| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/17/2010 | CN101675137A Adhesive resin composition and dicing die bonding film using the same |
| 03/11/2010 | WO2010027906A1 Adhesive composition |
| 03/11/2010 | WO2010027017A1 Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal |
| 03/11/2010 | WO2010007150A3 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 03/10/2010 | EP2161739A1 Adhesive film and semiconductor device obtained with the same |
| 03/10/2010 | EP2160435A1 Toughened adhesive material |
| 03/10/2010 | EP1527147B1 Two part epoxide adhesive with improved strength |
| 03/10/2010 | CN101665674A Single-component thread locking epoxy precoated adhesive and preparation method thereof |
| 03/04/2010 | WO2010024295A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 03/04/2010 | WO2010024087A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 03/04/2010 | WO2010023166A1 Method for gluing components, forming a temperature resistant adhesive layer |
| 03/04/2010 | US20100056671 Polyfunctional epoxy oligomers |
| 03/04/2010 | DE102009031351A1 Ausrichtungs- und Befestigungssystem für Zierteile Aligning and mounting system for trim |
| 03/04/2010 | DE102008041657A1 Verfahren zum Verkleben von Bauteilen unter Ausbildung einer temperaturbeständigen Klebstoffschicht A method of adhesive bonding of components to form a temperature-resistant adhesive layer |
| 03/03/2010 | CN101659846A Method for producing adhesive |
| 03/03/2010 | CN101659845A Formulation and manufacturing process for sealant resistant to positive pressure and high temperature |
| 03/03/2010 | CN101659844A Radiation-resistant mica tape adhesive, preparation method thereof and application thereof |
| 02/25/2010 | WO2010021167A1 Insulating sheet and laminated structure |
| 02/25/2010 | US20100048766 Halogen-free phosphorous epoxy resin composition |
| 02/24/2010 | EP2157148A2 Low RF loss static dissipative adhesive |
| 02/24/2010 | EP2157079A1 Alkylated 4-aminobenzyl-4-aminocyclohexane |
| 02/24/2010 | CN101654607A High purity photo-thermal curing adhesive and preparation method thereof |
| 02/24/2010 | CN101654606A Epoxy adhesive and preparation method thereof |
| 02/24/2010 | CN101654605A Modified epoxy resin adhesive and preparation method thereof |
| 02/24/2010 | CN100591740C Epoxy adhesives and bonded substrates |
| 02/23/2010 | CA2469820C Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 02/18/2010 | WO2010019539A2 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 02/18/2010 | WO2010018712A1 Conductive adhesive and led substrate using the same |
| 02/18/2010 | US20100040886 Granulation and stabilization of resin systems for use in the production of fiber composite components |
| 02/17/2010 | EP2154570A1 Photosensitive adhesive resin composition, adhesive film and light-receiving device |
| 02/17/2010 | EP2153985A1 Steel product composite and process for producing the steel product composite |
| 02/17/2010 | CN101649174A Preparation method of high temperature resistant single-component solventless epoxy adhesive |
| 02/16/2010 | US7662482 Bonded automotive vehicle assembly comprising plastic component, adhesive for bonding the plastic component to at least one second component, comprising polyhydroxy compound, hydroxyalkyl methacrylate monomer and anhydrous solvent |
| 02/16/2010 | CA2411709C Method for producing aliphatic oligocarbonate diols |
| 02/11/2010 | WO2010016305A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 02/11/2010 | DE102007063698A1 Optisches Bauelement mit Oberflächenbeschichtung An optical device with surface coating |
| 02/10/2010 | EP2151715A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
| 02/10/2010 | CN100588995C Polarizing disk and producing method thereof |
| 02/09/2010 | US7659064 allows precise diagnosis of congenital diseases or base mutations with much higher sensitivity than is achievable with a DNA chip; analysis of multiple bases, base mutations and single nucleotide polymorphisms (SNPs) |
| 02/03/2010 | EP2149586A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 02/03/2010 | CN101638567A High-temperature curing high-strength solid epoxy adhesive toughened by butyronitrile and preparation method thereof |
| 02/03/2010 | CN100587019C Modified epoxy resin adhesive and its preparation process |
| 02/03/2010 | CN100587002C Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 02/02/2010 | US7655709 Aqueous self-adhesive coating for electrical steel and its uses |
| 01/28/2010 | WO2010011710A2 Two-part epoxy-based structural adhesives |
| 01/28/2010 | WO2010011705A1 Two-part epoxy-based structural adhesives |
| 01/28/2010 | DE102008034105A1 Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff Connecting pipes by means of a sleeve and a thermally expandable adhesive |
