| Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378) |
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| 01/03/2001 | EP1065525A2 Radiation image read out apparatus |
| 01/03/2001 | EP1065524A2 Radiation image read out method and apparatus |
| 01/03/2001 | EP1065523A2 Radiation image read-out method and apparatus |
| 01/03/2001 | EP1065179A1 Process for the deposition of a tungsten and/or molybdenum based layer on a glass, ceramic or glass ceramic substrate and coated substrate according to the process |
| 01/03/2001 | EP1064670A1 Sputtering apparatus with a coil having overlapping ends |
| 01/03/2001 | EP1064150A1 Oxygen barrier composite film structure |
| 01/03/2001 | CN1278747A Catalyst for membrane electrode assembly and method of making |
| 01/03/2001 | CN1278484A Coated press-surfacelayer for wear-resisting laminated plate and laminated plate made using same |
| 01/03/2001 | CN1060229C Anode for chloroalkali electrolysis, its preparation method and use thereof |
| 01/03/2001 | CN1060225C Multiple-gun dynamic mixing injection technology and its device |
| 01/02/2001 | USH1933 Magnetron sputter-pulsed laser deposition system and method |
| 01/02/2001 | US6169288 Laser ablation type ion source |
| 01/02/2001 | US6169030 Metallization process and method |
| 01/02/2001 | US6169027 Method of removing surface oxides found on a titanium oxynitride layer using a nitrogen containing plasma |
| 01/02/2001 | US6168833 Evaporating ceramic material by melting surface of ingot with an heat source; depositing evaporated material upon object as coating |
| 01/02/2001 | US6168832 Pausing material in gaseous form to impinge on and condense on the substrate, while rotating substrate with respect to source providing material in gaseous form, and while partially shielding substrate from gaseous material by mask |
| 01/02/2001 | US6168698 Apparatus for coating a substrate |
| 01/02/2001 | US6168696 Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatus |
| 01/02/2001 | US6168690 Methods and apparatus for physical vapor deposition |
| 01/02/2001 | US6168242 Zirconium nitride coating having a top layer thereon |
| 01/02/2001 | CA2093729C Process for preparing superconducting thin film formed of oxide superconductor material |
| 12/28/2000 | WO2000079839A1 Method and apparatus for forming polycrystalline particles |
| 12/28/2000 | WO2000079630A2 Fuel cell membrane electrode assemblies with improved power outputs and poison resistance |
| 12/28/2000 | WO2000079018A1 Sputtering method using virtual shutter |
| 12/28/2000 | WO2000062830A3 Coating medical devices using air suspension |
| 12/28/2000 | CA2375847A1 Method and apparatus for forming polycrystalline particles |
| 12/28/2000 | CA2374399A1 Fuel cell membrane electrode assemblies with improved power outputs and poison resistance |
| 12/27/2000 | EP1063679A1 Erosion profile compensated magnetron with moving magnet assembly |
| 12/27/2000 | EP1063317A1 Sputtering target, transparent conductive film, and method for producing the same |
| 12/27/2000 | EP1063085A1 Method of making abrasion resistant laminates using coated pressing surfaces |
| 12/27/2000 | EP1061958A2 Radioactive seed implants |
| 12/27/2000 | EP0815501B1 Apparatus and method for controlling high throughput sputtering |
| 12/27/2000 | CN2412019Y Pulse laser deposition appts. |
| 12/27/2000 | CN1278307A PVD aluminium oxide (s) coated cutting tool |
| 12/27/2000 | CN1278019A Surface metallized high molecular film, and its prepn. method |
| 12/27/2000 | CN1278018A Ion cycloron boronization process used for first wall surface of superconductive magnetic restraining fusion device |
| 12/27/2000 | CN1059935C Isometric nanometer boron nitride film and its preparation |
| 12/27/2000 | CN1059874C Method of preparing antiseptic hydroxyl kietyoite cladding material |
| 12/26/2000 | US6166414 Electronic circuit |
| 12/26/2000 | US6165616 Synthetic diamond coatings with intermediate bonding layers and methods of applying such coatings |
| 12/26/2000 | US6165610 Metallized film comprising blend of polyester and ethylene copolymers |
| 12/26/2000 | US6165607 Consisting essentially of mn and at least one kind of r element selected from a group of ni, pd, pt, co, rh, ir, v, nb, ta, cu, ag, au, ru, os, cr, mo, w, and re |
| 12/26/2000 | US6165567 Using ionized metal plasma physical vapor deposition |
| 12/26/2000 | US6165413 Pre-packing a powder bed by hot pressing or vibration between metal plates, followed by hot isostatic pressing for making integrated circuits |
| 12/26/2000 | US6165376 Work surface treatment method and work surface treatment apparatus |
| 12/26/2000 | US6165328 Low pressure pump such as cryopump coupled to the processing chamber with a throttle plate; valve mechanism couples noble gas to chamber so noble gas flows in continuously and is pumped out with cryopump, getter pump removes impurity gases |
| 12/26/2000 | US6164519 Method of bonding a sputtering target to a backing plate |
| 12/26/2000 | CA2213288C Diboride coated pressing surfaces for abrasion resistant laminate and making pressing surfaces |
