| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/07/2012 | EP2426787A1 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member |
| 03/07/2012 | CN102369101A Film for resin spacer, light-receiving device and method for manufacturing same, and MEMS device and method for manufacturing same |
| 03/07/2012 | CN102367372A Adhesive for slowly binding prestressed steel strand |
| 03/07/2012 | CN102367371A Adhesive for bond-retarded steel strand |
| 03/07/2012 | CN102367370A Retarding adhesive for steel strand |
| 03/07/2012 | CN101503606B Adhesive for imperial crown cap polyolefin pad for beer or beverage and preparation thereof |
| 03/06/2012 | US8128782 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 03/01/2012 | US20120048606 Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 03/01/2012 | US20120048598 Adhesive resin composition, and laminate and flexible printed wiring board using the same |
| 03/01/2012 | US20120048332 Adhesive film for solar cell electrode and method for manufacturing solar cell module using the same |
| 03/01/2012 | DE102011081551A1 Adhäsivfilm für Solarzellenelektrode und Verfahren zur Herstellung eines Solarzellenmoduls mit deren Verwendung Adhesive film for solar cell electrode and method for manufacturing a solar cell module with their use |
| 02/29/2012 | CN102363723A Preparation method for high-temperature resistant copper foil adhesive |
| 02/29/2012 | CN102363722A Water-soluble insulating cement, cylinder fetal membrane with application of insulating cement and preparation method thereof |
| 02/29/2012 | CN101463245B Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods |
| 02/23/2012 | WO2012022011A1 Stabilized, silver coated filler-containing curable compositions |
| 02/23/2012 | US20120043118 Adhesive resin composition, and laminate and flexible printed wiring board using the same |
| 02/22/2012 | EP2420545A1 Adhesive composition, bonding method, laminate and tire |
| 02/22/2012 | CN102358828A Preparation method of nano adhesive |
| 02/22/2012 | CN102358827A Novel bond |
| 02/22/2012 | CN101522744B 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板 Polyamide-imide resins, adhesives, flexible board materials, flexible laminate and the flexible printed circuit board |
| 02/21/2012 | US8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 02/21/2012 | US8118969 One-step; medium or high crystallinity, medium or high gel polychloroprene resin aqueous dispersion; carboxylated acrylic polymer dispersion; hydrocarbon resins aqueous dispersion, rosins, rosin esters, terpene resins, acrylic resins, hydrogenated rosin; crosslinker; stabilizer; laminated furniture |
| 02/16/2012 | WO2012021258A1 Epoxy structural adhesive |
| 02/16/2012 | WO2012020750A1 Resin composition, coated metal body using same, and adhesive |
| 02/16/2012 | US20120041101 Catalysis of epoxy resin formulations |
| 02/16/2012 | US20120040499 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition |
| 02/15/2012 | CN102352212A High-strength metal adhesive and preparation method thereof |
| 02/15/2012 | CN102352211A Epoxy resin metal adhesive and preparation method thereof |
| 02/15/2012 | CN102352210A High-strength medical structural adhesive and preparation method thereof |
| 02/15/2012 | CN102352209A Threaded locking sealing gum and preparation method thereof |
| 02/14/2012 | US8114519 Derivatized solid epoxy resin and uses thereof |
| 02/09/2012 | WO2012016258A2 Adhesive for fixing and/or embedding an electronic component and metnod and use |
| 02/09/2012 | US20120034458 Lacquer Composition and Use Thereof |
| 02/08/2012 | EP2416633A1 Method for fixing and/or embedding an electronic component and adhesive for use in such a method |
| 02/08/2012 | EP2415592A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same |
| 02/08/2012 | CN102344772A High thermal conducting insulating epoxy resin adhesive and its application in flexible aluminum based copper-clad plate for LED |
| 02/08/2012 | CN102344544A Photocurable resin composition and optical component using the same |
| 02/08/2012 | CN102344543A Photocurable resin composition and optical component using the same |
| 02/08/2012 | CN101624385B 非离子型自乳化水性环氧固化剂及其制备方法和应用 Non-ionic self-emulsifying waterborne epoxy curing agent and its preparation method and application |
| 02/08/2012 | CN101531882B 耐酸耐高温粘结剂及其制备方法 High temperature acid binder and its preparation method |
| 02/08/2012 | CN101475787B 一种各向同性高性能导热胶粘剂及其制备方法 An isotropic thermal adhesive performance and preparation method |
| 02/02/2012 | US20120029117 Adhesive film for semiconductor assembly |
| 02/02/2012 | US20120029116 Curable adhesive compositions, process, and applications |
| 02/02/2012 | US20120027949 Adhesive resin composition and bonding method |
| 02/02/2012 | US20120025400 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device |