| 01/27/2010 | EP1572814B1 Uv-curable epoxy acrylates |
| 01/27/2010 | CN101633827A High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
| 01/27/2010 | CN100585244C Induction type ceramic tap |
| 01/26/2010 | CA2568376C Adhesive system and method of making same |
| 01/21/2010 | WO2010007817A1 Anisotropic conductive adhesive |
| 01/21/2010 | WO2010007150A2 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 01/21/2010 | WO2009131405A3 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
| 01/21/2010 | US20100012271 Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks |
| 01/20/2010 | EP2145924A1 Reaction products based on amphiphilic block copolymers and use thereof as impact modifiers |
| 01/20/2010 | EP2145906A1 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/20/2010 | CN100584180C Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave |
| 01/20/2010 | CN100583418C Adhesives and electric devices |
| 01/20/2010 | CN100582190C Adhesive sheet, semiconductor device, and method for producing the semiconductor device |
| 01/19/2010 | US7648609 Adhesive and its use |
| 01/19/2010 | CA2449590C Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 01/14/2010 | WO2010003708A1 Hybrid-functional polymers |
| 01/14/2010 | US20100006218 Alignment and Affixment System for Trim Parts |
| 01/13/2010 | EP2143745A1 Hybrid-functional polymers |
| 01/13/2010 | EP2143559A1 Magnesium alloy compound material, and its manufacturing method |
| 01/13/2010 | EP2143558A1 Titanium alloy compound material, and its jointing method |
| 01/13/2010 | CN101624507A Glue used for making five-cereal made picture |
| 01/12/2010 | US7646088 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 01/12/2010 | US7645514 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 01/07/2010 | WO2010002008A1 Epoxy resin composition |
| 01/07/2010 | WO2010002007A1 Epoxy resin composition |
| 01/07/2010 | WO2010000096A1 Silver coated flaky material filled conductive curable composition and the application in die attach |
| 01/07/2010 | US20100004356 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/07/2010 | US20100003513 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
| 01/07/2010 | US20100003512 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 01/07/2010 | US20100000679 Method for bonding mea and gdl of fuel cell stack |
| 01/06/2010 | EP2141184A1 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/06/2010 | EP2141014A1 Stainless steel complex and its manufacturing method |
| 01/06/2010 | CN101622324A Low temperature curable conductive adhesive and capacitors formed thereby |
| 01/06/2010 | CN101619201A Underwater epoxy adhesive and preparation method thereof |
| 01/06/2010 | CN100577766C Autocatalysis cross-linking organosilicon-epoxide compound seal glue and method for making same |
| 01/05/2010 | CA2448344C Curable adhesive compositions containing reactive multi-functional acrylate |
| 12/31/2009 | US20090326100 Epoxy resin molding material for sealing and electronic component device |
| 12/31/2009 | US20090321116 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 12/31/2009 | DE10297225B4 Plättchenbefestigungsklebstoffe insbesondere für Halbleiteranwendungen Die attach adhesives, especially for semiconductor applications |
| 12/30/2009 | WO2009157147A1 One-liquid type cyanate epoxy composite resin composition |
| 12/30/2009 | EP2137226A1 Epoxy group-terminated polymers, their compositions and their utilisation as impact resistance modifiers |
| 12/30/2009 | CN101617014A Flame retardant adhesive composition, flexible copper-clad laminates and cover lay films |
| 12/30/2009 | CN101613585A Epoxy copper adhesive and preparation method and application thereof |
| 12/30/2009 | CN100575440C Adhesive epoxy composition and process for applying it |
| 12/24/2009 | DE102008028638A1 Kleb- und Dichtstoff oder Strukturschaum auf Epoxidbasis enthaltend anorganische Nanopartikel mit Acrylsäureester-haltiger Hülle Adhesive and sealant or epoxy-based structural foam containing inorganic nanoparticles with acrylic acid ester-containing envelope |
| 12/23/2009 | WO2009153274A1 Epoxy-based adhesive or sealant comprising inorganic nanoparticles with acrylic acid ester-containing casing |
| 12/23/2009 | WO2009127343A8 Adhesive formulation and process for the treatment of reinforcing inserts |
| 12/23/2009 | EP2136393A1 Adhesive film for semiconductor and semiconductor device made with the same |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | EP2135909A1 Next generation, highly toughened two part structural epoxy adhesive compositions |
| 12/23/2009 | EP2135736A1 Copper alloy composite and process for producing the same |
| 12/23/2009 | CN101608106A Room-temperature curing adhesive for insulator sleeve adhesion |
| 12/23/2009 | CN101608105A Adhesive for packaging smart card module |