| 12/22/2000 | CA2308214A1 Coated pressing surfaces for abrasion resistant laminate and making laminates therefrom |
| 12/21/2000 | WO2000077488A1 High-temperature balance |
| 12/21/2000 | WO2000077274A1 Method and device for coating a substrate at a high temperature by means of sputtering |
| 12/21/2000 | WO2000077266A1 Hydrogen-occluding layered material |
| 12/21/2000 | WO2000076930A1 Protective layers for sputter coated article |
| 12/21/2000 | DE19927062A1 Lock has a gap sealed by a sealing device which is formed by a pump rotor pair conveyed from the vacuum chamber to the atmosphere |
| 12/21/2000 | DE19926019A1 Process for monitoring growing layers used in vacuum coating processes comprises directing a measuring beam before starting the layer growth into a galvanic bath and onto a layer substrate |
| 12/21/2000 | CA2339958A1 Hydrogen-occluding layered material |
| 12/20/2000 | EP1061550A2 System and method for cleaning contaminated surfaces in an ion implanter |
| 12/20/2000 | EP1060501A1 Method and apparatus for predicting plasma-process surface profiles |
| 12/20/2000 | EP1060285A1 Apparatus and method for depositing a semiconductor material |
| 12/20/2000 | EP1060284A1 Protecting layer |
| 12/20/2000 | EP1060283A1 Distribution mask for depositing by vacuum evaporation |
| 12/20/2000 | EP0964766A4 Method of making high purity copper sputtering targets |
| 12/20/2000 | EP0770692B1 Sealing device for zone outlet/inlet of continuous heat treatment furnace, continuous vacuum evaporation equipment and the like |
| 12/20/2000 | CN1277457A Method and apparatus for producing thin film rotary ellipsoid with thin film and light using therewith |
| 12/20/2000 | CN1277268A Composition and making process of electrothermal semiconductor film |
| 12/19/2000 | US6163033 Method and apparatus for controlling a workpiece in a vacuum chamber |
| 12/19/2000 | US6163006 Permanent magnet ECR plasma source with magnetic field optimization |
| 12/19/2000 | US6162712 Platinum source compositions for chemical vapor deposition of platinum |
| 12/19/2000 | US6162707 Low work function, stable thin films |
| 12/19/2000 | US6162698 Method of manufacturing a capacitor in a semiconductor device |
| 12/19/2000 | US6162512 Process for modifying surfaces of nitride, and nitride having surfaces modified thereby |
| 12/19/2000 | US6162500 Method of treating a casting having a casting surface |
| 12/19/2000 | US6162495 Protective overcoat for replicated diffraction gratings |
| 12/19/2000 | US6162336 Clamping ring design to reduce wafer sticking problem in metal deposition |
| 12/19/2000 | US6162332 Grounding detection circuit |
| 12/19/2000 | US6162302 Method of cleaning quartz substrates using conductive solutions |
| 12/19/2000 | US6162300 Effusion cell |
| 12/19/2000 | US6162299 Multi-position load lock chamber |
| 12/19/2000 | US6162297 Embossed semiconductor fabrication parts |
| 12/19/2000 | US6162296 Method and apparatus for manufacturing chalcopyrite semiconductor thin films |
| 12/19/2000 | US6161837 Piston ring with hybrid face coating |
| 12/19/2000 | CA2156571C Coated substrate and process for its formation |
| 12/14/2000 | WO2000076007A1 Sheet-shaped piezoelectric device, method for making same, and piezoelectric vibrator and piezoelectric sound generator using same |
| 12/14/2000 | WO2000075393A2 Carbon plasma pulsed source |
| 12/14/2000 | WO2000074868A1 Closed cell metal composites |
| 12/14/2000 | WO2000074657A1 Methods for coating particles and particles produced thereby |
| 12/14/2000 | DE19932338C1 Substrate rotating mechanism, for a ceramic or metal deposition chamber, comprises bearing balls in grooves provided in two concentric annular disks and an interposed annular substrate holder |
| 12/14/2000 | DE19924557C1 Production of reflecting layers uses a pretreatment process that is carried out in a cycle with a desorption phase, activation phase and a degassing phase |
| 12/14/2000 | CA2376113A1 Methods for coating particles and particles produced thereby |
| 12/13/2000 | EP1058944A1 Cooling system with antifreeze for cooling magnetron for process chamber of processing system |
| 12/13/2000 | EP0935633A4 Acrylate coating methods |
| 12/13/2000 | EP0864003A4 METHODS OF MAKING Cr-Me SPUTTER TARGETS |
| 12/13/2000 | CN1276440A Surface treatment method and apparatus, vapor deposition material, and rare-earth based permanent magnet |
| 12/13/2000 | CN1276439A Nb-doped barium titanate film and its preparing process |
| 12/13/2000 | CN1276438A Sb-doped strontium titanate film and its preparing process |
| 12/13/2000 | CN1059474C Collimator and mfg. method therefor |
| 12/12/2000 | US6161054 Cell control method and apparatus |
| 12/12/2000 | US6160621 Method and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light source |
| 12/12/2000 | US6160350 Ion plating apparatus |
| 12/12/2000 | US6160315 The alloying metal oxide having a thickness of about 6 nm on the oxide sidewalls encapsulates the copper layer to provide a barrier against copper migration, to form an adhesion layer over silicon dioxide |