Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
09/2001
09/13/2001WO2001066815A1 Method for depositing amorphous silicon layers that contain hydrogen
09/13/2001WO2001049893A8 Vacuum coating device
09/13/2001US20010021785 Indium source reagent compositions, and use thereof for deposition of indium-containing films on substrates and ion implantation of indium-doped shallow junction microelectronic structures
09/13/2001US20010021455 Linear aperture deposition apparatus and coating process
09/13/2001US20010021446 Anti-reflection film and process for preparation thereof
09/13/2001US20010021415 Heating powder mixture in vacuum; sublimation, vaporization
09/13/2001US20010021410 Heating, vaporization in vacuum
09/13/2001US20010020586 Metal oxide which is deficient in oxygen as compared with the stoichiometric composition, comprising titanium, niobium, tantalum, molybdenum, tungsten, zirconium, hafnium oxides
09/13/2001US20010020340 Vacuum processing apparatus and operating method therefor
09/13/2001US20010020339 Vacuum processing apparatus and operating method therefor
09/13/2001DE10107288A1 Vapor coated sliding element, especially a plain bearing half-shell with an electron beam or laser beam vapor deposited metallic layer, is produced by sliding element rotation about an axis perpendicular to the vapor stream central axis
09/13/2001DE10012390A1 Production of oxidic protective layers comprises applying layers to a material using physical deposition in the vapor phase
09/13/2001DE10011597A1 Production of decorative hard layers comprises depositing a metal carbonitride and/or a metal carbonitride oxide on a substrate
09/12/2001EP1132980A2 Thin film forming method for light emitting devices
09/12/2001EP1132663A2 Piston ring with wear resistant layer and wear resistant layer for piston ring
09/12/2001EP1132493A2 Vapor deposition method of organic compound and refinement method of organic compound
09/12/2001EP1132197A2 Machine direction oriented, CVD/PVD-coated packaging film
09/12/2001EP1131838A1 Self-oriented bundles of carbon nanotubes and method of making same
09/12/2001EP1131474A1 Electron beam physical vapor deposition apparatus with ingot magazine
09/12/2001EP1131473A1 Process for making metal flakes
09/12/2001EP1131054A2 Methods for preparing coated drug particles and pharmaceutical formulations thereof
09/12/2001CN1312584A Film-forming device, film-forming method and self-luminous device
09/12/2001CN1312398A Method and apparatus for applicating electromagnetic wave shielding coating
09/12/2001CN1312397A Preparation Mn-Co film with low temperature coefficient of resistance
09/12/2001CN1070934C Evaporative method of magnesium
09/12/2001CN1070933C Material of chemical compounds with a metal in group IVB of the periodic system, nitrogen and oxygen and process for producing it
09/12/2001CN1070932C High-corrosino-resistant Zn-Mg series electroplated steel plate and production method thereof
09/11/2001US6288449 Integrated circuit device with aspect ratio of up to about 15:1 and a metal stack within made of layers of tantalum, tantalum nitride, titanium nitride and copper; at least one of the layers is formed by chemical vapor deposition
09/11/2001US6288392 Quantitative characterization of obliquely-deposited substrates of gold by atomic force microscopy: influence of substrate topography on anchoring of liquid crystals
09/11/2001US6287986 Sputtering film forming method, sputtering film forming equipment, and semiconductor device manufacturing method
09/11/2001US6287889 Diamond thin film or the like, method for forming and modifying the thin film, and method for processing the thin film
09/11/2001US6287695 Corrosion-stable aluminum pigments and process for the production thereof
09/11/2001US6287682 Diamond coated tools and process for making
09/11/2001US6287673 Method for producing high surface area foil electrodes
09/11/2001US6287645 Ablation material from target onto substrate; hetaing
09/11/2001US6287644 Continuously-graded bond coat and method of manufacture
09/11/2001US6287642 Vapor deposition using gas plasma and laser; forming protective coating
09/11/2001US6287437 Recessed bonding of target for RF diode sputtering
09/11/2001US6287436 Brazed honeycomb collimator
09/11/2001US6287435 Method and apparatus for ionized physical vapor deposition
09/11/2001US6287430 Apparatus and method forming thin film
09/11/2001US6287429 Nonmagnetic substrate, chromium-molybdenum alloy, cobalt-platimun magnetic layer; controlling temperature
09/11/2001US6287385 Spring clip for sensitive substrates
09/11/2001US6286943 Droplet deposition apparatus
09/11/2001US6286453 Shield design for IBC deposition
09/11/2001US6286452 Sputtering apparatus
