Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
09/2011
09/21/2011CN102191002A High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
09/21/2011CN102191001A Epoxy conductive adhesive composition
09/21/2011CN102191000A Adhesive composition
09/21/2011CN102190999A Production method of universal epoxy resin adhesive
09/21/2011CN102190980A Low-temperature conductive adhesive and preparation method thereof
09/21/2011CN101600294B Anisotropic conducting film and circuit board using same
09/21/2011CN101314704B Two-component epoxy resin adhesive for stone skin patching and preparation thereof
09/21/2011CN101230241B Adhesive for electrode connection and connecting method using it
09/21/2011CN101144000B Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
09/15/2011WO2011111784A1 Adhesive reel
09/15/2011WO2011111723A1 Resin composition
09/15/2011WO2011111667A1 Curable composition, hardened material, and method for using curable composition
09/15/2011US20110224329 Metal stabilizers for epoxy resins and dispersion process
09/15/2011US20110221308 Method for gluing components, forming a temperature-resistant adhesive layer
09/15/2011US20110221017 Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
09/14/2011EP2365046A1 Toughened two component structural adhesive being curable at room temperature
09/14/2011EP1951836B1 Anisotropic conductive adhesive compositions
09/14/2011EP1771522B1 Viscous chemical anchoring adhesive
09/14/2011CN102186941A Reinforcement patches with unidirectionally-aligned fibers
09/14/2011CN102181253A Light emitting diode (LED) epoxy encapsulation adhesive
09/14/2011CN102181252A Low-halogen single-component flame-retardant epoxy adhesive
09/14/2011CN102181251A Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof
09/14/2011CN102181250A Carbon black conductive adhesive and preparation method thereof
09/14/2011CN102181238A Heat-cured high-intensity flaky adhesive for automobile and preparation method thereof
09/14/2011CN102181236A Protective layer of epoxy radical and related method and composition thereof
09/14/2011CN102181042A Method for preparing epoxy resin curing agent
09/14/2011CN102181041A Method for preparing performed polymer modified epoxy resin
09/14/2011CN102181040A Medium molecular weight solid bisphenol A epoxy resin
09/13/2011US8017444 Adhesive sheet, semiconductor device, and process for producing semiconductor device
09/09/2011WO2011107450A2 Two-component structural adhesive which is impact resistant at room temperature
09/07/2011CN201961660U 一种防伪金属盖 Anti-counterfeit metal cover
09/07/2011CN102177450A Polarizing plate
09/07/2011CN102177214A Ultraviolet curing removable adhesive composition and adhesive sheet using the same
09/07/2011CN102174306A Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
09/07/2011CN102174300A Adhesive tape and solar cell module using the same
09/07/2011CN102174243A Conductive silver adhesive composition for LED (Light Emitting Diode) die bonding and preparation method
09/07/2011CN102174172A Waterborne rosin-based epoxy resin and preparation method as well as application thereof
09/07/2011CN101717610B Hot melt adhesive
09/06/2011US8012580 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
09/01/2011WO2011103973A1 Heat-curable compositions including a reinforcement additive against shocks
08/2011
08/31/2011CN1836295B Insulation-coated electroconductive particles, its preparation method and anisotropic conductive adhesive
08/31/2011CN102171306A Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive
08/31/2011CN102171303A Fast curing oil-uptaking epoxy-based structural adhesives
08/31/2011CN102171263A Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board
08/31/2011CN102167963A Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device
08/31/2011CN102167962A Photocuring adhesive used for adhering optic glass lenses and preparation method thereof
08/31/2011CN102167799A Preparation method of novel phosphorus-containing biphenyl novolac epoxy resin and condensate of novel phosphorus-containing biphenyl novolac epoxy resin
08/31/2011CN101755328B Adhesive for electronic component
08/31/2011CN101497774B Semiconductor chip liquid encapsulation material
08/31/2011CN101139509B Monocomponent epoxide-resin rubber adhesive and preparation method thereof
08/25/2011US20110204616 Security laminates with interlaminated transparent embossed polymer hologram
