Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
05/2001
05/09/2001CN1065571C Method and appts. for orientation growth of lithium ferrous niobate by electric field induction
05/08/2001US6229956 Flash evaporator vessel
05/08/2001US6228672 Stable surface passivation process for compound semiconductors
05/08/2001US6228541 Supplying reactive gas; forming thin film
05/08/2001US6228457 Optical data storage medium
05/08/2001US6228439 Multistage; concurrent cleaning substrate, depositing
05/08/2001US6228429 Methods and apparatus for processing insulating substrates
05/08/2001US6228236 Sputter magnetron having two rotation diameters
05/08/2001US6228235 Magnetron for low pressure, full face erosion
05/08/2001US6228234 Apparatus for sputtering
05/08/2001US6228229 Method and apparatus for generating a plasma
05/08/2001US6228209 Equipment for forming a glue layer of an opening
05/08/2001US6228186 Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies
05/08/2001US6228176 Contoured platen design for plasma immerson ion implantation
05/08/2001US6228173 Single-substrate-heat-treating apparatus for semiconductor process system
05/08/2001CA2073642C Substoichiometric zirconium nitride coating
05/03/2001WO2001031683A1 Plasma doping system comprising a hollow cathode
05/03/2001WO2001031681A1 Method and apparatus for eliminating displacement current from current measurements in a plasma processing system
05/03/2001WO2001031081A1 Method and apparatus for coating a substrate in a vacuum
05/03/2001WO2001031080A2 Electron beam physical vapor deposition apparatus
05/03/2001WO2001030566A1 Forming members for shaping a reactive metal and methods for their fabrication
05/03/2001DE19952549A1 Substrat mit einer Chrom-Nitrid-Schicht Substrate with a chromium nitride layer
05/03/2001DE19951017A1 Verfahren und Vorrichtung zur Plasmabehandlung von Oberflächen Method and apparatus for plasma treatment of surfaces
05/03/2001DE10046067A1 Phasenschiebungsmaske sowie Verfahren zur Herstellung derselben Phase shift mask and method of manufacturing the same
05/03/2001CA2388178A1 Method and apparatus for coating a substrate in a vacuum
05/02/2001EP1096549A2 Substrates support devices
05/02/2001EP1096545A2 Tilted sputtering target with shield to block contaminants
05/02/2001EP1096037A2 A composite ingot for producing a gradient coating by evaporation
05/02/2001EP1096036A1 Heavy gas plasma sputtering
05/02/2001EP1096035A1 Coated steel sheet and method and apparatus for its fabrication
05/02/2001EP1096027A1 Method of manufacturing high purity cobalt sputter targets having a low magnetic permeability
05/02/2001EP1096026A2 Method of manufacturing thin metal alloy foils
05/02/2001EP1095394A1 Feedthrough overlap coil
05/02/2001EP1095378A1 Primary target for forming fission products
05/02/2001EP1095169A1 Method and device for producing a powder aerosol and use thereof
05/02/2001EP1094991A1 Material and method for coating glass forming equipment
05/02/2001EP0928343B1 Process for coating brass with hard, multicolored layers
05/02/2001EP0886685B1 Improved thermal barrier coating system and methods
05/02/2001CN2428490Y Sampler support for vacuum steam-plating
05/02/2001CN1293272A Sliding device of sewing machine
05/01/2001US6225233 Semiconductor device manufacturing machine and method for manufacturing a semiconductor device by using THE same manufacturing machine
05/01/2001US6224972 Method of making a PVD-coated HSS drill
05/01/2001US6224968 Layer of titanium nitride; layer of a carbonitride of an element of the group iva of the periodic system; a layer of aluminum oxide or zirconium oxide;a layer of a carbonitride of zirconium,hafnium,vanadium,niobium or chromium
05/01/2001US6224951 Depositing a copper layer on the metal layer of a polyimide film strip and, to the other side, a tiecoat metal to which a non-flowing adhesive is applied and cured completely in the interior and partially outside; continuous processing
05/01/2001US6224942 Alloy of aluminum and titanium layering with higher melting point; layers are formed, photpatterned into a conductive line used in semiconductor processing of integrated circuitry
05/01/2001US6224941 Pulsed-vapor phase aluminide process for high temperature oxidation-resistant coating applications
05/01/2001US6224726 Cathodic arc coating apparatus
05/01/2001US6224725 Unbalanced magnetron sputtering with auxiliary cathode
05/01/2001US6224724 Physical vapor processing of a surface with non-uniformity compensation
05/01/2001US6224719 Sputtering method of manufacturing Fe-Ai-N-O laminated films using N2O as the reactive gas
05/01/2001US6224718 Target assembly for ion beam sputter deposition with multiple paddles each having targets on both sides
05/01/2001US6224673 Apparatus for masking turbine components during vapor phase diffusion coating
