C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material

Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
12/2002
12/24/2002	US6498086 Use of membrane properties to reduce residual stress in an interlayer region
12/24/2002	US6497917 Ultrafine particle film forming method
12/24/2002	US6497803 Unbalanced plasma generating apparatus having cylindrical symmetry
12/24/2002	US6497802 Self ionized plasma sputtering
12/24/2002	US6497799 Method and apparatus for sputter deposition of multilayer films
12/24/2002	US6497797 A wear profile for a sputtering target surface is determined, corresponding to shape of the target surface after it is subjected to having material sputtered therefrom; to determine maximum anticipated lifetime of the target
12/24/2002	US6497772 Treatment for metals such as steel, which is both a wear resistant titanium nitride and phosphate corrosion resistant coating
12/24/2002	US6497744 Apparatus and method for generating indium ion beam
12/24/2002	US6497193 Scanned focus deposition system
12/19/2002	WO2002101785A1 Magnetron atomisation source
12/19/2002	WO2002101768A1 Method of manufacturing double surface metallized film, and metallized film capacitor using the method
12/19/2002	WO2002101122A1 Method for forming thin film crystal and semiconductor element employing that method
12/19/2002	WO2002101113A1 Method and device for treating a substrate
12/19/2002	WO2002095085A8 Method for producing a layer with a predefined layer thickness profile
12/19/2002	WO2002086932B1 Magnetic mirror plasma source
12/19/2002	WO2002078407A3 Neutral particle beam processing apparatus
12/19/2002	WO2002078040A3 Neutral particle beam processing apparatus
12/19/2002	WO2002011187A3 Method and apparatus for depositing a tantalum-containing layer on a substrate
12/19/2002	WO2001073883A9 Low-temperature fabrication of thin-film energy-storage devices
12/19/2002	WO2001073868A9 Device enclosures and devices with integrated battery
12/19/2002	US20020192946 Semiconductor device and method of manufacturing the same
12/19/2002	US20020192933 Semiconductor devices fabricated using sputtered silicon targets
12/19/2002	US20020192654 Generation of solid support; obtain nylon, wash and remove dust, heat, expose to graphite electrode, supply power, cool recover biochip
12/19/2002	US20020192508 Method of fabricating improved buffer architecture for biaxially textured structures
12/19/2002	US20020192502 High coercive force and residual magnetic flux density by controlling metallurgical microstructure; rotating machine and magnetic recording medium; anisotropy; alternating layers of refractory metal and magnetic rare earth alloy
12/19/2002	US20020192499 Homogeneous films formed on a substrate having a large screen by vacuum evaporation; small changes in the film thickness and density on deposition; controlled using an equation based on distance, thickness and angle against the perpendicular
12/19/2002	US20020192474 At least 10 layers, including from the substrate outwardly, tin oxide, titanium oxide, nickel oxide, silver; silicon nitride as an overcoat
12/19/2002	US20020192390 Backing connected to a sputtering power source and an outer layer of sputterable zinc and a second metal with a lower melting point
12/19/2002	US20020192365 Method for imparting hydrophilicity to substrate
12/19/2002	US20020192359 System for automatic control of the wall bombardment to control wall deposition
12/19/2002	US20020190387 Substantially hillock-free aluminum-containing components
12/19/2002	US20020190218 Method and apparatus for simultaneously depositing and observing materials on a target
12/19/2002	US20020189953 Method for processing metals
12/19/2002	US20020189940 Substrate support with multilevel heat transfer mechanism
12/19/2002	US20020189938 System and method for performing sputter deposition with multiple targets using independent ion and electron sources and independent target biasing with DC pulse signals
12/19/2002	US20020189937 Apparatus for processing metals
12/19/2002	US20020189932 Method of coil preparation for ionized metal plasma process and method of manufacturing integrated circuits
12/19/2002	US20020189728 Process for producing sputtering target materials
12/19/2002	US20020189719 A nickel titanium hafnium copper thin film shape memory alloy was formed in presence of using krypton as process gas
12/19/2002	US20020189542 Controlling the thickness of an organic layer in an organic light-emiting device
12/19/2002	DE10224954A1 Oberflächenbehandlungsverfahren für einen Kontaktbereich einer Membranfeder und eines Plattenelements, das an dieser gleitet A surface treatment method for a contact portion of a diaphragm spring and a plate member which slides on these
12/18/2002	EP1267384A2 Graphite target
12/18/2002	EP1266980A2 Surface-coated carbide alloy tool
12/18/2002	EP1266979A2 Amorphous carbon coated tool and fabrication method thereof
12/18/2002	EP1266978A2 Lustrous pigment and method of producing the same
12/18/2002	EP1266977A2 Lustrous pigment and method of producing the same
12/18/2002	EP1266958A1 Bio-chip substrate for the embedding of DNA or protein and its fabrication method
