Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
09/2010
09/01/2010CN101818038A Method for preparing film adhesive for aluminum honeycomb panel sandwich structure
09/01/2010CN101818037A Room-temperature curing epoxy structural adhesive composition and preparation method thereof
09/01/2010CN101068897B Method for treating and sticking work pieces made of metal or a metal alloy comprising a hydrated oxide and/or hydroxide layer
08/2010
08/31/2010US7786214 Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent
08/31/2010US7785440 Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives
08/26/2010DE102007010876B4 Verfahren zur Herstellung eines Halbleitermoduls A process for producing a semiconductor module
08/25/2010EP2221860A2 Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods
08/25/2010CN101815769A Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
08/25/2010CN101812280A Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method
08/25/2010CN101107315B Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion
08/24/2010US7781522 Aromatic-free polysiloxane containing at least 2 epoxy groups, 1,3-bis((3-m-hydroxyphenyl)propyl)-1,3-dimethyldisiloxane, and a curing accelerator; cured product has high flexibility and improved adhesive characteristics
08/19/2010WO2010092831A1 Hydrogen energy storage system and hydrogen energy storage method
08/19/2010US20100210759 Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads
08/19/2010US20100210758 Coating System
08/18/2010EP2217651A2 Curable compositions containing isocyanate-based tougheners
08/18/2010CN101808466A Manufacturing method of copper-clad plate and glue solution for copper-clad plate
08/18/2010CN101805577A Transparent epoxy resin packaging adhesive
08/18/2010CN101805576A Epoxy-resin single-component soft adhesive
08/18/2010CN101805575A High-performance conductive silver paste and preparation method thereof
08/18/2010CN101805574A Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof
08/17/2010CA2459379C Adhesive for gas barrier laminates and laminated films
08/12/2010WO2010091072A1 Room temperature curing epoxy adhesive
08/12/2010US20100201115 Security laminates with interlaminated transparent embossed polymer hologram
08/11/2010EP1894980B1 Dicing die bonding film
08/11/2010CN101798494A Normal-temperature curing epoxy waterproof adhesive of bridge deck
08/11/2010CN101798493A Epoxy binding agent
08/11/2010CN101798490A Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device
08/11/2010CN101797825A Copper-clad laminate suitable for high-order high density interconnect build-up multilayer and preparation method thereof
08/11/2010CN101465409B Substrate for flexible organic optoelectronic device and preparation method thereof
08/10/2010US7772313 Pumpable heat-processable liquid dispersions for forming fused thermoplastic solids
08/05/2010WO2010087444A1 Adhesive for electronic components
08/05/2010WO2010086932A1 One-pack type cyanate-epoxy composite resin composition
08/05/2010WO2009109442A3 Silica and also epoxy resins
08/05/2010US20100197830 Adhesive for electronic component
08/04/2010EP2213709A1 Epoxy-based antiskid adhesive and preparation thereof
08/04/2010EP1456314B1 Method for connecting two bodies
08/04/2010CN101792641A Environment-friendly adhesive for quickly adhering aluminum alloy and PVC thin film and preparation and application thereof
08/04/2010CN101792576A Epoxy acrylate prepolymer resin, preparation method thereof and application thereof in bicomponent structural adhesive
08/04/2010CN101792520A Low-corrosive epoxy resins and production method thereof
07/2010
07/29/2010WO2010084802A1 Adamantane compound
07/29/2010US20100190013 Detachable adhesive containing reaction product of oxidizing agent and amine compound
07/28/2010EP2211596A1 Circuit-connecting material and circuit terminal connection structure
07/28/2010EP2210927A1 A red and green dry adhesive, a method producing the same
07/28/2010CN101790564A Saturated polyester resin composition and hot melt adhesive composition
07/28/2010CN101790278A Full photophobic copper-clad laminate and preparation method thereof
07/28/2010CN101787251A Bonding agent applicable to copper foil cladding laminated board with full light shading performance
07/21/2010EP2207861A1 Halogen-free flame retardant adhesive compositions and article containing same
07/21/2010EP2121861B1 Low temperature curing of toughened epoxy adhesives
07/21/2010CN101784580A Thermosetting resin composition and cured product thereof
07/21/2010CN101781544A Adhesive composition and application thereof
07/21/2010CN101781542A Binding agent suitable for high-order high-density interconnected laminated plates
