| Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378) |
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| 07/03/2001 | US6254458 Post processing for nitinol coated articles |
| 07/03/2001 | US6254328 High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
| 07/03/2001 | US6253441 Fabrication of articles having a coating deposited through a mask |
| 07/03/2001 | CA2093635C Magnetron sputter coating method and apparatus with rotating magnet cathode |
| 06/28/2001 | WO2001046999A2 Method and apparatus for supercritical processing of a workpiece |
| 06/28/2001 | WO2001046488A1 Article coated with photocatalyst film, method for preparing the article and sputtering target for use in coating with the film |
| 06/28/2001 | WO2000055388A3 Method and apparatus for arc deposition |
| 06/28/2001 | US20010005629 Depositing barrier/wetting layer over surfaces of aperture, the barrier/wetting layer comprising tantalum, tantalum nitride, tungsten, tungsten nitride, and combinations thereof, depositing a conformal metal layer over the surface |
| 06/28/2001 | US20010005554 Transparent laminate, method for producing the same, and plasma display panel |
| 06/28/2001 | US20010005553 Linear aperture deposition apparatus and coating process |
| 06/28/2001 | US20010005537 Recording medium and method of manufacturing same |
| 06/28/2001 | US20010004856 Adjusting ratio of gas flow volume (Nm3)/molten liquid flow mass(kg) to 5 Nm3/kg or more in gas atomizing step of spray forming method using aluminum or aluminum alloy sputtering target material in which maximum inclusion length is 20 mu m |
| 06/28/2001 | US20010004807 Vacuum processing apparatus and operating method therefor |
| 06/28/2001 | DE19956733A1 Verfahren zur Regelung von Sputterprozessen The method for controlling sputtering |
| 06/28/2001 | DE10060931A1 Ductile ferrous materials with lubricated contact surfaces are sand-blasted or plasma-etched before coating with wear-resistant, low-friction material |
| 06/28/2001 | CA2387373A1 Method and apparatus for supercritical processing of a workpiece |
| 06/27/2001 | EP1111661A2 High temperature electrostatic chuck |
| 06/27/2001 | EP1111651A2 Power supply hardening for ion beam systems |
| 06/27/2001 | EP1111438A2 Black matrix and preparing method thereof |
| 06/27/2001 | EP1111087A1 Apparatus and method for forming thin film |
| 06/27/2001 | EP1111086A1 Cathode and method for making cathode for cathodic arc deposition |
| 06/27/2001 | EP1111085A1 Method for producing ceramic coatings |
| 06/27/2001 | EP1111084A1 Pretreatment process for plasma immersion ion implantation |
| 06/27/2001 | EP1110920A1 LIght-absorptive antireflection filter, display device, and methods of producing the same |
| 06/27/2001 | EP1109946A1 Optical lens support and method for using same |
| 06/27/2001 | EP1109945A1 Electrochemical device |
| 06/27/2001 | EP1109944A2 Vapor deposition system |
| 06/27/2001 | EP1109641A1 Method and apparatus for producing material vapour |
| 06/27/2001 | EP0948672B1 Apparatus for growing silicon carbide crystals |
| 06/27/2001 | EP0810889B1 Implant |
| 06/27/2001 | CN1300874A Process for modifying surface of artificial organ |
| 06/27/2001 | CN1300873A Banded high purity pair-cathodes |
| 06/26/2001 | US6251796 Etching a dielectric in semiconductor wafer using tantalum nitride barrier |
| 06/26/2001 | US6251759 Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system |
| 06/26/2001 | US6251530 Thin-film of a high-temperature superconductor compound and method |
| 06/26/2001 | US6251504 Ceramic heat barrier coating having low thermal conductivity, and process for the deposition of said coating |
| 06/26/2001 | US6251472 Method of depositing electrode material onto a piezoelectric substrate whereby the substrate is masked and the unmasked portions are cleaned by a plasma or ion beam prior to deposition |
| 06/26/2001 | US6251334 Composite constructions having mixed organic/inorganic layers |
| 06/26/2001 | US6251297 Method of manufacturing polarizing plate |
| 06/26/2001 | US6251242 Magnetron and target producing an extended plasma region in a sputter reactor |
| 06/26/2001 | US6251233 Provide for simpler, economical and continuous operation. |
| 06/26/2001 | US6251232 Method of removing accumulated films from the surface of substrate holders in film deposition apparatus, and film deposition apparatus |
| 06/26/2001 | US6251230 Vacuum deposition method |
| 06/26/2001 | US6250869 Three chamber load lock apparatus |
| 06/26/2001 | US6250758 Plastic optical devices having antireflection film and mechanism for equalizing thickness of antireflection film |
| 06/26/2001 | US6250540 Fluxless joining process for enriched solders |
| 06/26/2001 | US6250374 Apparatus and method for treating substrates |
| 06/26/2001 | US6249955 Laser bar transport method |
| 06/21/2001 | WO2001045141A2 Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
| 06/21/2001 | WO2001044802A1 Method for the determination of gaseous chemical components in a process reactor for treating electrical components, in particular wafers |
| 06/21/2001 | WO2001044536A2 Sputtering targets and method of making same |
| 06/21/2001 | WO2001044535A1 Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target |
| 06/21/2001 | WO2001044534A1 Method and apparatus for thin film deposition |
| 06/21/2001 | WO2001044138A1 Ceramic compositions, physical vapor deposition targets and methods of forming ceramic compositions |
