Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
04/2001
04/18/2001EP1092991A2 Adhesion layer for optical coatings
04/18/2001EP1092787A2 Process for coating plastic surfaces in a vacuum
04/18/2001EP1092515A1 Atomically sharp edged cutting blades and methods for making same
04/18/2001EP1092109A1 Vacuum tight coupling for tube sections
04/18/2001EP1092050A1 Contoured sputtering target
04/18/2001EP0909341B1 Process for the production of metallic coatings on semiconductor structures
04/18/2001CN1291939A Metal foil disk for high areal density recording in environments of high mechanical shock
04/18/2001CN1291825A Method of producing piezoelectric film with orientation
04/18/2001CN1291660A Process for preparing mask for organic vacuum coating
04/18/2001CN1064720C Vacuum evaporation apparatus
04/17/2001US6218033 Such as chromium titanium copper or chromium titanium vanadium alloys
04/17/2001US6218029 Thermal barrier coating for a superalloy article and a method of application thereof
04/17/2001US6218028 High coercivity magnetic recording medium comprising a sputter textured layer
04/17/2001US6217969 A sputtering target disk is made of silicon carbide, obtained by sintering a uniform mixture of a powder of silicon carbide and nonmetallic auxillary sintering agent; useful for sputtering treatment for forming thin protective films
04/17/2001US6217952 Method of forming films over inner surface of cylindrical member
04/17/2001US6217730 Sputtering device
04/17/2001US6217724 Coated platen design for plasma immersion ion implantation
04/17/2001US6217723 Method of manufacturing a multilayer film
04/17/2001US6217721 Filling plug having high aspect ratio by precoating interior of plug hole or other aperture with liner layer deposited by physical vapor deposition utilizing high-density plasma
04/17/2001US6217720 Multi-layer reactive sputtering method with reduced stabilization time
04/17/2001US6217719 Forming thin film having refractive index varying stepwise or continuously in thickness direction by sputtering while introducing nitrogen-containing gas, oxygen-containing gas and fluorine-containing gas with varying flow rate ratio
04/17/2001US6217718 Apparatus having plasma generating coil positioned within processing chamber so as to prevent or minimize variations about center axis of processing chamber in quantity of ions delivered to workpiece
04/17/2001US6217717 Periodically clearing thin film plasma processing system
04/17/2001US6217716 Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
04/17/2001US6217715 Coating of vacuum chambers to reduce pump down time and base pressure
04/17/2001US6217714 Sputtering apparatus in vacuum chamber having gas supply, having three discrete separated electrodes, with associated targets and magnets, fixed substrate support, variable power supplies connected to electrodes
04/17/2001US6217272 In-line sputter deposition system
04/17/2001US6216631 Robotic manipulation system utilizing patterned granular motion
04/17/2001CA2238319C Sputtering of lithium using alternating sputtering potential
04/17/2001CA2089147C Cantilever mount for rotating cylindrical magnetrons
04/12/2001WO2001025501A1 Method for producing cobalt-based alloy sputter target
04/12/2001WO2001025500A1 Method and device for production of plane-parallel wafers
04/12/2001WO2001006026A3 Aluminium-titanium alloy with high specular reflectivity, reflecting coatings comprising same and mirrors and parts comprising said coating
04/12/2001DE10049536A1 Ion source arrangement has ion source movable relative to chamber along fixed curve essentially in horizontal plane to enable access to inner wall of chamber
04/12/2001DE10038290A1 SIMOX semiconductor structure e.g., wafer comprises a silicon substrate, a doped glass layer produced by ion implantation on the substrate and a silicon layer on the substrate
04/11/2001EP1091387A2 Coil for sputter deposition
04/11/2001EP1091360A2 Multilayer film structure for soft X-ray optical elements
04/11/2001EP1091017A2 Coating apparatus having reflective inside coating
04/11/2001EP1091016A2 Self ionized plasma for sputtering copper
04/11/2001EP1091015A1 Co-Ti ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD THEREOF
04/11/2001EP1091014A1 Ex-situ coating of refractory metal on IMP coils
04/11/2001EP1090420A1 Endpoint detection in the fabrication of electronic devices
04/11/2001EP1090416A2 Collimated sputtering of semiconductor and other films
04/11/2001EP1090158A1 Spraying method to form a thick coating and products obtained
04/11/2001EP1090153A1 Tantalum sputtering target and method of manufacture
04/11/2001EP1089945A1 Thermochromic coating
04/11/2001EP0892861B1 Boron and nitrogen containing coating and method for making
04/11/2001EP0832310A4 Electrically tunable coatings
04/11/2001EP0779941B1 A process for treating aluminium alloys
04/11/2001CN1291241A Apparatus and method for depositing a semiconductor material
04/11/2001CN1064294C Method for producing shaving blades
04/10/2001US6215188 Low temperature aluminum reflow for multilevel metallization
04/10/2001US6214772 Process for preparing polycrystalline thin film, process for preparing oxide superconductor, and apparatus therefor