05/01/2001US6224536 Method for delivering radiation therapy to an intravascular site in a body
05/01/2001US6223685 Film to tie up loose fluorine in the chamber after a clean process
05/01/2001US6223683 Hollow plastic containers with an external very thin coating of low permeability to gases and vapors through plasma-assisted deposition of inorganic substances and method and system for making the coating
05/01/2001CA2157070C Optical lens of transparent plastic
04/2001
04/27/2001CA2324676A1 Magneto-optical member
04/26/2001WO2001029914A1 Method for producing electrode for lithium secondary cell
04/26/2001WO2001029913A1 Method for producing material for electrode for lithium cell
04/26/2001WO2001029279A1 Process for producing sputtering target materials
04/26/2001WO2001029278A1 Method and apparatus for substrate biasing in multiple electrode sputtering systems
04/26/2001WO2001029137A1 Color shifting carbon-containing interference pigments
04/26/2001WO2001029052A1 Deposition of films using organosilsesquioxane-precursors
04/26/2001DE19949541A1 Komponente mit Schicht sowie Herstellungsverfahren für eine solche Schicht Component layer and manufacturing method for such a layer
04/26/2001CA2324437A1 Steel sheet with a coating comprising a main layer of zinc-chrome alloy, of which the predominant phase presents a structure .delta and/or .zeta.
04/25/2001EP1094504A2 PVD-IMP tungsten and tungsten nitride as a liner, barrier, and/or seed layer
04/25/2001EP1094503A2 Barrier layer for aluminium metallisation
04/25/2001EP1094496A2 Sputtering chamber shield promoting reliable plasma ignition
04/25/2001EP1094495A2 Sputter magnetron having two rotation diameters
04/25/2001EP1094493A2 Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage
04/25/2001EP1094344A2 Thin film forming method and apparatus
04/25/2001EP1094341A2 Apparatus and method for producing optical component
04/25/2001EP1094132A1 Multi-layer coated material for cutting tool
04/25/2001EP1094130A2 Method and apparatus for plasma processing of surfaces
04/25/2001EP1094129A2 Method for in-situ cleaning of surfaces of a substrate processing chamber
04/25/2001EP1093532A1 A method and apparatus for the formation of dielectric layers
04/25/2001CN1065046C Film formation method and semiconductor laser fabrication method
04/24/2001US6222991 Method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
04/24/2001US6222271 Method of using hydrogen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
04/24/2001US6221765 Method for manufacturing a semiconductor device
04/24/2001US6221520 Laminate of transparent oxide and metal
04/24/2001US6221512 Metallic article having a thermal barrier coating and a method of application thereof
04/24/2001US6221508 Multilayer; nickel alloy
04/24/2001US6221495 Radio frequency sputtering tin oxide and cadmium oxide
04/24/2001US6221231 Multilayer coating with metal or metal alloy on surface of article
04/24/2001US6221221 Apparatus for providing RF return current path control in a semiconductor wafer processing system
04/24/2001US6221219 For rewritable high-density recording medium
04/24/2001US6221217 Physical vapor deposition system having reduced thickness backing plate
04/24/2001US6221169 Generating ion beam having fluorine component; directing ion beam toward surface to be cleaned; neutralizing ion beam by; cleaning surface by allowing beam of neutral fluorine atoms to react with contaminants; removing volatile reaction product
04/24/2001US6220204 Film deposition method for forming copper film
04/24/2001US6220203 Device for vacuum coating bulk material
04/20/2001CA2323190A1 Method for manufacturing objects of metallic material and objects manufactured with this method
04/19/2001WO2001027970A1 Electric supply unit and a method for reducing sparking during sputtering
04/19/2001WO2001027689A1 Optically functional element and production method and application therefor
04/19/2001WO2001027349A2 Component covered with a layer and a method for producing a layer of this type
04/19/2001WO2001027345A1 Sputtering target and method for preparing the same and film-forming method
04/19/2001DE19952032A1 Verfahren und Vorrichtung zur Erzeugung planparalleler Plättchen Method and apparatus for generating a plane-parallel plate
04/19/2001DE19949394A1 Elektrische Versorgungseinheit und Verfahren zur Reduktion der Funkenbildung beim Sputtern Electric power supply unit and method for reducing spark formation in sputtering
04/19/2001DE19929615C1 Vorrichtung und Verwendung der Vorrichtung zur Überwachung von absichtlichen oder unvermeidbaren Schichtabscheidungen A device and use of the device for monitoring of deliberate or unavoidable layer depositions
04/18/2001EP1093154A2 Magnetron with cooling system for substrate processing system