| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 02/27/2008 | EP1892005A1 Adhesive for syringe needle, method of adhering syringe needle, front assembly for syringe and syringe |
| 02/27/2008 | CN101130679A Adhesion agent and method of manufacturing the same |
| 02/21/2008 | US20080045670 Epoxy Adhesive Composition |
| 02/20/2008 | EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 02/20/2008 | EP1174175B1 Potting agent for a hollow fiber membrane module, hollow fiber membrane module and uses of said hollow fiber membrane module |
| 02/20/2008 | EP1149130B1 Acrylic terpolymer for the use as a self-fixturing adhesive |
| 02/20/2008 | CN101128502A Latent hardener for epoxy resin and epoxy resin composition |
| 02/20/2008 | CN101126003A Moisture-heat-proof epoxy adhesive |
| 02/20/2008 | CN100370581C Sheet material for forming chip protection film |
| 02/20/2008 | CN100370002C Hybrid adhesives, articles, and methods |
| 02/14/2008 | WO2007018120A9 Adhesive film and semiconductor device using same |
| 02/14/2008 | US20080039594 epoxidized butadiene, isoprene homopolymers, copolymers; tackifying resin; photoinitiator; for labelling packages |
| 02/14/2008 | DE102006037010A1 Manufacturing adsorbent structure for adsorption air-conditioner, by pouring out/impregnating heat conducting support structure with synthetic resin, hardening the synthetic resin, and in situ thermochemically treating the support structure |
| 02/13/2008 | EP1886800A1 Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure |
| 02/13/2008 | CN101121868A Modified epoxy resin adhesive and preparation method thereof |
| 02/13/2008 | CN101121867A Method for manufacturing automobile synchronizer bevel gear ring conical surface adhesive epoxy resin carbon fiber |
| 02/07/2008 | WO2008016889A1 Curable epoxy resin-based adhesive compositions |
| 02/07/2008 | US20080029216 Applying a two phase mixture of an acrylic acid-functional terpolymer and an epoxy-functional copolymer, adding moisture; use as protective coatings and adhesion for production of laminates, antigraffiti coatings, construction, automotive industries; overcome disadvantages of pressure-sensitive adhesives |
| 02/07/2008 | US20080029200 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/06/2008 | EP1884533A2 Bonding process |
| 02/06/2008 | CN101120627A Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave |
| 02/06/2008 | CN101120043A Surfacing and/or joining method |
| 02/06/2008 | CN101117557A Autocatalysis cross-linking organosilicon-epoxide compound seal glue and method for making same |
| 02/06/2008 | CN101117552A Binding composition for cover film |
| 02/06/2008 | CN100366697C Foamable underfill encapsulant |
| 02/05/2008 | US7327039 Curable thermosetting adhesive |
| 02/05/2008 | US7326316 anisotropic electroconductive connections using epoxy resins comprising particles having breakable dielectric coatings; semiconductor dies, chips or packages |
| 01/31/2008 | WO2008013172A1 Hot-melt adhesive for fixing ic module, and laminated tape and ic card using the adhesive |
| 01/31/2008 | CA2652744A1 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 01/24/2008 | WO2008010555A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 01/24/2008 | WO2008010367A1 Pressure-sensitive adhesive composition for pdp front filter and use |
| 01/24/2008 | WO2007120078A3 Polymer anisotropic electroconductive gluing material and a gluing method |
| 01/24/2008 | US20080021163 Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board |
| 01/24/2008 | US20080017223 Conductive adhesive rework method |
| 01/23/2008 | CN101108956A Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board |
| 01/23/2008 | CN100364129C 1-3 structure huge magnetoelectric material and preparing process thereof |
| 01/23/2008 | CN100363678C Method for reinforcing defective pipeline and composite material therefor |
| 01/23/2008 | CN100363399C Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method |
| 01/17/2008 | WO2008006835A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 01/17/2008 | CA2654017A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 01/16/2008 | CN101107315A Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion |
| 01/16/2008 | CN101104785A Epoxy glue solution for repairing pipeline |
| 01/16/2008 | CN101104784A Composite laminated board high temperature resistant adhesive and preparation method thereof |
| 01/16/2008 | CN101104769A Ultraviolet light solidifying composition and preparation method thereof |
| 01/16/2008 | CN100362072C Adhesive for resin roll assembly and resin roll |
| 01/10/2008 | WO2008004399A1 Bonding resin composition for fluororesin substrates and metal-clad laminates made by using the composition |