08/25/2011CA2732473A1 A method of forming an anchor on an insulated cable
08/24/2011CN102164907A Episulfide compound, episulfide compound-containing mixture, method for producing episulfide compound-containing mixture, curable composition and connection structure
08/24/2011CN102161877A Mouldproof sterilized binder for bathroom accessory
08/24/2011CN102161876A Vibrator electromagnetic coil sealing agent
08/24/2011CN102161875A Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt
08/24/2011CN102161871A Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof
08/24/2011CN102161749A Self-toughening epoxy resin curing agent and preparation method thereof
08/24/2011CN102161745A Method for preparing modified epoxy resin
08/24/2011CN102161373A Process for improving boat bottom wear resistance of glass steel assault boat
08/24/2011CN102161285A Thermal transfer coating film and preparation method thereof
08/24/2011CN101699564B Preparation method of fiber metal matrix composite broadband light and slim type radar wave camouflage coating
08/24/2011CN101555393B High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof
08/23/2011US8003207 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
08/23/2011CA2609170C Waterborne adhesive for elastomers
08/18/2011WO2011099501A1 Curable composition, cured article, and use of curable composition
08/18/2011DE102006007429B4 Verfahren zum autoklavfreien Verkleben von Bauteilen für Luftfahrzeuge A method for autoclave-bonding components for aircraft
08/17/2011EP2357876A1 Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal
08/17/2011CN102160163A Semiconductor device and method for manufacturing same
08/17/2011CN102159642A Two-part epoxy-based structural adhesives
08/17/2011CN102159615A Two-part epoxy-based structural adhesives
08/17/2011CN102157422A Winding core and wafer-processing belt wound on same
08/17/2011CN102153980A Daub used for making glass steel pipeline threads and preparation method thereof
08/17/2011CN102153979A Intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding
08/17/2011CN102153978A Room-temperature solidification heat-resistant epoxy adhesive
08/17/2011CN102153977A Anti-seepage leak-stopping epoxy adhesive and preparation method thereof
08/17/2011CN102153976A Preparation method of graphene/nano silver epoxy conductive adhesive
08/17/2011CN102153975A Adhesive, preparation method thereof, mica tape containing same and laminated board containing same
08/17/2011CN102153957A Adhesive film, and connection structure and connecting method for circuit member
08/17/2011CN102153956A Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film
08/17/2011CN102153731A Room temperature curing heat-resistant epoxy curing agent
08/17/2011CN102153730A Method for preparing high-strength epoxy resin adhesive
08/17/2011CN102152685A Method for further curing adhesive layer of transfer printing film subjected to transfer printing
08/17/2011CN101641773B Adhesive film for semiconductor and semiconductor device made with the same
08/16/2011CA2534635C Command-cure adhesives
08/11/2011WO2011073422A3 Crimping fold bond
08/11/2011US20110195249 Adhesive composition and optical member
08/10/2011CN102146266A Dry-hang adhesive, rapid curing agent for dry-hang adhesive and preparation process of rapid curing agent
08/10/2011CN101747593B Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof
08/04/2011WO2011091585A1 A multilayer structure, and a method for making the same
08/04/2011WO2011091584A1 A multilayer structure, and a method for making the same
08/04/2011US20110187029 Aliphatic-aromatic polyester
08/04/2011US20110187009 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
08/04/2011US20110187006 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
08/04/2011US20110186217 Method for installing a floor covering and agent for treating an underlying surface, which can be applied in such method
08/04/2011CA2788099A1 A multilayer structure, and a method for making the same
08/04/2011CA2788002A1 A multilayer structure, and a method for making the same
08/03/2011CN102144432A Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal
08/03/2011CN102140328A Binder capable of resisting strong acid, alkali and salt
08/03/2011CN102140324A Elastic adhesive for optical fiber gyro and preparation method of elastic adhesive
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