| 06/21/2001 | WO2001044131A2 Haze-resistant transparent film stacks |
| 06/21/2001 | WO2001043965A1 Thermal barrier coatings and electron-beam, physical vapor deposition for making same |
| 06/21/2001 | WO2001043865A1 Production of material libraries using sputter methods |
| 06/21/2001 | WO2000073531A3 Copper sputtering target assembly and method of making same |
| 06/21/2001 | US20010004554 Vacuum processing apparatus and operating method therefor |
| 06/21/2001 | US20010004499 Forming over the air-bearing surface a wear-resistant carbon layer and covering that layer with a lubricating carbon layer; direct access storage devices |
| 06/21/2001 | US20010004210 Sheet resistance meter and method of manufacturing electronic components |
| 06/21/2001 | US20010004048 For the production of electrical contact components, by applying a film of tin or tin alloy to a strip of electroconductive base material, and subsequently depositing a silver film |
| 06/21/2001 | US20010004047 Confines the high pressure required for ion generation to an ion source and deposits thin films in a low background pressure, in which energetic electrons generated from sputter target biased negative relative to ground are controlled |
| 06/21/2001 | US20010003929 Premelting crude manganese at 1250-1500 degrees C. and then vacuum distilling the melt at 1100-1500 degrees C. in a crucible having interior and exterior crucibles with carbon felt packed in the space between the two crucibles |
| 06/21/2001 | US20010003873 Vacuum processing apparatus and operating method therefor |
| 06/21/2001 | DE19959972A1 Herstellung von Materialbibliotheken durch Sputterverfahren Production of material libraries by sputtering |
| 06/21/2001 | DE19958424A1 Composite material for thin-film coating of large substrates comprises a base layer of titanium or primed steel or copper, a transitional layer of primer and titanium dioxide and a working layer of titanium dioxide and metal |
| 06/21/2001 | DE10030175A1 Zellsubstrat, Flüssigkristall-Zelle, Flüssigkristall-Display und Verfahren zur Herstellung einer Elektrode Cell substrate, liquid crystal cell, liquid crystal display and method for manufacturing an electrode |
| 06/20/2001 | EP1109203A2 Dual substrate loadlock process equipment |
| 06/20/2001 | EP1109202A2 Wafer processing chamber having separable upper and lower halves |
| 06/20/2001 | EP1109201A2 Serial wafer handling mechanism |
| 06/20/2001 | EP1109196A1 Diamond-like coated components in an ion implanter for reducing x-ray emissions |
| 06/20/2001 | EP1109166A1 Recording medium and method of manufacturing same |
| 06/20/2001 | EP0832309A4 Cathodic arc cathode |
| 06/20/2001 | CN1300327A Zinc-tin alloy sputtering target |
| 06/20/2001 | CN1299886A Vacuum anagnetically controlled sputtering foamed metalizing machine |
| 06/19/2001 | US6249200 Combination of magnets for generating a uniform external magnetic field |
| 06/19/2001 | US6248422 Shadow sculpted thin films |
| 06/19/2001 | US6248409 Method for manufacturing antistatic integrated circuit trays of polymer materials using ion implantation |
| 06/19/2001 | US6248408 Method for simultaneously curing powder underlayer coating and PVD deposition of thin film layer |
| 06/19/2001 | US6248401 Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
| 06/19/2001 | US6248399 Industrial vapor conveyance and deposition |
| 06/19/2001 | US6248394 Process for fabricating device comprising lead zirconate titanate |
| 06/19/2001 | US6248291 Process for producing sputtering targets |
| 06/19/2001 | US6248223 Sputtering apparatus |
| 06/19/2001 | US6248220 Radio frequency sputtering apparatus and film formation method using same |
| 06/19/2001 | US6248219 Efficient sputtering of target within a confined plasma discharge space based upon a ratio of drop of time-averaged electric potential adjacent to electrode surfaces between which a radio frequency plasma discharge is generated |
| 06/19/2001 | US6248176 Apparatus and method for delivering a gas |
| 06/14/2001 | WO2001043165A2 Oxide films containing p-type dopant and process for preparing same |
| 06/14/2001 | WO2001042526A1 Plasma processing container internal member and production method therefor |
| 06/14/2001 | WO2001042522A2 Sputtering target and methods of making same |
| 06/14/2001 | US20010003677 Making a low-resistance contact by placing a cadmium sulfide/cadmium telleride layer into chamber, evacuating, filling with argon, generating plasma ignition by energizing a cathode |
| 06/14/2001 | US20010003641 Optical recording medium having a protective layer and a phase change recording layer, wherein the protective layer containing a metallic oxysulfide and being formed by sputtering using a target comprising metalllic oxysulfide |
| 06/14/2001 | US20010003607 Alternate steps of imp and sputtering process to improve sidewall coverage |
| 06/14/2001 | US20010003569 Coated PCBN cutting tools |
| 06/14/2001 | US20010003272 Method for improving the rate of a plasma enhanced vacuum treatment |
| 06/13/2001 | EP1107304A2 Article comprising a dielectric material of Zr-Ge-Ti-O or Hf-Ge-Ti-O and method of making the same |
| 06/13/2001 | EP1107288A2 Substrate processing system and method |
| 06/13/2001 | EP1107282A2 Method and apparatus for semiconductor wafer process monitoring |
| 06/13/2001 | EP1107244A2 Optical recording medium and production method of the same |