| 01/10/2008 | WO2008004376A1 Rubber-type curable hotmelt adhesive |
| 01/10/2008 | US20080006370 Process for applying a streamable epoxy adhesive |
| 01/09/2008 | EP1876382A1 Attachment primer for cryogenic support and its use |
| 01/09/2008 | EP1507837B1 Segmented curable transfer tapes |
| 01/09/2008 | EP1419527B1 Adhesive tape |
| 01/09/2008 | CN101103448A Manufacturing method for semiconductor device |
| 01/09/2008 | CN100360626C Linerless printable adhesive tape |
| 01/08/2008 | US7317055 comprising a modified polyolefin prepared by graft polymerizing at least one epoxy group-containing ethylenically unsaturated monomer to a polyolefin obtained by polymerizing one or more olefins selected from ethylene and alpha -olefin having from 3 to 20 carbon atoms |
| 01/03/2008 | WO2008001695A1 Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |
| 01/03/2008 | WO2007085291A3 Use of polysulfide-containing two-component adhesives for the production of windows |
| 01/03/2008 | US20080003369 Low Shrinking Amine-Curing Epoxy Compositions |
| 01/02/2008 | EP1871853A1 Functional adhesive, construction material using the same, and method for preparing the adhesive |
| 01/02/2008 | CN101098930A Curable composition |
| 01/02/2008 | CN101097934A Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same |
| 01/02/2008 | CN101096412A Curing agent for epoxy resin and low-temperature using epoxy adhesive |
| 01/02/2008 | CN100358964C Polyaniline corrosion proof sealant |
| 12/27/2007 | US20070295446 Bonding method with flowable adhesive composition |
| 12/26/2007 | EP1868737A1 Surface covering which is hardened in several stages |
| 12/26/2007 | CN101095215A Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 12/26/2007 | CN100357382C Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 12/25/2007 | US7312534 Interlayer dielectric and pre-applied die attach adhesive materials |
| 12/25/2007 | US7312261 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 12/19/2007 | EP1867693A1 Hybrid Adhesive |
| 12/19/2007 | EP1867676A1 Expandable sealing composition for structurally reinforcing metallic hollow parts |
| 12/19/2007 | CN101089110A Main component of adhesive for insulating film |
| 12/19/2007 | CN100355851C 环氧树脂灌封胶 Epoxy Potting |
| 12/13/2007 | US20070284041 Optical Adhesive Composition And Method For Bonding Optical Component |
| 12/13/2007 | US20070283550 Universal joint with adhesive bearing cup retention system |
| 12/06/2007 | WO2007139138A1 Polarizing plate and method for producing the same |
| 12/06/2007 | WO2007138870A1 Liquid crystal sealing agent and liquid crystal display cell using the same |
| 12/06/2007 | US20070278683 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials |
| 12/05/2007 | CN100352880C Adhesive tape composition for electronic components |
| 11/28/2007 | CN101077964A Method for preparing polyether polylol |
| 11/28/2007 | CN100351337C Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 11/28/2007 | CN100351335C Uv-cure adhesive composition for optical disk, cured material and goods |
| 11/22/2007 | WO2007100734A3 A halogen-free phosphorous epoxy resin composition |
| 11/22/2007 | US20070270536 Conductive adhesive composition |
| 11/22/2007 | US20070269659 Electrically disbondable compositions and related methods |
| 11/21/2007 | EP1858069A1 Semiconductor device manufacturing method |
| 11/21/2007 | CN100349948C Method of preparation of a water based epoxy curing agent |
| 11/21/2007 | CN100349947C Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 11/15/2007 | WO2007129711A1 Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 11/15/2007 | US20070264506 Epoxy Resin Compositions Containing Mannich Bases, Suitable for High-Temperature Applications |
| 11/15/2007 | US20070261791 Method for low-cost, practical fabrication of two-dimensional fiber optic bundles |
| 11/14/2007 | CN101072678A Laminate film |
| 11/08/2007 | WO2007125922A1 Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 11/08/2007 | WO2007125650A1 Adhesive tape, semiconductor package, and electronic device |
| 11/07/2007 | EP1852906A2 Sheet to form a protective film for chips and process for producing semiconductor chips |
| 11/07/2007 | EP1852452A1 Latent hardener for epoxy resin and epoxy resin composition |
| 11/07/2007 | CN101068897A Method for treating and sticking work pieces made of metal or a metal alloy comprising a hydrated oxide and/or hydroxide layer |
| 10/31/2007 | EP1850351A1 Adhesive for circuit connection |
| 10/31/2007 | EP1412445B1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/31/2007 | EP1384255B1 Method for grinding the back sides of wafers |
| 10/31/2007 | CN100345928C Adhesive, rubber reinforced cord yarn, driving belt and method for producing driving belt |