Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
02/2003
02/27/2003US20030040178 Method and apparatus for micromachining using a magnetic field and plasma etching
02/27/2003US20030039867 Coated cutting tool
02/27/2003US20030039866 Sputtering
02/27/2003US20030039844 Glass coated with heat reflecting colored film and process for its production
02/27/2003US20030039765 Marking method and marking material
02/27/2003US20030039764 Enhanced surface preparation process for application of ceramic coatings
02/27/2003US20030039760 Copper on polymer component having improved adhesion
02/27/2003US20030039042 Multilayer-coated reflective mirrors for X-ray optical systems, and methods for producing same
02/27/2003US20030038370 Process for forming a nitride film
02/27/2003US20030038252 Shielding assembly for a semiconductor manufacturing apparatus and method of using the same
02/27/2003US20030038112 Optical monitoring and control system and method for plasma reactors
02/27/2003US20030038028 Sputter target based on titanium dioxide
02/27/2003US20030038026 Made using a focal vacuum arc vapor deposition device comprising a chamber, a nozzle and a nozzle seal
02/27/2003US20030038025 Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma
02/27/2003US20030038024 Method for producing electrode for lithium secondary battery
02/27/2003US20030038023 Methods and apparatus for depositing magnetic films
02/27/2003US20030037847 High purity tantalum, products containing the same, and methods of making the same
02/27/2003US20030037843 Method for producing indium tin oxide film
02/27/2003US20030037443 Metallized cutlery and tableware
02/26/2003EP1286391A1 Method and apparatus for chucking a substrate
02/26/2003EP1286387A2 Method to reduce photoresist contamination from silicon carbide films
02/26/2003EP1286379A2 Magnetron
02/26/2003EP1286365A2 Moistureproof phosphor screens for use in radiation detectors
02/26/2003EP1285892A2 Cadmium free optical edge-steeped filter
02/26/2003EP1284833A1 Scalpel blade having high sharpness and toughness
02/26/2003EP1284757A1 System comprising a carrier substrate and a ti/p or. ai/p coating
02/26/2003EP1226030A4 Forming members for shaping a reactive metal and methods for their fabrication
02/26/2003EP0966409B1 Photocatalytically-activated self-cleaning article and method of making same
02/26/2003EP0873575B1 Device for producing oxidic thin films
02/26/2003EP0643151B1 Apparatus and system for arc ion plating
02/26/2003CN1399790A Method and apparatus for supercritical processing of multiple workpieces
02/26/2003CN1399502A Plate display and its protecting layer forming process
02/26/2003CN1399332A ZnO/saphire substrate and its making process
02/26/2003CN1399005A Prepn of shape memory alloy film with very small heat stagnation
02/26/2003CN1398807A Glass with plated zinc oxide film
02/25/2003US6524971 Method of deposition of films
02/25/2003US6524908 Method for forming refractory metal-silicon-nitrogen capacitors and structures formed
02/25/2003US6524730 NiFe-containing soft magnetic layer design for multilayer media
02/25/2003US6524688 High transmittance, low emissivity coatings for substrates
02/25/2003US6524687 Bilayer carbon overcoating for magnetic data storage disks and magnetic head/slider constructions
02/25/2003US6524455 Sputtering apparatus using passive arc control system and method
02/25/2003US6524449 Measuring flux distribution of vapor deposition source; lifting-off photoresist material from wafer
02/25/2003US6524448 Vapor deposition using electrical fields (magnets) for angular distribution of ionized particles
02/25/2003US6524431 Apparatus for automatically cleaning mask
02/25/2003US6524381 Methods for producing enhanced interference pigments
02/25/2003US6523493 Ring-shaped high-density plasma source and method
02/20/2003WO2003015124A1 Sputtering magnetron arrangements with adjustable magnetic field strength
02/20/2003WO2003014718A2 Method and apparatus for non-destructive target cleanliness characterization by types of flaws sorted by size and location
02/20/2003WO2003014421A1 Method for producing high purity nickel, high purity nickel, sputtering target comprising the high purity nickel, and thin film formed by using said spattering target
02/20/2003WO2003014411A1 Rapid cycle chamber having a top vent with nitrogen purge
02/20/2003WO2003014410A1 Sputtering device
02/20/2003WO2003014409A1 Sputtering target, transparent conductive film, and their manufacturing method
02/20/2003WO2003014254A1 Electrochromic counter electrode
02/20/2003WO2002047175A3 Zno substrate for solar cells and manufacturing process
02/20/2003WO2001073883A3 Low-temperature fabrication of thin-film energy-storage devices
02/20/2003US20030036483 High temperature superconducting thick films
02/20/2003US20030035970 A1 alloy memeber having excellent corrosion resistance
02/20/2003US20030035906 Transparent conductive stratiform coating of indium tin oxide
02/20/2003US20030035905 Carbon nitride coating for optical media discs
02/20/2003US20030035894 A layer system for cutting tools and machinery parts working with insufficient lubrication or under dry conditions; a hard base, a metallic intermediate layer and a slide layer of carbide, e.g., tungsten- chromium carbide; durability
02/20/2003US20030035705 Chuck transport method and system
02/20/2003US20030034244 Sealing substrate within an enclosure; applying voltage; process control
02/20/2003US20030033983 Apparatus and method for depositing thin films on a glass substrate
02/19/2003EP1284305A2 Copper film vapor phase deposition method and apparatus
02/19/2003EP1284304A2 Apparatus for implanting an ion on a target and method for the same
02/19/2003EP1284303A1 Silicon alloy sputtering target and method for its fabrication.
