Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
10/2002
10/24/2002WO2002084702A2 Sputtering deposition apparatus and method for depositing surface films
10/24/2002WO2002083977A1 Method for manufacturing endo-osseous implants or medical prosthesis by ionic implantation technique
10/24/2002WO2002083976A1 Apparatus and method for epitaxial sputter deposition of multi-compound magnetic epilayers with high deposition rate
10/24/2002WO2002083975A1 Apparatus and method for epitaxial sputter deposition of epilayers and high quality films
10/24/2002WO2002083974A1 Pt-co based sputtering targets
10/24/2002WO2002083973A1 Zns-sio2 sputtering target and optical recording medium having zns-sio2 protective film for phase change type optical disk formed by using said target
10/24/2002US20020156142 Vacuum deposition of cationic polymer systems
10/24/2002US20020155632 Method and apparatus for film deposition
10/24/2002US20020155299 Photo-induced hydrophilic article and method of making same
10/24/2002US20020155221 Variations in thickness; rotation; positioning mask
10/24/2002US20020155213 Optical filter and method of manufacturing the same
10/24/2002US20020155016 Producing arget by cold-pressing mixture of target components, including an aluminum component and additional component, in powdery form and forming target at temperatures below melting points of components; pressing backing plate
10/24/2002US20020153610 Electronic devices with cesium barrier film and process for making same
10/24/2002US20020153248 Methods of forming metal articles
10/24/2002US20020153247 Apparatus and method for coating substrates
10/24/2002US20020153243 Method of fabricating transparent contacts for organic devices
10/24/2002US20020153242 Method of manufacturing an object in a vacuum recipient
10/24/2002US20020153130 Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof
10/24/2002US20020153103 Plasma treatment apparatus
10/24/2002US20020153071 Methods of fabricating metallic materials
10/24/2002US20020153023 Method for cleaning out silicon-rich oxide in a pre-clean chamber
10/24/2002US20020153022 Method for preventing particles in a pre-clean chamber
10/24/2002US20020152961 Preheat method for EBPVD coating
10/24/2002US20020152803 Systems and methods of monitoring thin film deposition
10/24/2002DE10158031A1 Device for placing and removing masks on and/or from a substrate used in a device for coating substrates preferably compact disks and digital versatile disks comprises a vacuum lock having a lid and a support for the substrate
10/24/2002DE10119926A1 Process for optimizing the composition and/or mechanical properties of one or more layers deposited during a PVD, CVD and/or PCVD process comprises depositing layer(s) on vaporizing
10/24/2002DE10119533A1 Process for controlling a plasma in a magnetron sputtering process comprises locally influencing the plasma using screens arranged along a magnetron track
10/24/2002DE10119463A1 Production of a chalcogenide halide of the ABC2 type comprises arranging metallic precursor layers, chalcogenizing with simultaneous optical process control, irradiating with light, and surface chalcogenizing to form the ABC2 phase
10/23/2002EP1251571A2 Reuseable mass-sensor in manufacture of organic light-emmiting devices
10/23/2002EP1251547A1 Cylindrical magnetron shield structure
10/23/2002EP1251189A1 Controlling the thickness of an evaporated or sublimed organic layer during production of an organic light-emitting device
10/23/2002EP1251188A1 Sputtering target and method for preparing the same and film-forming method
10/23/2002EP1250471A1 Sputter chamber and vacuum transport chamber and vacuum treatment installations with chambers of this type
10/23/2002EP1250470A1 Nano-material
10/23/2002EP1144328B1 Low-emissivity, soil-resistant coating for glass surfaces
10/23/2002EP1017870B1 Tool having a protective layer system
10/23/2002CN1376308A Sputtering process
10/23/2002CN1375574A Metal silicide sputtering target
10/23/2002CN1093310C Metal film high-resistance resistor and mfg. technology thereof
10/22/2002US6469448 Inductively coupled RF plasma source
10/22/2002US6469425 Electron emission film and field emission cold cathode device
10/22/2002US6469357 Article comprising an oxide layer on a GaAs or GaN-based semiconductor body
10/22/2002US6468598 Uniform textured structure with micro-waviness having sloped or curved lateral surfaces and a height of less than 20nm.