12/18/2002	EP1266879A2 Amorphous carbon coated tools and method of producing the same
12/18/2002	EP1266043A2 Cemented carbide tool and method of making
12/18/2002	EP1017643B1 Glass-based copper-mirrors
12/18/2002	EP0914495B1 Target arrangement with a circular disk
12/18/2002	CN1386112A Manufacturing process of Christmas tree decorations and racks for their fixing during this process
12/18/2002	CN1386105A Dual degas/cool loadlock cluster tool
12/18/2002	CN1385554A 真空成膜装置 Vacuum deposition apparatus
12/18/2002	CN1385553A Indium-tin oxide sputtering target
12/18/2002	CN1385552A Carbon nitride ultrahard film plated target material and preparation method thereof
12/18/2002	CN1096438C Mixed oxide high index optical coating material and method
12/18/2002	CN1096310C Method and apparatus for sheet products treatment like circuit board
12/17/2002	US6496336 MR lead structure for controlling arcing across thin dielectric film
12/17/2002	US6495921 High aspect ratio metallization structures
12/17/2002	US6495850 Method for reading a radiation image that has been stored in a photostimulable screen
12/17/2002	US6495842 Implantation of the radioactive 32P atoms
12/17/2002	US6495840 Ion-implanting method and ion-implanting apparatus
12/17/2002	US6495457 Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organic precursor compounds
12/17/2002	US6495436 Formation of metal oxide gate dielectric
12/17/2002	US6495409 MOS transistor having aluminum nitride gate structure and method of manufacturing same
12/17/2002	US6495251 Silicon oxynitride protective coatings
12/17/2002	US6495216 Evaporator can be rotated about the main axis of a bore to allow the evaporation point to be adapted to various vapor coating conditions and substrate shapes without removing connections and connecting lines
12/17/2002	US6495198 Method for fabricating an organic light emitting diode
12/17/2002	US6495070 Flexible high performance microbolometer detector material fabricated via controlled ion beam sputter deposition process
12/17/2002	US6495010 Differentially-pumped material processing system
12/17/2002	US6495008 Method for making polycrystalline thin film and associated oxide superconductor and apparatus therefor
12/17/2002	US6495002 Vacuum arc deposition, includes a vacuum chamber, a cathode comprised of an electrically conductive ceramic material to be deposited on a substrate, an electrically insulating member about the cathode, a heater for preheating the cathode to a
12/17/2002	US6495001 For the production of electrical contact components, by applying a film of tin or tin alloy to a strip of electroconductive base material, and subsequently depositing a silver film
12/17/2002	US6495000 System and method for DC sputtering oxide films with a finned anode
12/17/2002	US6494999 A sputtering target assembly, and an adjustable magnetron assembly. the sputtering target assembly includes heating/cooling passages within the sputtering target assembly. a first side of a heat exchanger/pressure relieving
12/17/2002	US6494997 Radio frequency magnetron sputtering for lighting applications
12/17/2002	US6494670 Three chamber load lock apparatus
12/17/2002	US6494461 Sliding member
12/12/2002	WO2002099841A1 High performance magnetron for dc sputtering systems
12/12/2002	WO2002099837A1 Arc deposition device
12/12/2002	WO2002099168A1 Biaxially textured metal substrate with palladium layer
12/12/2002	WO2002099159A1 Method and device for forming film
12/12/2002	WO2002099158A1 Ring-type sputtering target
12/12/2002	WO2002099157A1 Recessed sputter target
12/12/2002	WO2002099156A1 Sputtering target for forming phase change optical disc protective film and optical recording medium having phase change optical disc protective film formed using that target
12/12/2002	WO2002099155A1 Ion beam sputter deposition process
12/12/2002	WO2002099152A1 Electric arc evaporator
12/12/2002	WO2002098561A1 Conductive catalyst particle and its manufacturing method, gas-diffusing catalyst electrode, and electrochemical device
12/12/2002	WO2002086937B1 Dipole ion source
12/12/2002	WO2002083975A9 Apparatus and method for epitaxial sputter deposition of epilayers and high quality films
12/12/2002	WO2002078041A3 Neutral particle beam processing apparatus
12/12/2002	WO2002057507A3 Method for making a film by pulsed laser ablation
12/12/2002	WO2002047119A3 High temperature superconducting thick films
12/12/2002	WO2001085364A9 Combinatorial synthesis of material chips
12/12/2002	US20020188324 Method and system for improving the effectiveness of medical devices by adhering drugs to the surface thereof
12/12/2002	US20020187644 Vapor deposition using organometallic or organosilicon compound
12/12/2002	US20020187605 Multiple deposition of metal layers for the fabrication of an upper capacitor electrode of a trench capacitor
12/12/2002	US20020187430 Method of forming patterned thin film and method of fabricating micro device
12/12/2002	US20020187405 Ion-beam deposition process for manufacturing attenuated phase shift photomask blanks

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