| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 06/17/2009 | EP2071000A1 Adhesive tape |
| 06/17/2009 | EP2070961A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 06/17/2009 | CN101457133A Lead accumulator epoxy resin sealant and preparation method thereof |
| 06/17/2009 | CN101457132A High toughness epoxy adhesive |
| 06/16/2009 | US7547373 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 06/16/2009 | CA2326955C Adhesive composition |
| 06/11/2009 | WO2009072742A2 Dicing die bonding film and dicing method |
| 06/10/2009 | EP2067810A1 Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent |
| 06/10/2009 | CN101451054A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN101451053A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN100497513C Rod shaped single parked epoxy adhesive and preparation process |
| 06/09/2009 | US7544739 Curable adhesive compositions containing reactive multi-functional acrylate |
| 06/09/2009 | US7543373 Gel package structural enhancement of compression system board connections |
| 06/04/2009 | WO2009070124A1 A low temperature method of bonding substrates having at least one surface that includes a layer of su8 |
| 06/04/2009 | US20090141472 Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methods |
| 06/04/2009 | US20090140210 Anisotropic Conductive Adhesive |
| 05/28/2009 | US20090133833 Epoxy Resin Composition and Die Bonding Material Comprising the Composition |
| 05/28/2009 | US20090133826 Hot melt adhesives; polymeric reinforcement phase, adsorber phase; PVC-free; homogeneous molten blend; hybrid plastisol/hot melt; adhesive for packaging |
| 05/27/2009 | EP1447843B1 Adhesive-backed tape for TAB and semiconductor device |
| 05/27/2009 | CN101440270A Sealant for reinforcing steel plate |
| 05/27/2009 | CN101440268A Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof |
| 05/27/2009 | CN101440267A Adhesive for shock resistance structure of automobile |
| 05/27/2009 | CN101440266A Novel paster glue for surface mounting technology and preparation thereof |
| 05/27/2009 | CN101439537A Method for manufacturing degradable carrier for cultivating plants |
| 05/27/2009 | CN100491490C Low-viscosity heat-conductive adhesive and process for preparing same |
| 05/27/2009 | CN100491141C Pneumatic radial tire |
| 05/22/2009 | WO2009062422A1 Epoxy-based antiskid adhesive and preparation thereof |
| 05/21/2009 | US20090131608 Adhesive Compositions |
| 05/20/2009 | CN101437914A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 05/20/2009 | CN101437372A Article made of biodegradable resin and method of making the same |
| 05/20/2009 | CN100489048C Binder composition for semiconductor device and binder sheet for semiconductor device |
| 05/19/2009 | CA2417668C An acid pretreatment method to improve adhesion to aluminum alloys |
| 05/14/2009 | WO2009059511A1 A red and green dry adhesive, a method producing the same |
| 05/14/2009 | US20090123759 epoxy resin; epoxy resin miscible block segment contains a polyethylene oxide block, a propylene oxide block, or poly(ethylene oxide-co-propylene oxide) block, and an epoxy resin immiscible block segment contains a polybutylene oxide block, a polyhexylene oxide block; a curing agent; bonding strength |
| 05/14/2009 | US20090120576 Adhesive strip that can be activated by heat and is based on nitrile rubber and polyvinyl butyral for sticking together electronic components and strip conductors |
| 05/13/2009 | CN101432134A Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 05/13/2009 | CN101431145A Substrate for flexible organic opto-electronic device and method for producing the same |
| 05/07/2009 | WO2009058295A2 Epoxy paste adhesives resistant to wash-off |
| 05/07/2009 | WO2009056196A1 Diffractive optical element and use of an optical adhesive for producing the same |
| 05/07/2009 | CA2703907A1 Epoxy paste adhesives resistant to wash-off |
| 05/06/2009 | EP2055757A1 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 05/06/2009 | EP2055756A1 Adhesive tape, joint structure, and semiconductor package |
| 05/06/2009 | EP2054460A2 A halogen-free phosphorous epoxy resin composition |
| 05/06/2009 | EP1871853A4 Functional adhesive, construction material using the same, and method for preparing the adhesive |
| 05/06/2009 | CN101426875A Adhesive tape, semiconductor package, and electronic device |
| 05/06/2009 | CN101423000A Metal blocking foil and preparation method thereof |
| 05/06/2009 | CN100485009C Heat resisting anti-aging adhesive for construction |
| 05/05/2009 | US7528183 water based curing agent is formed by combining an active amine-hydrogen containing amine-functional dispersion with an active amine-hydrogen containing amine-functional curing agent in solution or emulsion form; primer, sealer, paint, filler, coating, covering, trowelling or self leveling composition |
| 04/30/2009 | WO2009053483A1 Adhesive systems using imines and salts thereof, precursors to electron deficient olefins and coreactants therefor |
| 04/30/2009 | WO2008127925A3 Structural epoxy resins containing core-shell rubbers |
| 04/30/2009 | WO2007032855A3 Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers |
