| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/28/2008 | US20080206520 Surface-modified metal member and method of modifying metal surface |
| 08/28/2008 | DE10297737B4 Neues Schwefel enthaltendes phenolisches Harz, Verfahren zur Herstellung desselben, Phenolderivate mit Disulfidstruktur, Verfahren zur Herstellung desselben und Epoxyharz-Zusammensetzung und Kleber New sulfur-containing phenolic resin, process for producing the same, the same phenol derivatives having disulfide structure, methods of making and epoxy resin composition and adhesive |
| 08/27/2008 | CN101252029A Conductance compound material and preparing process |
| 08/27/2008 | CN101250390A Nano heat conductive transparent embedding glue composite material and preparation method thereof |
| 08/27/2008 | CN101250386A Adhesive for electrode connection and connecting method using it |
| 08/27/2008 | CN100413925C Curable silicone composition and its cured product |
| 08/21/2008 | WO2008099925A1 Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape |
| 08/21/2008 | US20080199717 Fast cure epoxy adhesive with enhanced adhesion to toughened sheet molding compound |
| 08/20/2008 | CN101245231A Adhesive composition, adhesive film, and method for producing semiconductor device |
| 08/20/2008 | CN101245227A Epoxy conductive silver glue for LED and method for manufacturing same |
| 08/20/2008 | CN101244645A Production method for oxazolidinone epoxy glass cloth laminated board |
| 08/20/2008 | CN100412997C Resin size used for chip resistor |
| 08/14/2008 | WO2008096756A1 Aqueous adhesive composition |
| 08/14/2008 | WO2008096661A1 Method for production of adhesive layer |
| 08/14/2008 | WO2008096636A1 Dicing tape and semiconductor device manufacturing method |
| 08/14/2008 | WO2008063611A3 Toughened binder compositions for use in advance processes |
| 08/14/2008 | WO2008063611A2 Toughened binder compositions for use in advance processes |
| 08/14/2008 | US20080193751 Mixture of curable resin and clay particles; photopolymerization; high aspect ratio |
| 08/13/2008 | EP1954759A1 Curable compositions |
| 08/13/2008 | CN101240154A Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| 08/13/2008 | CN101240104A Alkylated polyalkyleneamines and uses thereof |
| 08/13/2008 | CN100411138C Dicing/die boding sheet |
| 08/06/2008 | EP1954114A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 08/06/2008 | EP1951836A1 Anisotropic conductive adhesive compositions |
| 08/06/2008 | EP1951834A1 Concurrently curable hybrid adhesive composition |
| 08/06/2008 | EP1951587A2 Adhesive system and method of making same |
| 08/06/2008 | CN101238191A Electropeeling composition, adhesive using the same, and electropeeling multilayer adhesive |
| 08/06/2008 | CN101238188A Adhesive film and semiconductor device using same |
| 08/06/2008 | CN101235269A Double-component epoxy resin embedding adhesive and its preparation method and can sealing technique |
| 08/06/2008 | CN101235263A Epoxy-polyurea adhesive and preparing method thereof |
| 08/06/2008 | CN100408647C Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 08/05/2008 | US7408259 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet |
| 07/31/2008 | WO2008091386A2 Biomimetic modular adhesive complex: material, methods and applications therefore |
| 07/31/2008 | WO2008089663A1 A method for repairing, reinforcing or enhancing a pipeline by use of basalt fiber composite material |
| 07/30/2008 | EP1948735A1 Flame retardant prepregs and laminates for printed circuit boards |
| 07/30/2008 | CN101232128A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 07/30/2008 | CN101230244A Self-seepage concrete crack repairing glue and method for making same |
| 07/30/2008 | CN101230241A Adhesive for electrode connection and connecting method using it |
| 07/29/2008 | US7405247 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 07/24/2008 | WO2008089410A1 High strength epoxy adhesive and use thereof |
| 07/24/2008 | WO2008087467A1 Low temperature curing of toughened epoxy adhesives |
| 07/24/2008 | WO2008086738A1 Enhancing technique for a pressure mechanism by combining pouring the curable polymer under the help of a clamp with a fiber-reinforced composite material |
| 07/24/2008 | US20080177023 Curable compositions having a reduced enthalpy output |
| 07/23/2008 | CN101225156A Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof |
| 07/23/2008 | CN100404740C Production method of tearing proof tyre fabric |
| 07/23/2008 | CN100404597C Thermally conductive adhesive composition and process for device attachment |
| 07/17/2008 | WO2008084843A1 Adhesive for electronic components |
| 07/17/2008 | WO2008057414B1 Flowable, non-sagging adhesive compositions |
| 07/16/2008 | EP1944346A1 Anisotropic conductive adhesive |
| 07/16/2008 | CN101222188A Rotor or stator with gradient coating friction material |
| 07/16/2008 | CN100402622C Steel cord adhesive for radial tyre and its preparing method |
