Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
12/2002
12/03/2002US6488384 Light-reflecting layer, preferably an aluminum layer, and another layer placed between the substrate and the light-reflecting layer, the additional layer, which has a high barrier effect to substances which migrate or evolve
12/03/2002US6487910 Method and apparatus for quantitative sputter target cleanliness and characterization
12/03/2002US6487794 Substrate changing-over mechanism in vacuum tank
12/03/2002US6487793 Vacuum processing apparatus and operating method therefor
12/03/2002US6487791 Vacuum processing apparatus
11/2002
11/28/2002WO2002095085A1 Method for producing a layer with a predefined layer thickness profile
11/28/2002WO2002095084A1 Process and apparatus for producing crystalline thin film buffer layers and structures having biaxial texture
11/28/2002WO2002094945A1 Method for the production of plane-parallel platelets by using organic separating agents
11/28/2002WO2002094558A1 Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them
11/28/2002WO2002020864A3 System and method for depositing high dielectric constant materials and compatible conductive materials
11/28/2002WO2002018981A9 Method of forming optical thin film
11/28/2002WO2001045141A9 Method and apparatus for smoothing thin conductive films by gas cluster ion beam
11/28/2002US20020177328 Substrate for semiconductor device and method of manufacturing the same
11/28/2002US20020177244 MFOS memory transistor & method of fabricating same
11/28/2002US20020177001 Plasma processing container internal member and production method thereof
11/28/2002US20020177000 Treating a polyimide film having a biphenyltetracarboxylic acid unit with a solution containing a sodium and/or potassium permanganate and potassium and/or sodium hydroxide and treating surface with acid; peel strength
11/28/2002US20020176984 Silicon penetration device with increased fracture toughness and method of fabrication
11/28/2002US20020176942 Method for coating substrates with improved substrate preheating
11/28/2002US20020176930 To haze the heterojunction and increase the efficiency of the radioactive recombination of the electron and the hole
11/28/2002US20020176856 Administering an antibody to the mammal, that binds with a specified target epitope of an antigen, associated with a tumor or an infectious agent; having engineered glycosylation site in the constant region of the heavy chain antibodies
11/28/2002US20020176753 Cutting tool and tool with holder
11/28/2002US20020175393 Source reagent compositions for CVD formation of gate dielectric thin films using amide precursors and method of using same
11/28/2002US20020175296 Apparatus and method of ion beam processing
11/28/2002US20020175070 Supplying a sputtering gas to the tightly-closed vacuum chamber to obtain a thin film having high optical transparency/transmission. with respect to a light beam in an ultraviolet region of not more than 300 nm; lens; mirrors
11/28/2002US20020175069 Controlling sputtering a first material forming said active material layer onto the collector and then a second material where the plasma regions of each overlap eachother; reproducibility; homogeneous concentration distribution
11/28/2002US20020174917 Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions
11/28/2002US20020174916 Making a target by deforming an aluminum-comprising mass by equal channel angular extrusion; and then shaping the mass; aluminum can contain small (dopant range) amounts of other specified elements
11/28/2002US20020174832 System and method for controlling deposition thickness by synchronously varying a sputtering rate of a target with respect to an angular position of a rotating substrate
11/28/2002DE10124749A1 Kombiniertes Beschichtungs Verfahren magnetfeldunterstützte Hochleistungs-Impuls-Kathodenzerstäubung und Unbalanziertes Magnetron Combined coating method magnetic field-assisted high-power impulse magnetron sputtering and Unbalanced
11/28/2002DE10122545A1 Wärmedämmmaterial mit im wesentlichen magnetoplumbitischer Kristallstruktur Heat-insulating material having substantially the crystal structure magnetoplumbitic
11/28/2002DE10122431A1 Elektrodenanordnung für die magnetfeldgeführte plasmagestützte Abscheidung dünner Schichten im Vakuum Electrode assembly for the magnetic field led plasma-assisted deposition of thin layers in a vacuum
11/28/2002DE10122310A1 Vacuum deposition device used for coating flat substrates comprises a coating module with coating sections lying in the transport direction, and a transport system over which a transport chamber for the substrate is located
11/27/2002EP1261042A1 Method for producing organic thin-film device by use of facing-targets-type sputtering apparatus
11/27/2002EP1260611A2 Cutting tool and tool with holder
11/27/2002EP1260605A1 Vapour deposition system and process
11/27/2002EP1260604A1 Method for preparing film of compound material containing gas forming element
11/27/2002EP1260603A2 Combined coating process using high-rate magnetic field assisted sputtering and unbalanced magnetron
11/27/2002EP1169489B1 Method for increasing the yield in processes of deposition of thin layers onto a substrate
11/27/2002EP1078110B1 Tool or machine component and method for making the same as well as a vacuumtreatmentdevice
11/27/2002EP0931333B1 Process for the manufacture of a highly epsilon-dielectric or ferroelectric coating
11/27/2002CN1381905A Method and device for membrane deposition
11/27/2002CN1381608A Process for preparing high-purity gold foil
11/26/2002US6486514 Wiring line assembly for thin film transistor array substrate and a method for fabricating the same
11/26/2002US6486044 Band gap engineering of amorphous Al-Ga-N alloys
11/26/2002US6485619 Connecting the metal film on a wafer and/or a stage to a ground; and forming a metal oxide film on said wafer using the sputtering process while said metal film is being grounded.
