Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
03/2001
03/08/2001WO2001016388A1 Coated grooving or parting insert
03/08/2001WO2001015866A1 Method and device for treating the surface of a part
03/08/2001DE19942025A1 Corrosion-protected sheet steel used, e.g., for a vehicle chassis consists of sheet steel with a layer of zinc or zinc alloy coated with a protective layer made of a mixture of silicon oxide and silicon applied in a vacuum
03/08/2001CA2383082A1 Method and device for the surface threatment of a component
03/07/2001EP1081751A2 Methods of pre-cleaning dielectric layers of substrates
03/07/2001EP1081718A1 Transparent conductive laminate, its manufacturing method, and display comprising transparent conductive laminate
03/07/2001EP1081248A2 ARC type evaporation source
03/07/2001EP1081247A2 Arc type ion plating apparatus
03/07/2001EP1080522A1 Reliable modular production quality narrow-band high rep rate f 2? laser
03/07/2001EP1080248A1 Tool coating and method for the production thereof
03/07/2001EP1080245A2 Zinc-tin alloy sputtering target
03/07/2001EP1080244A1 Anti-adherent coating and method for the production thereof
03/07/2001CN2422291Y Vacuum coating film device
03/07/2001CN1286892A Substrate electrode plasma generator and substance/material processing method
03/07/2001CN1062916C Sputtering pole
03/06/2001US6197471 Flowing argon and hydrogen gas; capacitively coupling radio frequency generator; electrically coupling direct-current supply; forming photoconductive layer by sputter-depositing amorphous containing silicon and hydrogen
03/06/2001US6197438 Foodware with ceramic food contacting surface
03/06/2001US6197391 Pyrolytic boron nitride container and manufacture thereof
03/06/2001US6197367 Magnetic recording medium, method of fabricating magnetic recording medium, and magnetic storage
03/06/2001US6197167 Step coverage and overhang improvement by pedestal bias voltage modulation
03/06/2001US6197166 Method for inductively-coupled-plasma-enhanced ionized physical-vapor deposition
03/06/2001US6197165 Method and apparatus for ionized physical vapor deposition
03/06/2001US6197164 In fabrication of multilayered thin film structures such as magnetoresistive sensors wherein thickness uniformity of multiple layers deposited on substrate are controlled by controlling atom flux deposited on substrate
03/06/2001US6197134 Processes for producing fcc metals
03/06/2001US6197132 Method of manufacturing ferritic stainless FeCrA1-steel strips
03/06/2001US6196936 Coating with a corrosion-resistant, wear-resistant, impact-resistant material, such as zirconium nitride by physical vapor deposition such as cathodic arc process; color of coating can be varied
03/06/2001US6196155 Plasma processing apparatus and method of cleaning the apparatus
03/06/2001US6196154 Air lock for introducing substrates to and/or removing them from a treatment chamber
03/01/2001WO2001014607A1 Aluminum alloy thin film and target material and method for forming thin film using the same
03/01/2001WO2000058995B1 Apparatus for improving plasma distribution and performance in an inductively coupled plasma
03/01/2001DE19952465C1 Production of an adhesive-tight amorphous hydrocarbon layer on a substrate surface for cutting tools uses ion-supported deposition during which the surface of the substrate electrode is temporarily cooled
03/01/2001DE19939700A1 Process for characterizing and improving defect-adhered boundary surfaces in heterostructures on silicon comprises inserting foreign atoms into the heterostructure and detecting by a deep profiling process as boundary surface accumulation
02/2001
02/28/2001EP1079418A2 Vacuum processing apparatus and operating method therefor
02/28/2001EP1078999A2 System and method for fabricating organic electroluminescent display devices
02/28/2001EP1078998A2 Dielectric film with a perovskite structure and method of fabricating the same
02/28/2001EP1078733A1 Transparent conductive film and touch panel
02/28/2001EP1078111A1 Apparatus for sputter deposition
02/28/2001EP1078110A1 Tool or machine component and method for increasing the resistance to wear of said component
02/28/2001EP1077764A1 Method for preparation of libraries using a combinatorial molecular beam epitaxy (combe) apparatus
02/28/2001EP0998592A4 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
02/28/2001EP0821770B1 Concave sliding element and production process therefor
02/28/2001CN1285952A Laminate, capacitor, and method for producing laminate
02/28/2001CN1285419A Electric arc type evaparation source
02/28/2001CN1285253A Electric arc type ion plating device
02/28/2001CN1062673C Magnetic recording disk for contact recording
02/27/2001US6194783 Hillock-free aluminum-containing film consisting of aluminum having trace oxygen content formed by placing substrate in vacuum deposition chamber including aluminum-containing target, evacuating, applying electricity, introducing hydrogen
02/27/2001US6194734 Method and system for operating a variable aperture in an ion implanter
02/27/2001US6194680 Microwave plasma processing method