| 02/02/2012 | US20120024477 Room temperature curing epoxy adhesive |
| 02/01/2012 | CN102337100A Preparation method of unsaturated polyester resin adhesive |
| 02/01/2012 | CN102337099A Single-component photo-curable and thermal-curable adhesive and preparation method thereof |
| 02/01/2012 | CN102337098A Sealant and preparation method thereof |
| 02/01/2012 | CN102337097A Preparation method of adhesive for powder-filled high-thermal-conductivity mica tape |
| 02/01/2012 | CN102337089A Wafer processing adhesive tape and method for processing semiconductor therewith |
| 02/01/2012 | CN102336635A Epoxy resin and preparation method and application thereof |
| 02/01/2012 | CN101580684B 一种低温快速固化底部填充胶及其制备方法 Low-temperature fast curing underfill and its preparation method |
| 01/31/2012 | US8105460 Handling layer and adhesive parts formed therewith |
| 01/26/2012 | WO2012011265A1 Adhesive agent composition and adhesive film |
| 01/26/2012 | US20120022183 Epoxide (meth) acrylate composition |
| 01/25/2012 | CN102333837A One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| 01/25/2012 | CN102333836A Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
| 01/25/2012 | CN102333835A Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
| 01/25/2012 | CN102333819A Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
| 01/25/2012 | CN102329593A High-strength structural adhesive |
| 01/25/2012 | CN102329592A Metal adhesive with multiple components and preparation method thereof |
| 01/25/2012 | CN102329591A Metal binder and preparation method thereof |
| 01/25/2012 | CN102329590A Adhesive for metal bonding and preparation method thereof |
| 01/25/2012 | CN102329589A Anti-molten metal adhesive and preparation method thereof |
| 01/25/2012 | CN102329588A High-abrasion-resistant metal adhesive and preparation method thereof |
| 01/25/2012 | CN102329587A Solvent-free conductive silver adhesive with stable contact resistance |
| 01/25/2012 | CN102329586A Epoxy structure adhesive for rotor blades and preparation method thereof |
| 01/25/2012 | CN102329585A Leak-blocking adhesive and preparation method thereof |
| 01/25/2012 | CN102329584A Boiling-resistant epoxy adhesive as well as preparation method and application thereof |
| 01/25/2012 | CN101400715B Liquid epoxy resin composition and adhesive using same |
| 01/25/2012 | CN101370887B Adhesive tape |
| 01/24/2012 | CA2450150C Polymeric nanocomposites |
| 01/19/2012 | WO2012009118A2 Curable resin compositions |
| 01/19/2012 | WO2012006776A1 Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof |
| 01/19/2012 | US20120012999 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| 01/19/2012 | CA2804049A1 Curable resin compositions |
| 01/18/2012 | CN1831073B Low stress conductive adhesive |
| 01/18/2012 | CN102321447A High-heat-resistance toughened epoxy resin composition and application thereof in bonding sheet and copper-clad board |
| 01/18/2012 | CN102321233A Preparation method of epoxy resin-based polymer dispersion liquid crystal film material |
| 01/17/2012 | US8097119 Heat-resistant structural epoxy resins |
| 01/12/2012 | WO2012006001A2 Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 01/12/2012 | WO2012005079A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 01/12/2012 | US20120010329 Curable epoxy resin compositions and cured products therefrom |
| 01/11/2012 | EP2160435B1 Toughened adhesive material |
| 01/11/2012 | EP2048214B1 Pressure-sensitive adhesive composition for pdp front filter and use |
| 01/11/2012 | CN102311715A Healant for chemical pipes and preparation method thereof |
| 01/11/2012 | CN102311714A High thermal and electric conducting adhesive filled with nanometer silver and preparation method thereof |
| 01/11/2012 | CN102311713A Nanometer conductive adhesive |
| 01/11/2012 | CN102311613A Black halogen-free flame-retardant epoxy resin composition and adhesive film prepared from same |
| 01/11/2012 | CN101536260B Adhesive film, and connection structure and connecting method for circuit member |
| 01/11/2012 | CN101348700B Adhesion agent, printing film containing the adhesion agent and method of the adhesion agent in direct transfer printing on glass, ceramic and metallic product surface |
| 01/11/2012 | CN101338173B Single-component anaerobic structure glue and method for preparing same |
| 01/10/2012 | US8092906 Adhesive sheet for steel plate |
| 01/10/2012 | CA2551475C Systems for attaching wood products |
| 01/05/2012 | WO2012002437A1 Interlaminar bonding agent and waterproof structure and waterproofing method |
| 01/05/2012 | WO2012002177A1 Aluminum chelate-based latent curing agent |
| 01/05/2012 | WO2012000171A1 Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 01/04/2012 | EP2402395A2 Curable compositions |
| 01/04/2012 | EP2402394A1 Room-temperature curable epoxy structural adhesive composition and preparation method thereof |