Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
01/2001
01/24/2001EP1071117A2 Method of fabricating a display device, and apparatus for forming a thin film
01/24/2001EP1070971A1 Process for treating the surface of plastic optical parts for motor vehicles
01/24/2001EP1070769A1 Process for coating a locally diversely stressed component
01/24/2001EP1070768A1 Method for making silicon nanocluster monolayers in silicon oxide
01/24/2001EP1070767A1 Method for magnetron sputtering
01/24/2001EP1070766A1 Substrate for displays and method for its manufacture
01/24/2001EP1070762A1 Aluminium-titanium alloy having high specular reflectivity, reflective coatings of this alloy and mirrors or components with this coating
01/24/2001EP1070155A1 Integrated ion implant scrubber system
01/24/2001EP1070154A1 Method and apparatus for deposition of biaxially textured coatings
01/24/2001EP0848711B1 Method for the selective hydrogenation of vinyl oxirane to butylene oxide
01/24/2001CN1281058A Equipment and process for low-temp osmosis of metal
01/24/2001CN1281057A Equipment and process for preparing film by pulse aided filter and arc deposition
01/23/2001US6178390 Method for controlling thicknesses of layers formed by deposition equipment for fabricating semiconductor devices
01/23/2001US6177350 Sputter etching the patterned dielectric surface, depositing a continuous wetting layer of titanim over the patterned dielectric surface using ion sputtering, covering the wetting layer with a layer of aluminum
01/23/2001US6177302 Method of manufacturing a thin film transistor using multiple sputtering chambers
01/23/2001US6177200 Thermal barrier coating systems and materials
01/23/2001US6177151 Matrix assisted pulsed laser evaporation direct write
01/23/2001US6177145 Semiconductor processing method of making electrical contact to a node
01/23/2001US6177129 A surface treatment in vacuum station, controlling the timing process by a programmable process controller unit; batch processing; treating semiconductor wafers, memory discs, or machine components, tools
01/23/2001US6177023 Method and apparatus for electrostatically maintaining substrate flatness
01/23/2001US6176987 System for and method of providing a controlled deposition of wafers
01/23/2001US6176986 Hot-press sintering a powdered barium strontium titinate having mean primary particle size of 1mu.m or less at a sintering temperature 1000 to 1300 degree c., for sintering time 1-10 hours under pressure in vacuum or in inert gas
01/23/2001US6176983 Methods of forming a semiconductor device
01/23/2001US6176982 Method of applying a coating to a metallic article and an apparatus for applying a coating to a metallic article
01/23/2001US6176981 Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor
01/23/2001US6176980 A thin film is formed on a substrate whilst alternating between a condition in which deposition is effected with introduction of gas into the vacuum chamber cut off and evacuation from the vacuum chamber cut off
01/23/2001US6176979 At least two surfaces of electro-conductive material are exposed to the vacuum atmosphere atlest one being inpart covered with a material of lower electroconductivity than the material of surface
01/23/2001US6176978 Pasting layer formation method for high density plasma deposition chambers
01/23/2001US6176944 Casting a pure cobalt metal having an intrinsic magnetic permeability and slowly cooling to form a sputter target comprising single hexagonal close packed phase, then hot working, slow cooling and cold working
01/23/2001US6176932 Thin film deposition apparatus
01/23/2001US6176931 Wafer clamp ring for use in an ionized physical vapor deposition apparatus
01/23/2001US6176922 Method for improving crystalline thin films with a contoured beam pulsed laser
01/18/2001WO2001005194A1 Method and apparatus for manufacturing flexible organic el display
01/18/2001WO2001004926A1 Methods and apparatus for alignment of ion beam systems using beam current sensors
01/18/2001WO2001004609A1 Surface flaw detection using spatial raman-based imaging
01/18/2001WO2001004378A1 Device for rotating a substrate to be coated with ceramic and metallic substances in a process chamber
01/18/2001WO2001004375A1 Method and means for drill production
01/18/2001WO2001003879A1 Friction fit target assembly
01/18/2001WO2000062327A3 Rectangular cathodic arc source and method of steering an arc spot
01/18/2001DE3744876C1 Pyrotechnic fuse
01/18/2001DE19933632A1 Verfahren zur Herstellung von Monolagen aus Silizium-Nanoclustern in Siliziumdioxid Process for the preparation of monolayers of silicon nanoclusters in silica
01/18/2001DE19928319C1 Verfahren und Einrichtung zur Substratbeschichtung mittels Sputtern Method and apparatus for coating substrates by sputtering
01/17/2001EP1069612A2 Continuous, non-agglomerated adhesion of a seed layer to a barrier layer
01/17/2001EP1069204A1 Cu/Cr sputter targets
