| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 06/17/2010 | WO2010067896A1 Method for manufacturing composite polarizing plate |
| 06/16/2010 | CN101743288A Detachable adhesive containing reaction product of oxidizing agent and amine compound |
| 06/16/2010 | CN101735456A High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| 06/16/2010 | CN101732997A Sealing method of spiral rolled membrane module by acetone benzol solvent recovery |
| 06/15/2010 | US7737219 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| 06/10/2010 | WO2010019539A3 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 06/10/2010 | US20100144977 Curing agents for epoxy resins |
| 06/10/2010 | US20100143664 Rust - resistant tape |
| 06/10/2010 | US20100143604 Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 06/09/2010 | CN101728038A Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith |
| 06/09/2010 | CN101724374A UV curing packaging adhesive for liquid crystal display |
| 06/09/2010 | CN101724368A Anti-impact epoxy structural rubber and preparation method thereof |
| 06/09/2010 | CN101724225A Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam |
| 06/09/2010 | CN101722590A Surface treatment method of insert in vacuum casting and APG processes |
| 06/03/2010 | WO2010061980A1 Resin composition |
| 06/03/2010 | US20100133703 Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination |
| 06/02/2010 | EP2192167A1 Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
| 06/02/2010 | CN101717613A High-temperature resistant copper foil glue and preparation and application thereof |
| 06/02/2010 | CN101717610A Hot melt adhesive |
| 06/02/2010 | CN101717609A Anticorrosion glue tape for pipeline and preparation process |
| 06/02/2010 | CN101431145B Substrate for flexible organic opto-electronic device and method for producing the same |
| 05/26/2010 | EP2189278A1 Laminate film |
| 05/26/2010 | CN1715355B Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 05/26/2010 | CN1696231B Reprocessing conductive adhesive composition and its preparation method |
| 05/26/2010 | CN101714513A Adhesive sheet, semiconductor device, and method for producing the semiconductor device |
| 05/26/2010 | CN101712858A Method for preparing bi-component water-proof bond material for bridge deck pavement |
| 05/26/2010 | CN101712857A Epoxy dry-hang glue and preparation method thereof |
| 05/25/2010 | US7722949 Adhesive composition and adhesive film therefrom |
| 05/20/2010 | WO2010055956A1 Colored laminate metal sheet for containers |
| 05/20/2010 | WO2010055877A1 Adhesive composition |
| 05/20/2010 | CA2742948A1 Colored and laminated metal plate for container |
| 05/19/2010 | CN101709208A Building structure adhesive with high impact and peeling strength |
| 05/19/2010 | CN101709207A Mucilage glue suitable for large-gap bonding of respective ceramics and glass products or between same |
| 05/19/2010 | CN101225156B Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof |
| 05/19/2010 | CN101157836B Red-green dry-pasting glue and preparation technique thereof |
| 05/19/2010 | CN101012301B Epoxy acrylic resin and preparing method thereof |
| 05/14/2010 | WO2010053185A1 Resin composition for printed wiring board |
| 05/13/2010 | US20100119836 Stainless steel composite and manufacturing method thereof |
| 05/13/2010 | US20100117037 Made of a copolymer of (meth)acrylate ester monomer and 0.1 to 10 parts of unsaturated alcohol, such as hydroxyethyl methacrylate, crossliinked with a polyisocyanate; the adhesive contains no acidic groups so that oxidation of copper is prevented; superior durability |
| 05/13/2010 | US20100116433 Low-Temperature Impact Resistant Thermosetting Epoxide Resin Compositions With Solid Epoxide Resins |
| 05/12/2010 | CN1977018B Viscous chemical anchoring adhesive |
| 05/12/2010 | CN1927976B Preparation method for laminated tube insulating rubberized fabric |
| 05/12/2010 | CN1871299B Adhesive compositions |
| 05/12/2010 | CN1837317B Semiconductor device, adhesive, and double-sided adhesive film |
| 05/12/2010 | CN101705072A Ultraviolet curing glue for adhering and sealing FPC and plasma screen glass |
| 05/12/2010 | CN101705069A Sealing glue used for expansion joint |
| 05/12/2010 | CN101705058A Bonding method of felt and rubber oil seal |
| 05/12/2010 | CN101098930B Curable composition |
| 05/06/2010 | WO2010011710A3 Two-part epoxy-based structural adhesives |
| 05/06/2010 | US20100108259 Low Temperature Curing Of Toughened Adhesives |
| 05/05/2010 | EP2182585A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 05/05/2010 | CN1950912B Adhesive for connecting circuit |
| 05/05/2010 | CN1590084B Adhesive sheet for steel plate |