09/07/2001WO2001065895A2 Electrically controlled plasma uniformity in a high density plasma source
09/07/2001WO2001065590A2 Esrf source for ion plating epitaxial deposition
09/07/2001WO2001064443A1 Method for producing desired tantalum phase
09/07/2001WO2001011676A3 Sputtering process
09/06/2001US20010019807 Semiconductor substrate
09/06/2001US20010019801 Photomask blank, photomask and method of manufacture
09/06/2001US20010019745 Holders, hollow cathode with inert gas flow, heaters
09/06/2001US20010019741 Vacuum enclosure; reduced peeling
09/06/2001US20010019738 Sputtering targets and method for the preparation thereof
09/06/2001US20010019245 Organic electroluminescent display panel and method of manufacturing the same
09/06/2001US20010019238 Self-oriented bundles of carbon nanotubes and method of making same
09/06/2001US20010019016 For use in semiconductor fabrication; recessing the coil reduces deposition of material onto the coil, reducing particulate matter shed by the coil onto the workpiece
09/06/2001DE10108344A1 Component used in the production of machine parts, cutting tools and molds comprises a substrate, an intermediate layer made from a group IVa, Va, VIa, IIIb or IVb element
09/06/2001DE10008829A1 Verfahren zum Entfernen von adsorbierten Molekülen aus einer Kammer A method for removing adsorbed molecules from a chamber
09/06/2001CA2338876A1 Titanium nitrate coating
09/05/2001EP1130625A2 Method of sputter depositing copper films
09/05/2001EP1130624A2 Coil and coil support for generating a plasma
09/05/2001EP1130623A1 Apparatus for ion implantation
09/05/2001EP1130466A2 Photomask blank, photomask and method of manufacture
09/05/2001EP1130420A2 Transparent laminate, method for producing the same, and plasma display panel
09/05/2001EP1130129A1 Source for thermal physical vapor deposition of organic electroluminescent layers
09/05/2001EP1129232A1 Apparatus and method for coating objects through pvd
09/05/2001EP1090153A4 Tantalum sputtering target and method of manufacture
09/05/2001EP0820535B1 Erosion/corrosion protective coating for high-temperature components
09/05/2001CN1311531A Semiconductor storage having ruthenium pole, and its mfg. method
09/05/2001CN1311446A Light rays absorbing and anti-reflection filter and displaying device, and mfg. method therefor
09/05/2001CN1311348A Vacuum coating machine
09/05/2001CN1070539C Metallized film and capacitors contg. same
09/04/2001US6285049 Low loss composition of BaxSryCa1-x-yTiO3: Ba0.12-0.25Sr0.35-0.47Ca0.32-0.53TiO3
09/04/2001US6284691 Yttria-stabilized zirconia feed material
09/04/2001US6284659 Method of minimizing defect sources inside high density plasma reactor
09/04/2001US6284396 Holograms for documents such as bank notes, identity cards, passports
09/04/2001US6284382 For cathode ray tubes
09/04/2001US6284345 Designer particles of micron and submicron dimension
09/04/2001US6284329 Method of forming adherent metal components on a polyimide substrate
09/04/2001US6284326 Substrate surface is free-radicalized by a brief exposure to low-pressure plasma, free-radically polymerizing organic monomer compound is applied as adhesion-promoting layer; coating
09/04/2001US6284323 Thermal barrier coating systems and materials
09/04/2001US6284111 Sputtering target free of surface-deformed layers
09/04/2001US6284110 Method and apparatus for radio frequency isolation of liquid heat transfer medium supply and discharge lines
09/04/2001US6284107 Method for controlling arcing across thin dielectric film
09/04/2001US6284106 Method of producing flat panels
09/04/2001US6284013 Semiconductor thin film applications; ozone-containing gas conversion into ruthenium tetraoxide, blowing chlorine gas into sodium hydroxide solution; absorbing in acid, evaporating, salting out and sintering in hydrogen atmosphere
09/04/2001US6283357 Fabrication of clad hollow cathode magnetron sputter targets
09/04/2001CA2175439C Surface alloyed high temperature alloys
08/2001
08/30/2001WO2001063987A1 Dielectric processing with included stabilization periods
08/30/2001WO2001063643A1 Method for controlling plasma density or the distribution thereof
08/30/2001WO2001063628A1 tHIN PERMANENT-MAGNET FILM AND PROCESS FOR PRODUCING THE SAME
08/30/2001WO2001063002A1 Method for removing adsorbed molecules from a chamber
08/30/2001WO2001063001A2 Laser deposition process
08/30/2001WO2001063000A2 Method and apparatus for depositing films
08/30/2001US20010018262 Process for forming a diffusion-barrier-material nitride film
08/30/2001US20010018259 Method for fabricating conductive line pattern for semiconductor device
08/30/2001US20010018154 Sputtering uniform thin film on substrate
08/30/2001US20010018137 Ultra-low resistivity tantalum films and methods for their deposition