01/17/2001EP1069194A1 Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials
01/17/2001EP1068899A1 Multilayer structure and process for producing the same
01/17/2001EP1068631A1 Use of variable impedance having rotating core to control coil sputter distribution
01/17/2001CN1280631A Apparatus for surface modification of polymer, metal and ceramic materials using ion bean
01/17/2001CN1280387A Metal material for electronic unit, electronic unit, electronic equipment and treating method for metal material
01/16/2001US6174823 Methods of forming a barrier layer
01/16/2001US6174811 Positioning patterned substrate into high density physical vapor deposition chamber and depositing barrier layer of tantalum or tantalun nitride on substrate; depositing copper layers
01/16/2001US6174809 Method for forming metal layer using atomic layer deposition
01/16/2001US6174598 Magnetic recording medium, non-magnetic alloy film and sputtering target
01/16/2001US6174571 Method of using a substrate offset to obtain a specific alloy chemistry from a metal alloy EB-PVD coating process
01/16/2001US6173674 Plasma reactor with a deposition shield
01/14/2001CA2314287A1 Multilayer structure and process for producing the same
01/11/2001WO2001003156A1 METHOD FOR PREPARING A CsX PHOTOSTIMULABLE PHOSPHOR AND PHOSPHORS THEREFROM
01/11/2001WO2001003155A1 Method and apparatus for simultaneously depositing and observing materials on a target
01/11/2001WO2001002620A1 Loading system for pvd coating of cutting inserts
01/11/2001WO2001002619A1 Sputtering device and film forming method
01/11/2001WO2001002618A1 Magnetron unit and sputtering device
01/11/2001WO2001002617A1 Semiconductor vacuum deposition system and method having a reel-to-reel substrate cassette
01/10/2001EP1067593A2 Semiconductor thin film forming system
01/10/2001EP1067584A2 Enhanced cooling IMP coil support
01/10/2001EP1067578A2 Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance
01/10/2001EP1067211A1 Hard coating and coated member
01/10/2001EP1067209A1 Method of bonding a sputtering target to a backing plate
01/10/2001EP1067208A1 Method of making sputtering targets
01/10/2001EP1066899A2 Sputtering target, method of making same, and high-melting metal powder material
01/10/2001EP0842046A4 Hybrid polymer film
01/10/2001CN1279728A Device for vacuum coating slide bearings
01/09/2001US6172009 Controlled conversion of metal oxyfluorides into superconducting oxides
01/09/2001US6172008 Process for preparing high crystallinity oxide thin film
01/09/2001US6171953 Processes for making electronic devices with rubidum barrier film
01/09/2001US6171721 Sputter-deposited fuel cell membranes and electrodes
01/09/2001US6171714 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
01/09/2001US6171712 Palladium and palladium/copper thin flat membranes
01/09/2001US6171659 Producing alternatively, on the one hand, in one deposition zone, one or more deposits of determined thickness of electroconductor element on the substrate, on the other hand, a reaction zone with ions of reactive gases doped in deposits
01/09/2001US6171641 Vacuum processing apparatus, and a film deposition apparatus and a film deposition method both using the vacuum processing apparatus
01/09/2001US6171462 Device for holding lenses, especially for eye glasses to be coated in a vacuum coating or sputtering machine
01/09/2001US6171461 Sputtering cathode
01/09/2001US6171458 Moving a receiver material, spectral selective absorber layer, thermal emittance, atomizing metal in coating zone andsputtering
01/09/2001US6171456 Method for making improved long life bonding tools
01/09/2001US6171455 Sampling and vapor deposition of films with direct current
01/09/2001US6171454 Coating a substrate with sputtering
01/09/2001US6171453 Alignment mark shielding ring and method of using
01/09/2001US6170431 Plasma reactor with a deposition shield
01/09/2001CA2069329C Method for coating substrates with silicon based compounds
01/09/2001CA2016529C Method of forming a pattern on a surface
01/04/2001WO2001001438A1 Ion beam generation apparatus
01/04/2001WO2001001069A1 Method and device for measuring the thickness of a layer
01/04/2001WO2001000900A1 Device for monitoring intended or unavoidable layer deposits and corresponding method
01/04/2001WO2001000899A1 Sputtering target backing plate and sputtering target/backing plate assembly
01/04/2001WO2001000402A1 Wear resistant surface and a method for its manufacturing
01/03/2001EP1065713A2 Staged aluminium deposition process for filling vias
01/03/2001EP1065703A2 Vacuum processing method and apparatus
01/03/2001EP1065696A2 Ion implantation apparatus and ion source and ion source subassembly for use in ion implantation apparatus
01/03/2001EP1065528A2 Radiation image read out method and apparatus
01/03/2001EP1065527A2 Radiation image read-out method and apparatus
01/03/2001EP1065526A2 Radiation image detector