11/26/2002US6485618 Integrated copper fill process
11/26/2002US6485617 Sputtering method utilizing an extended plasma region
11/26/2002US6485616 System and method for coating substrates with improved capacity and uniformity
11/26/2002US6485615 Process of depositing a coating onto a substrate by reactive sputtering
11/26/2002US6485614 Method to stabilize a carbon alignment layer for liquid crystal displays
11/26/2002US6485542 Good corrosion resistance and magnetic properties;
11/26/2002US6485534 Contaminant collector trap for ion implanter
11/26/2002US6484415 Vacuum processing apparatus
11/26/2002US6484414 Vacuum processing apparatus
11/26/2002CA2089149C Shielding for arc suppression in rotating magnetron sputtering systems
11/21/2002WO2002093988A1 Method and system for improving the effectiveness of medical devices by adhering drugs to the surface thereof
11/21/2002WO2002093664A2 Cesium dispensers and process for the use thereof
11/21/2002WO2002093648A2 Semiconductor device interconnect
11/21/2002WO2002092873A2 Relationship to other applications and patents
11/21/2002WO2002092674A1 Laser forward transfer of rheological systems
11/21/2002WO2002092527A1 Heat treatable coated articles with anti-migration barrier layer between dielectric and solar control layers, and methods of making same
11/21/2002WO2002092510A1 Microwave processing of pressed boron powders for use as cathodes in vacuum arc sources
11/21/2002WO2002092337A1 Coated article with polymeric basecoat
11/21/2002WO2002072519A3 Process catalysed by fluoroalkylsulfonated compounds, preferably bis-triflimide compounds
11/21/2002WO2002054443A3 Ion accelaration method and apparatus in an ion implantation system
11/21/2002US20020173250 Superhard material article of manufacture
11/21/2002US20020173068 Sputtering using low discharging voltage and low pressure gases; electron reflecting electrodes
11/21/2002US20020172843 Substrate having a decorative zirconium compound or titanium compound layer; abrasion resistance, scrathing resistance and weathering resistance; for use in vehicle wheel cover
11/21/2002US20020172837 For use in a hot gas duct, especially in industrial gas turbines
11/21/2002US20020172775 Method of making coated articles and coated articles made thereby
11/21/2002US20020172763 For producing packaged beverages
11/21/2002US20020171123 System and method for fabricating silicon targets
11/21/2002US20020171122 System and method for sputtering silicon films using hydrogen gas mixtures
11/21/2002US20020170882 Method and apparatus for supporting substrate
11/21/2002US20020170822 Sputtering system
11/21/2002US20020170821 Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidified alloy powders and elemental Pt metal
11/21/2002US20020170673 System and method of processing composite substrates within a high throughput reactor
11/21/2002US20020170460 Chrome coating composition
11/21/2002US20020170389 Silicon aluminum alloy of prealloyed powder and method of manufacture
11/21/2002DE19933632C2 Verfahren zur Herstellung von Monolagen aus Silizium-Nanoclustern in Siliziumdioxid Process for the preparation of monolayers of silicon nanoclusters in silica
11/21/2002DE10145201C1 Device for coating substrates having a curved surface contains a pair of rectangular magnetron sources and substrate holders arranged in an evacuated chamber
11/21/2002DE10145050C1 Device for coating substrates having a curved surface contains a pair of rectangular magnetron sources and substrate holders arranged in an evacuated chamber
11/21/2002DE10129313C1 Sputtering process used for coating and/or surface treating substrates comprises activating the substrate surface in the regions exposed by an electrode mask by igniting a plasma, and coating the substrate in the exposed regions
11/21/2002DE10122329A1 Wärmetauscher-Vorrichtung mit einer oberflächenbeschichteten Wand, die Medium 1 von Medium 2 trennt Separating heat exchanger apparatus having a surface-coated wall, the medium 1 of medium 2
11/21/2002DE10122070A1 Kathodenzerstäubungskammer zum Aufbringen von Material auf der Oberfläche einer in der Kammer befindlichen Halbleiterscheibe Sputtering chamber for depositing material on the surface of an in-chamber semiconductor wafer
11/21/2002CA2415618A1 Coated article with polymeric basecoat
11/20/2002EP1258026A1 Method for controlling plasma density or the distribution thereof
11/20/2002EP1257683A1 Method for removing adsorbed molecules from a chamber
11/20/2002EP1257682A2 Laser deposition process
11/20/2002EP1257681A1 Diamond-like carbon film with enhanced adhesion
11/20/2002EP1257609A1 Photocatalytic coating and method for cleaning spacecraft surfaces
11/20/2002EP1025277B1 Vacuum coating installation and coupling device and process for producing work pieces
11/20/2002EP0977905A4 Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
11/20/2002EP0925382B1 Wear-resistant edge layer structure on a substrate made of titanium or its alloys which can be subjected to a high mechanical load and has a low coefficient of friction, and method of producing the same
11/20/2002CN2521225Y Sealing device of vacuum chamber
11/20/2002CN1380681A Method for forming crystaline semiconductor film lamination and colour filter
11/20/2002CN1380556A Half-transmitting reflector and half-transmitting polarizer and its liquid crystal display
11/20/2002CN1380441A Method for preparing film by means of cold-cathode sputtering process and its equipment
11/20/2002CN1380440A Tubular target and its producing method
11/20/2002CN1380439A Hall type ion auxiliary evaporation source