| 04/29/2010 | WO2010047386A1 Adhesive composition and optical member |
| 04/28/2010 | CN101699564A Preparation method of fiber metal matrix composite broadband light and slim type radar wave camouflage coating |
| 04/28/2010 | CN101698984A Wiper blade and manufacturing method thereof |
| 04/28/2010 | CN101698787A Epoxy resin binder used for repairing blade and preparation method thereof |
| 04/28/2010 | CN101698772A Preparation method of glass sealant primer |
| 04/22/2010 | WO2010045100A2 Reinforcement patches with unidirectionally-aligned fibers |
| 04/22/2010 | WO2010044232A1 Polarizing plate |
| 04/22/2010 | US20100096082 Adhesive resin composition and bonding method |
| 04/22/2010 | DE112008001404T5 Photohärtbare Haftklebstoffzusammensetzung The photo-curable adhesive composition |
| 04/21/2010 | EP2178094A1 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material |
| 04/21/2010 | CN101696349A Adhesive, preparation method thereof, and epoxy glass fabric prepared from adhesive |
| 04/15/2010 | WO2010041644A1 Polyamideimide resin, adhesive composition using the resin, ink for printed circuit board using the adhesive composition, cover lay film, adhesive sheet and printed circuit board |
| 04/15/2010 | WO2010041299A1 Ultraviolet curable-type removable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using the ultraviolet curable-type removable pressure-sensitive adhesive composition |
| 04/14/2010 | CN1787133B Method for preparing injection forming rare earth permanent magnet material by thermoplastic thermosetting adhesive |
| 04/14/2010 | CN1532256B Adhesive for circuit connection |
| 04/14/2010 | CN101693822A Elastic epoxy glue and bonding compound method thereof |
| 04/14/2010 | CN101693814A Adhesion method for repairing plate-fin heat exchanger and adhesive formula |
| 04/13/2010 | CA2291808C Pressure-sensitive adhesive composition, process for the preparation thereof and pressure-sensitive adhesive sheets |
| 04/08/2010 | WO2010039614A2 Fast curing oil-uptaking epoxy-based structural adhesives |
| 04/08/2010 | WO2010038753A1 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
| 04/08/2010 | WO2010038733A1 Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and laminate for print circuit board adhered by using same |
| 04/08/2010 | WO2010038644A1 Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board |
| 04/08/2010 | US20100084174 Sealing material and mounting method using the sealing material |
| 04/07/2010 | CN101691418A Adhesive epoxy composition and process for applying it |
| 04/01/2010 | WO2010035906A1 Method for manufacturing composite polarizing plate |
| 04/01/2010 | WO2010035459A1 Episulfide compound, episulfide compound-containing mixture, method for producing episulfide compound-containing mixture, curable composition and connection structure |
| 03/31/2010 | CN101689410A Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material |
| 03/31/2010 | CN101688104A Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| 03/31/2010 | CN101684399A Color daub and preparation method thereof |
| 03/25/2010 | WO2010032529A1 Semiconductor device and method for manufacturing the same |
| 03/25/2010 | US20100076119 Adhesive for electronic components |
| 03/24/2010 | CN101681845A Adhesive film and semiconductor device obtained with the same |
| 03/24/2010 | CN101681104A Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing |
| 03/24/2010 | CN101681101A Photosensitive adhesive resin composition, adhesive film and light-receiving device |
| 03/24/2010 | CN101679832A Adhesive composition and adhesive film using the same |
| 03/24/2010 | CN101679829A Photocurable pressure-sensitive adhesive composition |
| 03/24/2010 | CN101679828A heat-resistant structural epoxy resins |
| 03/24/2010 | CN101679819A Adhesive composition for optical member, adhesive layer for optical member, adhesive optical member, transparent conductive laminate, touch panel, and image display device |
| 03/24/2010 | CN101679612A Resin composition for interlayer insulation of multilayer printed wiring board |
| 03/24/2010 | CN101679611A Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 03/24/2010 | CN101678648A Steel product composite and process for producing the steel product composite |
| 03/23/2010 | US7682477 Radiation cross-linkable hot-melt contact adhesives |
| 03/18/2010 | WO2010028951A1 Adhesive with a high resistance |
| 03/18/2010 | US20100065878 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 03/18/2010 | US20100065210 Flowable non-sagging adhesive compositions |
| 03/18/2010 | DE102008046873A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 03/17/2010 | EP2163579A2 Epoxy resin composition |