07/21/2010CN101781541A Situ preparation method of nano silver/epoxy conductive adhesive
07/21/2010CN101781540A High-performance conducting resin and preparation method thereof
07/15/2010WO2010078690A1 Metal stabilizers for epoxy resins and dispersion process
07/15/2010WO2010078689A1 Metallic compounds in non-brominated flame retardant epoxy resins
07/15/2010WO2010078688A1 Metal stabilizers for epoxy resins
07/15/2010WO2010045100A3 Reinforcement patches with unidirectionally-aligned fibers
07/15/2010US20100178514 Adhesion method, and biochemical chip and optical component made by the same
07/14/2010EP2206002A1 Diffractive optical element and use of an optical adhesive for producing the same
07/14/2010EP2205693A1 Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same
07/14/2010EP2205692A2 Epoxy paste adhesives resistant to wash-off
07/14/2010EP1689816B1 Curable silicone composition and cured product thereof
07/14/2010CN101778901A Two part crash durable epoxy adhesives
07/14/2010CN101775872A Composite ceramic thin plate and preparation method thereof
07/14/2010CN101775196A Preparation method of novel quinone amine curing agent and application to normal temperature epoxy curing system
07/13/2010US7754790 Epoxy acrylate, a resin component having no unsaturated double bond; a bis(methacryloyloxyethyl) hydrogen phosphate; and a radical polymerization initiator; low-temperature curability, high adhesion, high reliability
07/13/2010CA2601950C Latent hardener for epoxy resin and epoxy resin composition
07/08/2010WO2010039614A3 Fast curing oil-uptaking epoxy-based structural adhesives
07/08/2010WO2008143247A8 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate
07/07/2010CN101772532A Toughened adhesive material
07/07/2010CN101770171A Photosensitive composition, sealing structure and manufacturing method of sealing structure
07/07/2010CN101768417A Bonded structural adhesive and preparing method thereof
07/07/2010CN101768328A Bonding film and used resin thereof
07/07/2010CN101768327A Halogen-free bonding film and resin used for same
07/07/2010CN101767558A Compound rear protective plate of truck
07/07/2010CN101767556A Composite automobile bumper
07/07/2010CN101767481A Method for preparing highly heat-conductive copper-clad plate
07/06/2010US7749604 Storage-stable aqueous dispersion of a polyurethane; epoxy resin, which is a reaction product of a compound having an epoxide group and a diol or polyol, to a solvent solution of a polyurethane having hydrophilic groups; dispersing in water; and adding an amine crosslinking agent; paper coatings
07/01/2010WO2010074518A2 Dual-layer adhesive film for semiconductor and die bonding film including the same
07/01/2010WO2010074135A1 Resin composition for adhesive, adhesive comprising same, adhesive sheet, and printed wiring board including same as adhesive layer
07/01/2010WO2010074060A1 Thermosetting die-bonding film
07/01/2010WO2010073885A1 Film adhesive and anisotropic conductive adhesive
07/01/2010WO2010073583A1 Adhesive film, multilayer circuit substrate, component for semiconductor, and semiconductor device
06/2010
06/30/2010CN101765909A Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet
06/30/2010CN101765646A Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device
06/30/2010CN101760162A Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof
06/30/2010CN101760161A Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature
06/30/2010CN101760160A Ethoxyline resin adhesive
06/30/2010CN101760147A Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof
06/29/2010US7745006 Epoxy resin and ethylenediamine hardener; enhanced adhesion to sheet molding compound; catechol synergistic accelerator; rapid reaction with reduced brittleness
06/29/2010CA2571923C Viscous chemical anchoring adhesive
06/24/2010US20100160494 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate
06/24/2010US20100159238 Multi-layer aircraft adhesive
06/23/2010CN1926214B Adhesive sheet for light-emitting diode device and light-emitting diode device
06/23/2010CN101755328A Adhesive for electronic component
06/23/2010CN101755025A Adhesive and bonded body
06/23/2010CN101747855A Low-resistivity single-component conductive silver paste and preparation method thereof
06/23/2010CN101747854A Adhesive combination, covering film and flexible circuit board
06/23/2010CN101747593A Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof
06/22/2010US7740734 An epoxy compound, a cationic catalyst such as diaryliodonium hexafluorophosphate, and as a shrinkage suppressant a dibenzo- or benzonaphtho- oxepinane or oxepinone such as 6,7-Dihydro-5H-dibenz[c,e]oxepin; adhesives, sealants and coatings.
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