02/19/2003EP1284302A1 Titanium dioxide based sputtering target
02/19/2003CN2536598Y Vacuum micro-vaporization depositor
02/19/2003CN1397985A Mfg. method of lining processor and semiconductor device
02/19/2003CN1397661A Sputtering target for high resistance transparent conductive membrane and mfg. method of high resistance transparent conductive membrane
02/19/2003CN1397660A Non-magentic shielding type ferromagnetic target as sputter cathode
02/19/2003CN1397654A Process and apparatus for preparing porous metal by combined physical gas-phase deposition techinque
02/19/2003CN1397377A Process for preparing photocatalytic TiO2 film used to clean water and air
02/18/2003US6522997 Simulation method of sputtering
02/18/2003US6522056 Method and apparatus for simultaneously depositing and observing materials on a target
02/18/2003US6521911 High dielectric constant metal silicates formed by controlled metal-surface reactions
02/18/2003US6521541 Surface preparation of substances for continuous convective assembly of fine particles
02/18/2003US6521108 Diffusion bonded sputter target assembly and method of making same
02/18/2003US6521107 Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
02/18/2003US6521106 Collimated deposition apparatus
02/18/2003US6521105 Discharge is stable and film deposition speed and film thickness distribution are uniform even when a plurality of dielectric films are formed consecutively by using an opposing electrode, held at earth potential
02/18/2003US6521104 Configurable vacuum system and method
02/18/2003US6521101 Beryllium-based multilayer mirrors, useful in the wavelength region greater than the beryllium K-edge (111 angstrom or 11.1 nm)
02/18/2003US6521100 Method of producing a piezoelectric thin film and bulk acoustic wave resonator fabricated according to the method
02/18/2003US6521099 Periodically clearing thin film plasma processing system
02/18/2003US6521098 Fabrication method for spin valve sensor with insulating and conducting seed layers
02/18/2003US6521062 Wrought processing of brittle target alloy for sputtering applications
02/18/2003US6521010 Filter, filtering frame, and semiconductor device manufacturing method and apparatus
02/18/2003US6520999 Printing a colored layer (2) on a print base body (3) with a dyeing solvent by using a printer (5) electrically controlled, the dyeing solvent containing a dissolved or fine-grained dispersed sublimatable dye, then, placing the
02/18/2003US6520318 Device for introducing and/or eliminating containers
02/18/2003CA2081227C Multilayer film with metallized surface
02/13/2003WO2003012898A1 Negative pole for secondary cell, secondary cell using the negative pole, and negative pole manufacturing method
02/13/2003WO2003012855A1 Method and apparatus for fabricating mercuric iodide polycrystalline films for digital radiography
02/13/2003WO2003012845A1 Semiconductor fabrication device and semiconductor fabrication method
02/13/2003WO2003012161A1 Metal vapor coating
02/13/2003WO2003012160A1 High frequency ion plating vapor deposition system
02/13/2003WO2002046490A3 Coated substrate having a low emissivity
02/13/2003WO2002039480A3 Ion beam deposition targets having a replaceable insert
02/13/2003WO2002036847A3 Sputtering target
02/13/2003US20030033116 Method for characterizing the performance of an electrostatic chuck