10/22/2002US6468595 Vaccum deposition of cationic polymer systems
10/22/2002US6468405 Sputtering target assembly and method for depositing a thickness gradient layer with narrow transition zone
10/22/2002US6468404 Apparatus and method for reducing redeposition in a physical vapor deposition system
10/22/2002US6468403 Sputtering using intermittent electric power to form transparent electroconductive layer
10/22/2002US6468402 Plasma argon gas sputtering low electrical resistance substoichiometric titanium dioxide
10/22/2002US6468401 Sputtering cobalt in presence of inert gas and oxygen to form nonstochiometric cobalt oxide layer, applying rubber coatingand vulcanizing
10/22/2002US6467427 Evaporation source material supplier
10/22/2002US6467425 Apparatus for internally coating a metal tube
10/22/2002US6467187 Vacuum processing apparatus and operating method therefor
10/22/2002US6467186 Transferring device for a vacuum processing apparatus and operating method therefor
10/22/2002CA2222369C Endcap for indirectly heated cathode of ion source
10/17/2002WO2002082530A2 In-situ thickness measurement for use in semiconductor processing
10/17/2002WO2002082522A1 Single wafer processing method and system for processing semiconductor
10/17/2002WO2002082506A2 Continuous thermal evaporation system
10/17/2002WO2002081787A1 Tank for epitaxy installation and installation comprising one such tank
10/17/2002WO2002081770A2 Room temperature luminescent erbium oxide thin films for photonics
10/17/2002WO2002081767A2 A method for determining a critical size of an inclusion in aluminum or aluminum alloy sputtering target
10/17/2002WO2002081765A1 Grain oriented electromagnetic steel sheet exhibiting extremely small watt loss and method for producing the same
10/17/2002WO2002081199A1 Coated article having the appearance of stainless steel
10/17/2002WO2002081198A1 Coated article with polymeric basecoat having the appearance of stainless steel
10/17/2002WO2002081194A1 Coated article with polymeric basecoat having the appearance of stainless steel
10/17/2002WO2002050867A3 Centrifugal type contaminant collector trap for ion implanter
10/17/2002WO2002043103A3 Extraction and deceleration of low energy beam with low beam divergence
10/17/2002WO2002029449A3 Magnetic transparent conducting oxide film and method of making
10/17/2002WO2001054163A9 Shaped and low density focused ion beams
10/17/2002US20020151101 Containing layer of mercaptohexadecanoic acid and/or nitrobenzenethiol; electroconductivity
10/17/2002US20020150843 Masking; plasma etching; photoresists; one-step
10/17/2002US20020150839 With use of radio frequency plasma bias in a vacuum chamber; evaporation; efficiency; photolithography
10/17/2002US20020150775 Degradable laminated body and a method for the preparation thereof
10/17/2002US20020150772 Reflection layer or semi-transparent reflection layer for use in optical information recording media, optical information recording media and sputtering target for use in the optical information recording media
10/17/2002US20020150687 Multilayer protective coatings
10/17/2002US20020150680 Manufacturing process of christmas tree decorations and racks for their fixing during this process
10/17/2002US20020150674 Vacuum evaporation; masking patterns
10/17/2002US20020149011 Semiconductor component and corresponding fabrication method
10/17/2002US20020148941 Sputtering method and apparatus for depositing a coating onto substrate
10/17/2002US20020148813 Dry etching and mirror deposition processes for silicone elastomer
10/17/2002US20020148725 Magnetron for a vault shaped sputtering target having two opposed sidewall magnets
10/17/2002US20020148724 High purity cobalt sputter target and process of manufacturing the same
10/17/2002US20020148720 Physical vapor deposited copper is solubilized in a fluid for redistribution, which prevents inherent nonuniformity of deposited copper film thickness by improving uniformity of copper flim thickness on coverd surfaces
10/17/2002DE10118763A1 Production of ceramic (mixed) metal oxide layers on substrate made from glass, ceramic, glass-ceramic, iron or other metals comprise coating substrate with an intermediate layer, applying ceramic (mixed) metal oxide layers using anodization
10/17/2002DE10114956A1 Semiconductor component used in DRAMs comprises a binary metal oxide dielectric layer arranged on a substrate
10/17/2002CA2409186A1 Coated article having the appearance of stainless steel
10/17/2002CA2409181A1 Coated article with polymeric basecoat having the appearance of stainless steel
10/16/2002EP1249514A1 Surface coated sintered alloy member
10/16/2002EP1249509A2 Silicon aluminum alloy of prealloyed powder and method of manufacture
10/16/2002EP1249334A1 Method of dyeing plastic lens and a dyeing system used therein
10/16/2002EP1249032A1 Plasma doping system comprising a hollow cathode
10/16/2002CN2516565Y Device for preparing silica film by intemediate-frequency reactive magnet control sputtering
10/16/2002CN2516564Y On-line joint coating device with intermediate-frequeney reactive sputtering silica for indium oxide tin glass
10/16/2002CN1374685A Silicide eliminating method for pre-cleaning chamber
10/16/2002CN1374684A Particle preventing method for pre-cleaning chamber
10/16/2002CN1374413A Fast method of preventing particle pollution in pre-cleaning chamber
10/16/2002CN1374412A Particle pollution preventing method for pre-cleaning chamber
10/15/2002US6466881 Method for monitoring the quality of a protective coating in a reactor chamber
10/15/2002US6466738 45-55% by weight tib2 and 40.5-54.7% by weight bn and 0.1-1.5% by weight calcium oxide or calcium borate; and containing a compound selected from the group consisting of the oxides, carbides and nitrides of al, si, zr, and ti
10/15/2002US6466124 Thin film resistor and method for forming the same
10/15/2002US6465369 Method for stabilizing semiconductor degas temperature