| 04/30/2009 | US20090107632 Adhesive compositions for high temperature sensors and methods of making the same |
| 04/30/2009 | DE102007050579A1 Epoxy resin adhesive, useful e.g. to adhere glass with glass foam, comprises epoxy resin system from aliphatic materials, which is obtained by stirring the resin and hardener, aerating the mixture, removing the solvent, and cooling |
| 04/29/2009 | CN101418205A Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| 04/29/2009 | CN101418204A Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate |
| 04/29/2009 | CN101418201A Adhesive composite for flexible circuit board |
| 04/29/2009 | CN100482760C Optical module and used adhesive |
| 04/28/2009 | US7524893 Conductive adhesive |
| 04/28/2009 | US7524563 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 04/28/2009 | US7524394 bromine free bisphenol a or bispheno F type epoxy resins, phenol formaldehyde novolak epoxy resins; curable thermoplastic/synthetic rubber such as polyester, acrylic resins, phenoxy resins, and carboxyl group-containing acrylonitrile butadiene rubber; mealmine or piperzine pyrophosphate as fire retardant |
| 04/23/2009 | WO2009052335A1 Halogen-free flame retardant adhesive compositions and article containing same |
| 04/23/2009 | WO2009051980A1 Nonconductive adhesive composition and film and methods of making |
| 04/23/2009 | WO2008127923A3 Heat-resistant structural epoxy resins |
| 04/23/2009 | DE102008024492A1 Haftfuß mit thermoreversiblem Kleber und Verfahren zum Herstellen und Verwenden desselben The same thermo-reversible adherence foot with adhesive and method of making and using |
| 04/23/2009 | CA2702891A1 Halogen-free flame retardant adhesive compositions and article containing same |
| 04/22/2009 | EP2049611A1 Curable epoxy resin-based adhesive compositions |
| 04/22/2009 | CN101412896A Bicomponent epoxy adhesive and preparation thereof |
| 04/22/2009 | CN100480353C Accumulator sealant |
| 04/16/2009 | WO2009047885A1 Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition |
| 04/16/2009 | WO2009017690A3 Curable epoxy resin-based adhesive compositions |
| 04/16/2009 | DE102008050024A1 Verfahren zum minimieren von Resthaftung für thermoreversible Trockenklebstoffe Method for minimizing the residual adhesion of adhesives for dry thermoreversible |
| 04/15/2009 | EP2048214A1 Pressure-sensitive adhesive composition for pdp front filter and use |
| 04/15/2009 | EP1777278B1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/15/2009 | CN101407708A High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof |
| 04/15/2009 | CN100479105C Adhesive sheet semiconductor device manufacturing method using the adhesive sheet |
| 04/14/2009 | US7517724 Dicing/die bonding sheet |
| 04/09/2009 | WO2009044732A1 Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure |
| 04/08/2009 | EP2045839A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 04/08/2009 | EP2045305A1 Hot-melt adhesive for fixing ic module, and laminated tape and ic card using the adhesive |
| 04/08/2009 | CN101402839A Adhesion agent for aluminum cellular composite board and method of producing the same |
| 04/08/2009 | CN101402838A Silver staining palladium alloy microsphere conductive adhesive and method of producing the same |
| 04/08/2009 | CN101402837A Production formula for binding power of steel wire and rubber |
| 04/08/2009 | CN101402836A Organic active gelatinous material and method for welding non-metal and metallic material with glue |
| 04/08/2009 | CN101402831A Thermal-activated adhesive film and method of producing the same |
| 04/08/2009 | CN100476030C Surface-coating electromagnetic steel sheet for bonding |
| 04/07/2009 | CA2304305C Thermally stable polyetheramines |
| 04/02/2009 | WO2008067198A3 Low temperature curable conductive adhesive and capacitors formed thereby |
| 04/02/2009 | US20090087571 Low shrinkage epoxy-cationic curable composition |
| 04/01/2009 | EP1434827B1 Laminates with structured layers |
| 04/01/2009 | CN101400715A Liquid epoxy resin composition and adhesive using same |
| 04/01/2009 | CN101397486A Bi-component epoxide-resin adhesive and preparation method thereof |
| 04/01/2009 | CN100473707C Low viscosity, fire resistant embedding glue, and method for preparing modified phenol-formaldehyde resin in the glue |
| 04/01/2009 | CN100473704C Adhesive sheet and semiconductor device and process for producing the same |
| 03/26/2009 | WO2009038020A1 Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
| 03/26/2009 | DE102007043559A1 Lichthärtender thermoplastischer Epoxidharzklebstoff Light-curing epoxy adhesive thermoplastic |
| 03/25/2009 | EP2038104A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 03/25/2009 | CN101392159A Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device |
| 03/25/2009 | CN100472741C Manufacturing method for semiconductor device |
| 03/24/2009 | US7507778 Epoxy composition containing two curing agents having different reactivities; exhibits high storage stability and is useful as protective coating or adhesive. |
| 03/24/2009 | US7507461 Edge coating for honeycomb used in panels with composite face sheets |