04/10/2001US6214720 Plasma process enhancement through reduction of gaseous contaminants
04/10/2001US6214712 Heating semiconductor surface and introducing hydrogen gas into high vacuum environment to develop conditions favorable for growing desired metal oxide, yet unfavorable for formation of any native oxides
04/10/2001US6214711 Method of low angle, low energy physical vapor of alloys including redepositing layers of different compositions in trenches
04/10/2001US6214479 Covered member and method of producing the same
04/10/2001US6214474 Oxidation protective coating for refractory metals
04/10/2001US6214422 Cleaning and preparing surface of substrate comprising polymer film by in-line plasma treatment under vacuum; forming polymer film on plasma-treated surface of polymer film by in-line evaporation of monomer in vacuum and radiation curing
04/10/2001US6214413 Stencil used to control deposition of material in a physical vapor deposition (pvd) system
04/10/2001US6214408 Method for the operation of an electron beam
04/10/2001US6214184 Insulated wafer pedestal
04/10/2001US6214183 Combined ion-source and target-sputtering magnetron and a method for sputtering conductive and nonconductive materials
04/10/2001US6214177 Heating, pressurization; liquid phase
04/10/2001US6214120 High throughput multi-vacuum chamber system for processing wafers and method of processing wafers using the same
04/10/2001US6213075 Roller follower assembly for an internal combustion engine
04/10/2001CA2099132C Device and process for the vaporisation of material
04/05/2001WO2001023830A1 Method and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light source
04/05/2001WO2001023642A2 Thermal barrier coatings for turbine components
04/05/2001WO2001023636A1 Method and apparatus for controlling chamber surfaces in a semiconductor processing reactor
04/05/2001WO2001023635A1 Tungsten target for sputtering and method for preparing thereof
04/05/2001WO2001023634A1 Rotating magnet array and sputter source
04/05/2001DE10028594A1 Rollenfolgeanordnung für einen Verbrennungsmotor Roller follower arrangement for a combustion engine
04/04/2001EP1088787A1 Process for producing metal oxide, target comprising the metal oxide for forming thin metal oxide film, process for producing the same, and process for producing thin metal oxide film
04/04/2001EP1088597A2 Radiation cured island coating system
04/04/2001EP1088316A1 Thin electret layer and corresponding production method
04/04/2001EP1088116A1 Method for applying a coating system to surfaces
04/04/2001EP1088115A1 Metal article with fine uniform structures and textures and process of making same
04/04/2001EP1088114A1 A composite material comprising a substrate with a barrier layer
04/04/2001CN1290308A Plasma reactor with a deposition shield
04/04/2001CN1289861A Evaporation coating process with cathode arc for depositing diamond-like carbon film
04/03/2001US6211080 Repair of dielectric-coated electrode or circuit defects
04/03/2001US6211066 Electronic devices with barium barrier film and process for making same
04/03/2001US6210780 Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
04/03/2001US6210755 Method and evaporation chamber for generating a continuous vapor stream containing a compound having monovalent gallium therein, and a vacuum coating apparatus
04/03/2001US6210749 Applying fillerless coating formulation comprising hydrogen silsesquioxane resin onto substrate to form film; heating film in inert or oxygen containing atmosphere to produce insoluble coating free of cracks; depositing silicon dioxide layer
04/03/2001US6210745 Method of quality control for chemical vapor deposition
04/03/2001US6210744 Placing component in coating chamber with an atmosphere having controllable atmosphere composition; maintaining component at constant temperature; establishing vacuum in coating chamber; controlling; depositing material forming thermal barrier
04/03/2001US6210726 Hardness, wear resistance; for metal machining
04/03/2001US6210634 Highly purified titanium material, method for preparation of it and sputtering target using it
04/03/2001US6210545 Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target
04/03/2001US6210542 Process for producing thin film, thin film and optical instrument including the same
04/03/2001US6210541 Process and apparatus for cold copper deposition to enhance copper plating fill
04/03/2001US6210540 Method and apparatus for depositing thin films on vertical surfaces
04/03/2001US6210502 Processing method for high-pure titanium
04/03/2001US6209481 Sequential ion implantation and deposition (SIID) system
04/03/2001CA2196589C Titanium nitride doped with boron, substrate coating based on this new compound, with good hardness conferring very good resistance to wear, and parts bearing such a coating
03/2001
03/29/2001WO2001022470A1 Ion beam vacuum sputtering apparatus and method
03/29/2001WO2001021852A1 A METHOD FOR PRODUCING NiTiHf ALLOY FILMS BY SPUTTERING
03/29/2001WO2001021851A1 Production of ternary shape-memory alloy films by sputtering