02/27/2001US6194353 Substrate is heated and an oxidizing gas is locally supplied to the proximity of the substrate so that the pressure of the proximity of the substrate becomes 6 times 10sup6 to 8 times 10sup5 torr at a background pressure
02/27/2001US6194076 Method of forming adherent metal components on a polyimide substrate
02/27/2001US6194031 Vapor deposition; adjusting cross-section of vaporizer aperture
02/27/2001US6194026 Dissolving embedded abrasive particles with hydroxide
02/27/2001US6193856 Sputtering target comprising a substrate and a target material formed on the substrate, wherein the target material comprises a metal oxide of the chemical formula mox as the main component, wherein mox is a metal oxide deficient in oxygen
02/27/2001US6193855 Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage
02/27/2001US6193854 Extended plasma is formed over a very high percentage of the surface of the target, thereby creating an erosion profile that is highly uniform and encompasses essentially the entire face of the target; maximizes utilization of target
02/27/2001US6193853 Elongate emitter used as cathode to coat cylindrical workpiece by magnetron sputterinig; where inside surface of workpiece is coated, workpiece itself is used as vacuum sputtering chamber; overlap between plasma and magnetic fields creates coat zone
02/27/2001US6193821 Tantalum billets, deformation and size reduction
02/27/2001US6193811 Baking a semiconductor and isolation
02/27/2001US6193804 Apparatus and method for sealing a vacuum chamber
02/27/2001US6193801 Apparatus for coating lenticular articles
02/22/2001WO2001013371A1 Light-transmitting film and sputtering target for forming the light-transmitting film
02/22/2001WO2001012874A1 Surface preparation of a substrate for thin film metallization
02/22/2001WO2001012863A1 Steel sheet for heat shrink band and method for producing the same
02/22/2001WO2001012358A1 Titanium material superior in upset-forgeability and method of producing the same
02/22/2001WO2001012246A1 Medical devices with metal/polymer composites
02/22/2001WO2001012131A1 Work piece and method for producing and utilizing said work piece
02/22/2001DE19937864A1 Werkstück und Verfahren zum Herstellen und zum Verwerten des Werkstückes Workpiece and method for producing and for making use of the workpiece
02/21/2001EP1077483A2 Method of making an integrated circuit device having a planar interlevel dielectric layer
02/21/2001EP1077270A1 Transition metal boride coatings
02/21/2001EP1076911A1 Method and apparatus for ionized physical vapor deposition
02/21/2001EP1076729A1 Low pressure purging method
02/21/2001EP1076728A1 A low friction coating for a cutting tool
02/21/2001EP0865513A4 Sputtering of lithium
02/21/2001EP0833957B1 Hard material coating with yttrium and method for its deposition
02/21/2001EP0809659A4 Plasma deposited film networks
02/21/2001CN1284742A Method for manufacturing semiconductor device with semiconductor layer
02/20/2001US6192330 Method and apparatus for string model simulation of a physical semiconductor process including use of specific depth angles and segment list with removal of redundant segments
02/20/2001US6190998 Method for achieving a thin film of solid material and applications of this method
02/20/2001US6190752 Thin films having rock-salt-like structure deposited on amorphous surfaces
02/20/2001US6190737 Metalized elastomers
02/20/2001US6190517 Magnet array
02/20/2001US6190516 High magnetic flux sputter targets with varied magnetic permeability in selected regions
02/20/2001US6190514 Decorative laminate from resin impregnated paper; wear resistant overcaoting with boride
02/20/2001US6190512 Soft plasma ignition in plasma processing chambers
02/20/2001US6190511 Sputtering; vacuum chamber, baffle, pump for pumping gases, screen chemical
02/20/2001US6189806 Metallizing device for vacuum metallizing
02/16/2001WO2001012872A1 Method for deposition of wear-resistant coatings and for increasing the lifespan of parts
02/15/2001WO2001011676A2 Sputtering process
02/15/2001WO2001011109A1 Electron beam physical vapor deposition apparatus
02/15/2001WO2001011108A1 Electron beam physical vapor deposition apparatus and method
02/15/2001WO2001011107A1 Electron beam physical vapor deposition apparatus
02/15/2001WO2001011106A1 Electron beam physical vapor deposition apparatus
02/15/2001WO2001011105A1 Electron beam physical vapor deposition apparatus with ingot magazine
02/15/2001WO2001011104A1 Ion beam processing of a substrate
02/15/2001WO2001011103A2 Electron beam physical vapor deposition apparatus and control panel therefor
02/15/2001WO2001010795A1 Silicon nitride components with protective coating
02/15/2001WO2000065631A3 Apparatus and method for exposing a substrate to plasma radicals
02/15/2001DE19738118C2 Montageverfahren für ein Halbleiterbauelement A mounting method of a semiconductor device
02/15/2001DE10035719A1 Verfahren zum Herstellen von intermetallischen Sputtertargets A method for producing of intermetallic sputter targets
02/15/2001CA2381199A1 Sputtering process