| 07/16/2008 | CN100402620C Method of preparing high performance conductive glue |
| 07/09/2008 | EP1940992A1 Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 07/09/2008 | EP0872529B2 Binder for building structures |
| 07/09/2008 | CN101215453A Adhesive for middle-temperature solidifying epoxy pre-dipping material and preparation method thereof |
| 07/09/2008 | CN101215452A Nano luminous epoxy adhesive and preparation method thereof |
| 07/09/2008 | CN101215450A Conductive adhesive added with short rod type nano silver powder and preparation method thereof |
| 07/09/2008 | CN100400608C Primer, conductor foil with resin, laminate and process for producing the laminate |
| 07/09/2008 | CN100400592C Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
| 07/08/2008 | CA2426664C Fiber-metal laminate interphase coating |
| 07/03/2008 | US20080161504 Adhesives; sealants |
| 07/03/2008 | US20080161496 Adhesive composition |
| 07/03/2008 | US20080157030 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
| 07/03/2008 | US20080156438 adhered substrates that includes: providing an adhesive composition that is a liquid dispersion when stored at temperatures from about room temperature up to about 140 degrees F., becomes a molten solution when heated to a temperature above about 300 degrees F. and mixed, then becomes a nonexuding cmpd |
| 07/03/2008 | US20080156437 Method for Connecting Flexible Printed Circuit Board to Another Circuit Board |
| 07/02/2008 | CN101210162A Semi-conductor adhesive and preparation method thereof |
| 07/02/2008 | CN101210157A Micron nano material composite modified water-based adhesive |
| 07/02/2008 | CN100398620C Adhesion agent for electrode conection and connection method using same |
| 07/01/2008 | US7393419 Conductive adhesive rework method |
| 06/26/2008 | WO2008077140A2 Hydrolytically resistant thermoset monomers |
| 06/26/2008 | WO2008077075A1 Method for making a fast setting epoxy composition |
| 06/26/2008 | WO2008076686A1 Thermally b-stageable composition for rapid electronic device assembly |
| 06/26/2008 | WO2008075655A1 Lead frame fixing material |
| 06/26/2008 | WO2008075609A1 Adhesive sheet for semiconductor device production and method for producing semiconductor device by using the same |
| 06/26/2008 | US20080152921 Thermally B-Stageable Composition for Rapid Electronic Device Assembly |
| 06/25/2008 | CN101205451A Ultraviolet-anaerobic dual curing adhesive |
| 06/25/2008 | CN101205444A Adhesive film composition, associated dicing die bonding film, and die package |
| 06/25/2008 | CN101204822A Producing method of spruce laminated layer materials |
| 06/25/2008 | CN100396748C Epoxy resin type high strength structure adhesive |
| 06/25/2008 | CN100396747C Acrylic adhesive sheet |
| 06/19/2008 | US20080145667 Epoxy resin and ethylenediamine hardener; enhanced adhesion to sheet molding compound; catechol synergistic accelerator; rapid reaction with reduced brittleness |
| 06/19/2008 | US20080142158 Hydrolytically resistant thermoset monomers |
| 06/19/2008 | DE10297224B4 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zum Verbinden von Substraten und Verwendung eines derartigen Klebstoffs zur Verknüpfung und Verbindung von Substraten einer Halbleitervorrichtung Die attach adhesives for semiconductor applications, and methods of bonding substrates using such an adhesive for bonding substrates and linking of a semiconductor device |
| 06/18/2008 | EP1931508A2 Customizable carbon frames for bicycle or other vehicles |
| 06/18/2008 | EP1704185B1 Reactive thermosetting system with long storage life |
| 06/18/2008 | EP0959498B1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
| 06/18/2008 | CN101200623A Adhesive sheet |
| 06/11/2008 | EP1930359A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 06/11/2008 | EP1928968A1 Uv-curing adhesive, preparation process, adhesively bonded semiconductor component, and method of adhesive bonding |
| 06/11/2008 | CN101198671A Adhesive and adhesive sheet |
| 06/11/2008 | CN101195735A Fireproof glue and method for producing the same |
| 06/11/2008 | CN100393836C Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 06/05/2008 | WO2008067198A2 Low temperature curable conductive adhesive and capacitors formed thereby |
| 06/05/2008 | US20080131639 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same |
| 06/04/2008 | EP1837383B1 Die-attach composition for high power semiconductors |
| 06/04/2008 | CN101193975A Hardenable resin composition |
| 05/29/2008 | DE19809419B4 Adhäsive Zusammensetzung, deren Verwendung und Verfahren zu deren Herstellung Adhesive composition, the use thereof and processes for their preparation |
| 05/29/2008 | CA2670027A1 Toughened binder compositions for use in advanced processes |
| 05/28/2008 | CN101189124A Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure |
| 05/28/2008 | CN101186797A Multifunctional architecture flue produced from PVC residual liquid and waste plastic and preparation method thereof |