer lokal unterschiedlich beanspruchten Komponente A method for coating a locally differently stressed component
01/25/2001DE19934114A1 Substrate carrier used to holding thin layer substrates during the manufacture of high pressure sensor elements comprises a base element for receiving the substrate arranged on a handling element having covering elements
01/25/2001DE10022274A1 Production of corrosion resistant layers on steel substrates comprises etching the substrate with niobium or tantalum ions before coating using a PVD process
01/25/2001CA2379704A1 Method of coating an article